B23K26/70

Method for producing a three-dimensional component

A method for producing a three-dimensional component by means of a laser melting process, in which the component is produced by consecutively solidifying individual layers made of building material by melting the building material, wherein said building material can be solidified by the action of radiation, wherein the melting area produced by a punctiform and/or linear energy input is detected by a sensor device and sensor values are derived therefrom in order to evaluate the component quality. The sensor values detected in order to evaluate the component quality are stored together with the coordinate values that locate the sensor values in the component and are displayed by means of a visualization unit in two- and/or multi-dimensional representation with respect to the detection location of the sensor values in the component.

Additive manufacturing, spatial heat treating system and method

An additive manufacturing system including a two-dimensional energy patterning system for imaging a powder bed is disclosed. The two-dimensional energy patterning system may be used to control the rate of cooling experienced by each successive additive layer. Accordingly, the system may be used to heat treat the various additive layers.

Laser cutting of a pre-coated steel blank and associated blank
20230016893 · 2023-01-19 ·

Method for producing a precoated steel blank including the successive steps of: —providing a precoated steel strip including a steel substrate having, on at least one of its main faces, a precoating, the precoating including an intermetallic alloy layer and a metallic layer extending atop said intermetallic alloy layer, the metallic layer being a layer of aluminum, a layer of aluminum alloy or a layer of aluminum-based alloy, —laser cutting the precoated steel strip in order to obtain at least one precoated steel blank, the precoated steel blank including a laser cut edge surface resulting from the laser cutting operation, the laser cut edge surface including a substrate portion and a precoating portion, wherein the laser cutting is carried out in such a way that the substrate portion of the laser cut edge directly resulting from the cutting operation has an oxygen content greater than or equal to 15% in weight.

Laser welded assembly having a heat affected zone reinforcement and method of making the same

A laser welded assembly and method of making. The laser welded assembly includes a first work piece having a thickness (T1) defined between an external surface and a faying surface; a second work piece having a thickness (T2) defined between an external surface and a faying surface of the second work piece; a weld seam having a core fusion zone extending from the external surface of the first work piece through the faying interface and at least partially into the thickness (T2) of the second work piece; and a protruding fusion zone extending laterally from the core fusion zone adjacent to the external surface of the first work piece. The protruding fusion zone may be formed by post-heating or concurrently with the core fusion zone.

Laser welded assembly having a heat affected zone reinforcement and method of making the same

A laser welded assembly and method of making. The laser welded assembly includes a first work piece having a thickness (T1) defined between an external surface and a faying surface; a second work piece having a thickness (T2) defined between an external surface and a faying surface of the second work piece; a weld seam having a core fusion zone extending from the external surface of the first work piece through the faying interface and at least partially into the thickness (T2) of the second work piece; and a protruding fusion zone extending laterally from the core fusion zone adjacent to the external surface of the first work piece. The protruding fusion zone may be formed by post-heating or concurrently with the core fusion zone.

Method and system for joining two components of a meltable material
11701839 · 2023-07-18 · ·

A method for joining two components of a meltable material comprises the steps of providing a first component having a first border region and a second component having a second border region, placing the second component relative to the first component so as to form an overlap between the first border region and the second border region under a gap between the first border region and the second border region, continuously heating opposed sections of the first border region and the second border region at the same time through at least one energy source arranged in the gap at least partially, continuously providing a relative motion of the at least one energy source along the first border region and the second border region in the gap, and continuously pressing already heated sections of the first border region and the second border region onto each other.

Machining condition adjustment apparatus and machine learning device
11554448 · 2023-01-17 · ·

Disclosed is a machine learning device of a cutting condition adjustment apparatus including: a state observation section that observes, as state variables indicating a current state of an environment, cutting condition data indicating a laser cutting condition for a laser cutting and oblique rearward temperature rise data indicating a temperature rise value at an oblique rearward part of a cutting front of a workpiece, a determination data acquisition unit that acquires temperature rise value determination data for determining propriety of the temperature rise value during cutting based on the laser cutting condition for the laser cutting as determination data indicating a propriety determination result of the cutting of the workpiece, and a learning unit that learns the temperature rise value and adjustment of the laser cutting condition for the laser cutting in association with each other using the state variables and the determination data.

Methods and apparatuses for laser processing materials

Methods of laser processing a transparent material are disclosed. The method may include positioning the transparent material on a carrier and transmitting a laser beam through the transparent material, where the laser beam may be incident on a side of the transparent material opposite the carrier. The transparent material may be substantially transparent to the laser beam and the carrier may include a support base and a laser disruption element. The laser disruption element may disrupt the laser beam transmitted through the transparent material such that the laser beam may not have sufficient intensity below the laser disruption element to damage the support base.

Apparatus for machining a workpiece with a laser beam

The invention relates to an apparatus 100, 200, 300, 700 and a method 400 for machining a workpiece 101 with a laser beam 102. The apparatus 100, 200, 300, 700 comprises a machining unit 103 configured to provide a pressurized fluid jet 104 onto the workpiece 101 and to couple the laser beam 102 through at least one optical element 105 into the fluid jet 104 towards the workpiece 101. Further, it comprises a sensing unit 107 arranged to receive a laser-induced electromagnetic radiation 106 propagating away from the workpiece 101 through the fluid jet 104 and through at least one optical element, and configured to convert the received radiation 106 into a signal 108. The apparatus 100, 200, 300, 700 also comprises a signal processing unit 109 configured determine a state of machining the workpiece 101 based on the signal 108.

METHOD FOR THINNING WAFER
20230009693 · 2023-01-12 ·

A method for thinning a wafer is provided which is related to the field of semiconductor technologies, to resolve problems of a low yield, a complex process, and high preparation costs of a SiC power device. The wafer which may alternatively be understood as a composite substrate, includes a first silicon carbide layer, a dielectric layer, and a second silicon carbide layer that are disposed in a stacked manner. The wafer has a first side and a second side that are opposite to each other, and a side that is of the second silicon carbide layer and that is away from the first silicon carbide layer is the first side of the wafer.