Welding of transparent material in electronic devices. An electronic device may include an enclosure having at least one aperture formed through a portion of the enclosure. The electronic device may also include a component positioned within the aperture formed through the portion of the enclosure. The component may be laser welded to the aperture formed through the enclosure. Additionally, the component may include transparent material. A method for securing a component within an electronic device may include providing an electronic device enclosure including at least one aperture, and positioning a component within the aperture formed through the enclosure. The component positioned within the aperture may include a transparent material. The method may also include welding the component to the electronic device enclosure.

A laser processing device has a preprocessing controller which issues a command to perform preprocessing of a workpiece under high output conditions, which are previously found by an experiment or calculation in accordance with at least some of processing conditions and which include the irradiation intensity and irradiation time, at which a workpiece is melted, changed in shape, or denatured; a command to irradiate the workpiece with a laser beam under low output conditions, which are previously found by an experiment or calculation in accordance with at least some of the processing conditions and which include the irradiation intensity and irradiation time, at which a workpiece is not melted, changed in shape, or denatured; and a command of whether to start the laser processing, based on a first light quantity of light reflected or emitted from a processing point irradiated with a laser beam under the low output conditions.

A laser processing device has a preprocessing controller which issues a command to perform preprocessing of a workpiece under high output conditions, which are previously found by an experiment or calculation in accordance with at least some of processing conditions and which include the irradiation intensity and irradiation time, at which a workpiece is melted, changed in shape, or denatured; a command to irradiate the workpiece with a laser beam under low output conditions, which are previously found by an experiment or calculation in accordance with at least some of the processing conditions and which include the irradiation intensity and irradiation time, at which a workpiece is not melted, changed in shape, or denatured; and a command of whether to start the laser processing, based on a first light quantity of light reflected or emitted from a processing point irradiated with a laser beam under the low output conditions.

A laser processing device having a function for reducing intensity of a reflected laser beam, without stopping laser oscillation, in order to avoid a malfunction due to the reflected beam. A controller for controlling a laser oscillator has: a laser processing commanding part configured to output a laser processing command; a memory configured to store monitored intensity of the reflected beam and a laser output condition; a pre-processing commanding part configured to command a pre-processing prior to the laser processing command; a comparing part configured to compare the stored intensity of the reflected beam to a first judgment value and/or a second judgment value lower than the first judgment value; an output condition changing part configured to set or change the laser output command of the pre-processing command based on a comparison result; and a pre-processing terminating part configured to terminate the pre-processing based on a predetermined condition.

A method of preparing aluminum metal pieces for welding, along with welded sheet metal assemblies formed from the prepared aluminum metal pieces. In one embodiment, a scanning beam of a laser is directed at an edge portion of the sheet metal piece such that a portion of the scanning beam is configured to impact an oxide layer at the edge portion. The laser is pulsed in a series of ablating pulses at the edge portion, with the ablating pulses creating an ablation plume that includes ablated material from the oxide layer of the primary surface and the peripheral surface of the edge portion. The ablation plume is analyzed, and ablation and analyzing continues until a threshold of at least one constituent in the ablation plume or the analysis plume is met or exceeded. One or more operating parameters of the laser are adjusted based on the analysis of the ablation plume or analysis plume. In some embodiments, two aluminum metal pieces are simultaneously prepared.

A method of processing a wafer having a plurality of intersecting streets on a face side thereof with protrusions on the streets includes a holding step of holding a protective sheet of a wafer unit on a holding table, an upper surface heightwise position detecting step of detecting a heightwise position of an upper surface of a reverse side of the wafer along the streets, and a laser beam applying step of applying a laser beam having a wavelength transmittable through the wafer to the wafer from the reverse side thereof along the streets while positioning a focused point of the laser beam within the wafer on the basis of the heightwise position, to thereby form modified layers in the wafer along the streets.

A method is provided for producing a glass or glass ceramic article that includes: providing a sheet-like glass or glass ceramic substrate having two opposite faces, which in the visible spectral range from 380 nm to 780 nm exhibits light transmittance of at least 1% for visible light that passes from one face to the opposite face; providing an opaque coating on one face where the coating exhibits light transmittance of not more than 5% in the visible spectral range from 380 nm to 780 nm; and directing a pulsed laser beam onto the opaque coating and locally removing the coating by ablation down to the surface of the glass or glass ceramic article, repeatedly at different locations, thereby producing a pattern of a multitude of openings defining a perforated area in the opaque coating, so that the opaque coating becomes semi-transparent in the area.

A laser processing device having a function for efficiently starting laser processing, while eliminating an adverse effect due to a reflected laser beam from a workpiece. The laser processing device has: a reflected beam intensity detecting part for detecting an intensity of a reflected beam, which is a part of a laser beam irradiated from a laser oscillator and then is reflected by a workpiece surface; a beam intensity increasing part for continuously increasing an intensity of the irradiating laser beam over a predetermined period of time; a next process selecting part for selecting a content of a next process, based on a temporal change in the intensity of the detected reflected beam, during the intensity of the irradiating laser beam is increased; and an executing part for executing the next process subsequent to the laser processing, based on the selected content of the next process.

A welding method for an outer joint member of a constant velocity universal joint includes constructing a cup section having track grooves, which engage with torque transmitting elements, formed along an inner periphery thereof and a shaft section that is formed on a bottom portion of the cup section by two or more separate members, joining a cup member forming the cup section and a shaft member forming the shaft section, and melt-welding end portions of the cup member and the shaft member. The cup member and the shaft member are shaped so that a sealed hollow cavity portion is formed when the end portions of the cup member and the shaft member are brought into abutment against each other, the melt-welding of the end portions being performed when the sealed hollow cavity portion is under atmospheric pressure or lower.

A welding method for an outer joint member of a constant velocity universal joint includes constructing a cup section having track grooves, which engage with torque transmitting elements, formed along an inner periphery thereof and a shaft section that is formed on a bottom portion of the cup section by two or more separate members, joining a cup member forming the cup section and a shaft member forming the shaft section, and melt-welding end portions of the cup member and the shaft member. The cup member and the shaft member are shaped so that a sealed hollow cavity portion is formed when the end portions of the cup member and the shaft member are brought into abutment against each other, the melt-welding of the end portions being performed when the sealed hollow cavity portion is under atmospheric pressure or lower.