A processing apparatus is equipped with: a first stage system that has a table on which a workpiece is placed and moves the workpiece held by the table; a beam irradiation system that includes a condensing optical system to emit beams; and a controller to control the first stage system and the beam irradiation system, and processing is performed to a target portion of the workpiece while the table and the beams from the condensing optical system are relatively moved, and at least one of an intensity distribution of the beams at a first plane on an exit surface side of the condensing optical system and an intensity distribution of the beams at a second plane whose position in a direction of an optical axis of the condensing optical system is different from the first plane can be changed.

A laser machining method able to effectively satisfy cutting quality required on one side of a cutting spot of a workpiece. A laser machining method for cutting a workpiece W by using a machining head able to emit a laser beam and an assist gas coaxially and non-coaxially includes: preparing a machining program specifying, for the workpiece W, a cutting line, and a first region and a second region on both sides of the cutting line where cutting quality requirements are different; and maintaining a state in which a center axis of the assist gas is shifted from an optical axis of the laser beam toward the first region in response to the difference in the cutting quality requirements during the cutting between the first region and the second region along the cutting line in accordance with the machining program.

Laser processing head 10 includes housing 11 and a plurality of optical components. Housing 11 is provided with partition wall 11a, first and second light entrance ports 12a, 12b through which first and second laser beams A, B respectively enter, and light irradiation port 13. Laser processing head 10 includes first and second photodetectors 91b, 92a provided around first and second light entrance ports 12a, 12b, respectively. First photodetector 91b is disposed opposite to second photodetector 92a across partition wall 11a. First photodetector 91b receives light in the second wavelength band including the wavelength of second laser beam B, and second photodetector 92a receives light in the first wavelength band including the wavelength of first laser beam A.

A laser irradiation apparatus is a laser irradiation apparatus including a laser light source, the laser irradiation apparatus including a failure prediction unit configured to perform failure prediction on a movable part used when a substrate is processed by the laser light source, in which the failure prediction unit acquires a physical quantity when the movable part is movable, and derives a failure time of the movable part based on an acquired physical quantity.

A laser irradiation apparatus is a laser irradiation apparatus including a laser light source, the laser irradiation apparatus including a failure prediction unit configured to perform failure prediction on a movable part used when a substrate is processed by the laser light source, in which the failure prediction unit acquires a physical quantity when the movable part is movable, and derives a failure time of the movable part based on an acquired physical quantity.

This invention concerns a module for insertion into an additive manufacturing apparatus. The module comprising a frame mountable in a fixed position in the additive manufacturing apparatus, the frame defining a build chamber and a dosing chamber. A build platform is movable in the build chamber for supporting a powder bed during additive manufacturing of a part. A dosing piston is movable in the dosing chamber to push powder from the dosing chamber. A mechanism mechanically links the build platform to the dosing piston such that downward movement of the build platform in the build chamber results in upward movement of the dosing piston in the dosing chamber.

In a cryogenic workbench, a cryogenic laser peening system and a control method, a tapered surface gap d is adjusted, based on the electromagnetic principle, to control the gasification volume of liquid nitrogen, then the temperatures of the copious cooling workbench and the surface of a sample are precisely controlled by means of the adjustment of the heat absorption amount of liquid nitrogen gasification, the temperature adjustment range and the temperature rising/lowering rate of the cryogenic laser peening system are effectively extended, and the precision of the control of the surface temperature of the sample is increased in combination with a closed-loop control. Additionally, an intelligent control of a cryogenic laser peening process is realized by means of a computer and a PLC control unit, whereby the usage amount of liquid nitrogen in the experiment process is reduced and the processing efficiency is improved.

Devices for laser welding using welding wire have a welding head, a wire guide for the welding wire, and a wire feed drive. The welding wire can be moved by the wire feed drive during a welding process with a feed movement in a feed direction, guided by the wire guide. A positioning device has a positioning drive, by which the welding wire is moved in an oscillating manner in the longitudinal direction of the welding wire, when a wire end of the welding wire is arranged in a welding readiness position. Methods for laser welding using a welding wire as added material are carried out using the devices. A control program controls the devices. The devices for laser welding can be provided as a part of a welding robot.

Devices for laser welding using welding wire have a welding head, a wire guide for the welding wire, and a wire feed drive. The welding wire can be moved by the wire feed drive during a welding process with a feed movement in a feed direction, guided by the wire guide. A positioning device has a positioning drive, by which the welding wire is moved in an oscillating manner in the longitudinal direction of the welding wire, when a wire end of the welding wire is arranged in a welding readiness position. Methods for laser welding using a welding wire as added material are carried out using the devices. A control program controls the devices. The devices for laser welding can be provided as a part of a welding robot.

The laser reflow apparatus of the present invention comprises a laser pressurization head module for pressing a bonding object, which includes a plurality of electronic components arranged on a substrate by a transmissive pressurization member while irradiating a laser beam through the pressurization member, to bond the electronic components to the substrate; and a bonding object transfer module for transferring the bonding object having transferred from one side of the laser pressurization head module to carry the bonding object to the other side thereof after passing through a reflow process of the laser pressurized head module.