A colored sapphire material and methods for coloring sapphire material using lasers are disclosed. The method for coloring the sapphire material may include positioning the sapphire material over an opaque substrate material, exposing the opaque substrate material to a laser beam passing through the sapphire material to impact the substrate material, and inducing a chemical change in a portion of the sapphire material exposed to the laser beam. The method may also include creating a visible color in the portion of the sapphire material as a result of the chemical change. The colored sapphire material may include a first transparent portion, and a second, colored portion substantially surrounded by the first portion. The second, colored portion may have a chemical composition different than that of the first portion.

A colored sapphire material and methods for coloring sapphire material using lasers are disclosed. The method for coloring the sapphire material may include positioning the sapphire material over an opaque substrate material, exposing the opaque substrate material to a laser beam passing through the sapphire material to impact the substrate material, and inducing a chemical change in a portion of the sapphire material exposed to the laser beam. The method may also include creating a visible color in the portion of the sapphire material as a result of the chemical change. The colored sapphire material may include a first transparent portion, and a second, colored portion substantially surrounded by the first portion. The second, colored portion may have a chemical composition different than that of the first portion.

A system for cutting a substrate that is transparent within a predetermined range of wavelengths in the electromagnetic spectrum is provided that includes: a laser capable of emitting light along a light path and of a predetermined wavelength that is within the range of wavelengths in which the substrate is transparent; an optical element positioned in the light path of the laser such that the laser in conjunction with the optical element is capable of generating induced nonlinear absorption within at least a portion of the substrate; and an interface block composed of a material that is transparent over at least a portion of the predetermined range of wavelengths in the electromagnetic spectrum in which the substrate is also transparent. The interface block is positioned in the light path and between the substrate and the optical element. Further, the substrate will include an edge when extracted from a sheet.

Providing a solid body to be split into a number of layers of solid material, introducing or generating defects in the solid body in order to determine a first detachment plane (8) along which a first layer of solid material is separated from the solid body, providing a receiving layer for holding the layer of solid material on the solid body, applying heat to the receiving layer in order to generate, in particular mechanically, stresses in the solid body, due to the stresses a crack propagating in the solid body along the detachment plane, which crack separates the first layer of solid material from the solid body, then providing a second receiving layer for holding another layer of solid material on the solid body reduced by the first layer of solid material, introducing or generating defects in the solid body in order to determine a second detachment plane (9) along which a second layer of solid material is separated from the solid body, applying heat to the second receiving layer in order to generate, in particular mechanically, stresses in the solid body, due to the stresses a crack propagating in the solid body along the second detachment plane, which crack separates the second layer of solid material from the solid body.

Providing a solid body to be split into a number of layers of solid material, introducing or generating defects in the solid body in order to determine a first detachment plane (8) along which a first layer of solid material is separated from the solid body, providing a receiving layer for holding the layer of solid material on the solid body, applying heat to the receiving layer in order to generate, in particular mechanically, stresses in the solid body, due to the stresses a crack propagating in the solid body along the detachment plane, which crack separates the first layer of solid material from the solid body, then providing a second receiving layer for holding another layer of solid material on the solid body reduced by the first layer of solid material, introducing or generating defects in the solid body in order to determine a second detachment plane (9) along which a second layer of solid material is separated from the solid body, applying heat to the second receiving layer in order to generate, in particular mechanically, stresses in the solid body, due to the stresses a crack propagating in the solid body along the second detachment plane, which crack separates the second layer of solid material from the solid body.

The invention relates to a method (100) for cutting cut parts (1, 2, 3, 4, 5, 6; 12, 13, 14, 15, 16, 17, 18), wherein the cut parts (1, 2, 3, 4, 5, 6; 12, 13, 14, 15, 16, 17, 18) produce a cutting pattern (7), said method having the following method step: cutting (106) the cut parts (1, 2, 3, 4, 5, 6; 12, 13, 14, 15, 16, 17, 18), wherein the cut parts (1, 2, 3, 4, 5, 6; 12, 13, 14, 15, 16, 17, 18) are arranged in a rectangular, repeating portion (9, 9) of an endless single ply material web (19), wherein the portion (9) at least one cut part (1, 2, 3, 4, 5, 6; 12, 13, 14, 15, 16, 17, 18) or at least one cutting pattern (7) is contained in part (10, 11). The method additionally comprises a computer program product and a device for cutting by means of a cutting tool.

The invention relates to a method (100) for cutting cut parts (1, 2, 3, 4, 5, 6; 12, 13, 14, 15, 16, 17, 18), wherein the cut parts (1, 2, 3, 4, 5, 6; 12, 13, 14, 15, 16, 17, 18) produce a cutting pattern (7), said method having the following method step: cutting (106) the cut parts (1, 2, 3, 4, 5, 6; 12, 13, 14, 15, 16, 17, 18), wherein the cut parts (1, 2, 3, 4, 5, 6; 12, 13, 14, 15, 16, 17, 18) are arranged in a rectangular, repeating portion (9, 9) of an endless single ply material web (19), wherein the portion (9) at least one cut part (1, 2, 3, 4, 5, 6; 12, 13, 14, 15, 16, 17, 18) or at least one cutting pattern (7) is contained in part (10, 11). The method additionally comprises a computer program product and a device for cutting by means of a cutting tool.

A reflectance detection method in which a workpiece is irradiated with a laser beam and reflectance is detected, irradiating, with a light amount H0, the workpiece with a laser beam with a first wavelength X1 shorter than a detection-target wavelength X and detecting a light amount H1 of reflected return light, irradiating the workpiece with a laser beam with a second wavelength X2 longer than the detection-target wavelength X with the light amount H0 and detecting a light amount H2 of reflected return light, and employing H calculated based on an expression shown below as the light amount of return light obtained when the workpiece is irradiated with the detection-target wavelength X and calculating reflectance obtained when the workpiece is irradiated with the detection-target wavelength X based on H/H0.
H=H1+(H2H1)(XX1)/(X2X1)

A reflectance detection method in which a workpiece is irradiated with a laser beam and reflectance is detected, irradiating, with a light amount H0, the workpiece with a laser beam with a first wavelength X1 shorter than a detection-target wavelength X and detecting a light amount H1 of reflected return light, irradiating the workpiece with a laser beam with a second wavelength X2 longer than the detection-target wavelength X with the light amount H0 and detecting a light amount H2 of reflected return light, and employing H calculated based on an expression shown below as the light amount of return light obtained when the workpiece is irradiated with the detection-target wavelength X and calculating reflectance obtained when the workpiece is irradiated with the detection-target wavelength X based on H/H0.
H=H1+(H2H1)(XX1)/(X2X1)

To provide a method for manufacturing an outer panel in which takt time is shortened and of high designability. A method for manufacturing an outer panel performing a hemming process according to the present disclosure includes; performing a laser light irradiation process on an inner side of a steel sheet that serves as an outer panel to bend the steel sheet at a first angle, the laser light being irradiated along a ridgeline of a center part of a bend radius of the steel sheet, and performing the hemming process on the steel sheet at a timing that is after the laser irradiation process to bend the steel sheet at a second angle smaller than the first angle.