A production method for welding a copper conductor to an electrical contact element of a workpiece for electrical contacting. The contact element has a first copper alloy, and the method has the following method steps: mechanical contacting between the copper conductor and the contact element at a join of the contact element, the welding of the copper conductor to the contact element being carried out with the aid of a focused laser beam, the laser beam having a wavelength of less than or equal to 0.6 μm, and a welded seam is produced which has a welding depth that is greater than or equal to 100 μm.

A production method for welding a copper conductor to an electrical contact element of a workpiece for electrical contacting. The contact element has a first copper alloy, and the method has the following method steps: mechanical contacting between the copper conductor and the contact element at a join of the contact element, the welding of the copper conductor to the contact element being carried out with the aid of a focused laser beam, the laser beam having a wavelength of less than or equal to 0.6 μm, and a welded seam is produced which has a welding depth that is greater than or equal to 100 μm.

An integrated device package is disclosed. The integrated device package can include a substrate that has a first side and a second side, an electronic component that is mounted on the first side or the second side of the substrate, a molding material that is disposed at least on the first side of the substrate, and an conductive material that is disposed on the first side of the substrate and extending through the molding material. The molding material has an exterior surface facing away from the substrate. The exterior surface of the molding material includes laser grooves indicative of laser lapping.

An integrated device package is disclosed. The integrated device package can include a substrate that has a first side and a second side, an electronic component that is mounted on the first side or the second side of the substrate, a molding material that is disposed at least on the first side of the substrate, and an conductive material that is disposed on the first side of the substrate and extending through the molding material. The molding material has an exterior surface facing away from the substrate. The exterior surface of the molding material includes laser grooves indicative of laser lapping.

The present invention relates to a method of joining glass elements with material continuity, to a glass component, to a housing, and to a vacuum insulating panel. The method comprises the following steps providing first and second glass elements, with each of the glass elements having at least one joining region having an outer edge to be joined, introducing a metallic material into the first glass element in the region of the joining region of the first glass element, placing the first and second glass elements onto one another such that the first and second glass elements contact one another at least at one outer edge of the respective joining region; and heating the metallic material in the first glass element so that the glass element at least partially melts in the region of the joining region of the first glass element so that a connection with material continuity is produced between the first and second glass elements.

The concepts described herein provide a method, system, and apparatus for joining, via welding, first and second members fabricated from an aluminum alloy including aluminum, zinc, and manganese, such as 7000-series aluminum alloys, and a resultant workpiece. A junction is formed by a first member being disposed contiguously to a second member. A welding machine generates a weld pool at the junction that includes liquified aluminum alloy. An ultrasonic transducer directs ultrasonic energy in proximity to the weld pool. In some embodiments, an electro-magnetic transducer directs electro-magnetic energy in proximity to the weld pool. The first member is fused to the second member at the junction upon solidification of the weld pool.

A method of producing a glass substrate having a hole is provided. The method includes preparing the glass substrate having a first surface and a second surface facing each other; forming a hole in the glass substrate with a laser; and annealing the glass substrate placed on a first support substrate having a thermal expansion coefficient whose difference from a thermal expansion coefficient of the glass substrate is less than or equal to 1 ppm/K, where the first support substrate is placed on a second support substrate having a thermal expansion coefficient of less than or equal to 10 ppm/K.

Disclosed is a processing method for a workpiece. The processing method includes a holding step of holding the workpiece on a holding table, a grinding step of grinding the workpiece that is held on the holding table at and around its center by a grinding wheel, so that a recess portion is formed at and around the center of the workpiece and an annular projection portion is formed surrounding the recess portion at and along an outer periphery of the workpiece, and a fusion step of applying a laser beam to a surface of the workpiece, the surface having been ground in the grinding step, so that the ground surface is fused. A processing apparatus for a workpiece is also disclosed.

A battery module and a method of manufacturing the same includes: a battery cell stack including a plurality of battery cells, a bus bar frame connected to the battery cell stack, at least one electrode lead connected to the battery cell stack and containing a first metal; and a bus bar overlapping with the at least one electrode lead and containing a second metal, the at least one electrode lead and the bus bar are welded to form a welded portion, the welded portion includes a first region in which a central portion is located in the at least one electrode lead and a second region in which the central portion is located in the bus bar, and precipitates of the first metal and the second metal are distributed in both the first region and the second region.

A variable gage blank is formed from a set of components joined by a joining process. The set of components include a web, a first flange, and a second flange. The components have respective thicknesses. The first flange and the second flange may be modified to include a transition region with a variable thickness that terminates on an edge having a thickness substantially similar to a thickness of the web.