B23K26/70

Method for emissions plume monitoring in additive manufacturing

A method of monitoring an additive manufacturing process in which one or more energy beams are used to selectively fuse a powder to form a workpiece, in the presence of one or more plumes generated by interaction of the one or more energy beams with the powder. The method includes using at least one sensor to generate at least one signal representative of a trajectory of one or more of the plumes.

Method for emissions plume monitoring in additive manufacturing

A method of monitoring an additive manufacturing process in which one or more energy beams are used to selectively fuse a powder to form a workpiece, in the presence of one or more plumes generated by interaction of the one or more energy beams with the powder. The method includes using at least one sensor to generate at least one signal representative of a trajectory of one or more of the plumes.

Optical module having a device for automatically changing a collimation optic
11478881 · 2022-10-25 · ·

An optical module for a machine for machining workpieces and/or for producing molded bodies by way of location-selective solidification of material powder into contiguous regions by a laser beam includes a housing for releasably fastening the optical module to the machine and a collimation optics changer releasably arranged in the housing, having at least two collimation optics which can be moved into a beam path of the laser beam for collimating the laser beam. The collimation optics changer has a mechanism for automatically changing the collimation optics.

LASER MACHINING SYSTEM

A control device that executes machining to cut a workpiece into a part and a remaining material; a detection unit that determines, as a time-series signal, a result of observing in time series a state of the workpiece; a machining state evaluation unit that determines, as evaluation information, a result of evaluation on a state of the machining for each of sections obtained by dividing the machining path, based on the time-series signal; an evaluation information storage unit that stores contour line evaluation information in which a contour line is associated with the evaluation information; and a sorting operation determination unit that determines a sorting control command for controlling sorting operation in which the part is taken out from a position where the workpiece is machined and moved to a target position, based on the contour line evaluation information; are provided.

LASER MACHINING SYSTEM

A control device that executes machining to cut a workpiece into a part and a remaining material; a detection unit that determines, as a time-series signal, a result of observing in time series a state of the workpiece; a machining state evaluation unit that determines, as evaluation information, a result of evaluation on a state of the machining for each of sections obtained by dividing the machining path, based on the time-series signal; an evaluation information storage unit that stores contour line evaluation information in which a contour line is associated with the evaluation information; and a sorting operation determination unit that determines a sorting control command for controlling sorting operation in which the part is taken out from a position where the workpiece is machined and moved to a target position, based on the contour line evaluation information; are provided.

LASER PROCESSING DEVICE
20230080501 · 2023-03-16 ·

Laser processing device (100) includes laser oscillator (10) that generates laser light beam (LB), optical fiber (30) that transmits laser light beam (LB), laser head (40) that emits laser light beam (LB) to workpiece (W), and chiller (50) that passes and circulates cooling water through laser oscillator (10) to cool laser oscillator (10). Laser oscillator (10) includes: a plurality of laser diodes; and a base having a cooling water channel therein and having the laser diodes mounted on a surface thereof. Laser processing device (100) is configured to change the incident angle of laser light beam (LB) entering optical fiber (30) by changing the water pressure of the cooling water flowing through the cooling water channel.

Laser processing system, jet observation apparatus, laser processing method, and jet observation method
11478876 · 2022-10-25 · ·

A laser processing system that can effectively blow out a material of a workpiece melted by a laser beam by effectively utilizing an assist gas emitted from a nozzle. The laser processing system comprising a nozzle including an emission opening configured to emit a jet of an assist gas along an optical axis of a laser beam, the nozzle being configured to form a maximum point of velocity of the jet at a position away from the emission opening; a measuring instrument configured to measure a sound generated by the jet impinging on an object; and a position acquisition section configured to acquire information representing the position of the maximum point based on output data of the measuring instrument.

SUBSTRATE PROCESSING APPARATUS AND METHOD OF MANUFACTURING SEMICONDUCTOR CHIP USING THE SAME

A substrate processing apparatus includes a chuck table including a mounting table having a mounting surface on which a substrate is mounted, wherein the mounting surface is a curved surface; and a laser supply head configured to irradiate the substrate attached to the mounting table with a laser beam.

Melt Pool Monitoring System and Method for Detecting Errors in an Additive Manufacturing Process
20230129572 · 2023-04-27 ·

A system and method of monitoring a powder-bed additive manufacturing process is provided where a layer of additive powder is fused using an energy source and electromagnetic emission signals are measured by a melt pool monitoring system to monitor the print process. The measured emission signals are analyzed to identify outlier emissions and clusters of outliers are identified by assessing the spatial proximity of the outlier emissions, e.g., using clustering algorithms, spatial control charts, etc. An alert may be provided or a process adjustment may be made when a cluster is identified or when a magnitude of a cluster exceeds a predetermined cluster threshold.

LASER PROCESSING APPARATUS
20230073693 · 2023-03-09 ·

A laser processing apparatus includes a laser oscillator configured to emit a laser beam, a slit configured to narrow a width of the laser beam emitted from the laser oscillator to a width corresponding to a dividing groove to form the dividing groove of a predetermined width, a slit moving mechanism configured to move the slit in a direction corresponding to a width direction of the dividing groove, and an adjusting unit configured to make the center of the slit and the cross-sectional center of the laser beam entering the slit coincide with each other in a direction in which the slit moving mechanism moves the slit.