The present laser processing device has a laser oscillator, a laser power supply, a control unit, an optical fiber cable, an electric cable, a processing head, an operation panels and a laser processing monitor unit. The laser processing monitor unit includes the control unit, the operation panel a sensor signal processing unites and a sensor unites as a basic configuration for a main function, that is, a monitoring function, and additionally includes a reference beam source, a reference beam source power supply, an optical measuring instrument and an optical path switching unit as a calibration unites for calibrating an optical sensor incorporated in the sensor unit.

A laser apparatus includes: a first vacuum chamber, wherein machining is performed on a target substrate in the first vacuum chamber; a laser facing the first vacuum chamber; a carrier disposed in the first vacuum chamber, wherein the target substrate is seated on the carrier; a chamber window disposed in one surface of the first vacuum chamber, wherein a laser beam emitted by the laser passes through the chamber window; a first protection window positioned between the carrier and the chamber window; a second vacuum chamber disposed at a first side of the first vacuum chamber; and a transfer unit configured to transfer the first protection window to the second vacuum chamber.

An additive manufacturing apparatus comprises a processing chamber (100) defining a window (110) for receiving a laser beam and an optical module (10) The optical module is removably-mountable to the processing chamber for delivering the laser beam through the window. The optical module contains optical components for focusing and steering the laser beam and a controlled atmosphere can be maintained within the module.

A surface processing machine for processing a surface of a workpiece has a processing unit which includes a laser oscillator that emits a laser beam, a condenser that forms the laser beam which has been emitted by the laser oscillator, into a plurality of beams, a collimation lens that is arranged between the laser oscillator and the condenser and collimates the laser beam into parallel light, a beam intensity adjuster that is arranged between the condenser and the collimation lens and adjusts an intensity of the beams, and a rotating mechanism that rotates the condenser.

A laser processing program creation device sets an evaluation region in an adjacent plane to a target plane; calculates the position of the extremity of the product profile in the axial direction within the evaluation region; sets a first line segment passing through the position of the extremity and extending orthogonally to the axis in the target plane; locates a processing area in the range surrounded by the first line segment, a second line segment, and the product profile, the second line segment extending in the axial direction from an end of the first line segment to the product profile; allocates a trajectory for laser beam cutting to form a notch or a hole in the processing area; and allocates a trajectory for laser beam cutting to cut the material along the product profile.

The invention provides a method for laser modification of a sample to form a modified region at a target location within the sample. The method comprises positioning a sample in a laser system for modification by a laser; measuring tilt of a surface of the sample through which the laser focusses; using at least the measured tilt to determine a correction to be applied to an active optical element of the laser system; applying the correction to the active optical element to modify wavefront properties of the laser to counteract an effect of coma on laser focus; and laser modifying the sample at the target location using the laser with the corrected wavefront properties to produce the modified region.

An irradiation system includes: a first beam source configured to output a first laser beam and a second beam source configured to output a second laser beam, in which the second laser beam has a higher beam quality higher than that of the first laser beam;

optics arranged to focus the first and second laser beams; and a beam guiding system including a first beam path along which the first laser beam is guided, and a second beam path along which the second laser beam is guided, in which the beam guiding system includes a beam combiner to superimpose the first and second laser beams, the first beam source is a pump laser, the second beam source is a laser resonator, and the beam guiding system further includes a beam switch adapted to feed the first laser beam into a pump laser beam path and/or into the first beam path.

A method for introducing a recess into a substrate, and/or for reducing a material, includes spatially beam shaping a focus of a laser beam along a beam axis, whereby defects are produced in the substrate along the beam axis without there being any material removal. One or more of the defects forms a modification in the substrate, so that subsequently the recess and/or the material thickness reduction is produced by action of an etching medium by an anisotropic material removal. An additional modification is introduced into the substrate along an additional beam axis that is parallel to and spaced from the beam axis, the additional modification having an extent between a first outer surface of the substrate and a position within the substrate that is at a distance from a second, opposite outer surface of the substrate.

A processing apparatus includes: a beam irradiation apparatus that is configured to irradiate an object with an energy beam; and a beam deflection apparatus that is configured to change a propagating direction of the energy beam toward the beam irradiation apparatus, wherein when the energy beam propagating toward the beam irradiation apparatus from the beam deflection apparatus propagates in a first direction, the beam irradiation apparatus emits the energy beam in a second direction, and when the energy beam propagating toward the beam irradiation apparatus from the beam deflection apparatus propagates in a third direction that is different from the first direction, the beam irradiation apparatus emits the energy beam in a fourth direction that is different from the second direction.

A processing apparatus includes: a beam irradiation apparatus that is configured to irradiate an object with an energy beam; and a beam deflection apparatus that is configured to change a propagating direction of the energy beam toward the beam irradiation apparatus, wherein when the energy beam propagating toward the beam irradiation apparatus from the beam deflection apparatus propagates in a first direction, the beam irradiation apparatus emits the energy beam in a second direction, and when the energy beam propagating toward the beam irradiation apparatus from the beam deflection apparatus propagates in a third direction that is different from the first direction, the beam irradiation apparatus emits the energy beam in a fourth direction that is different from the second direction.