Embodiments of welding work cells are disclosed. One embodiment includes a workpiece positioning system, a welding power source, and a welding job sequencer. The workpiece positioning system powers an elevating motion and a rotational motion of a workpiece mounted between a headstock and a tailstock to re-position the workpiece for a next weld to be performed. The welding power source generates welding output power based on a set of welding parameters of the power source. The welding job sequencer commands the workpiece positioning system to re-position the workpiece from a current position to a next position in accordance with a next step of a welding sequence of a welding schedule. The welding job sequencer also commands the welding power source to adjust a current set of welding parameters to a next set of welding parameters in accordance with the next step of the welding sequence of the welding schedule.

Embodiments of welding work cells are disclosed. One embodiment includes a workpiece positioning system, a welding power source, and a welding job sequencer. The workpiece positioning system powers an elevating motion and a rotational motion of a workpiece mounted between a headstock and a tailstock to re-position the workpiece for a next weld to be performed. The welding power source generates welding output power based on a set of welding parameters of the power source. The welding job sequencer commands the workpiece positioning system to re-position the workpiece from a current position to a next position in accordance with a next step of a welding sequence of a welding schedule. The welding job sequencer also commands the welding power source to adjust a current set of welding parameters to a next set of welding parameters in accordance with the next step of the welding sequence of the welding schedule.

A method for forming a pressure fit hermetic seal between a second component (104) and an interior member (108) is disclosed. The method comprises steps of coupling the second component (104) to a first component (102) by applying heat to one or more of the first component (102) and the second component (104) and allowing the first component (102) and the second component (104) to cool, wherein the applying heat step and allowing to cool step form the hermetic seal by causing compression of a hermetic element (106) against the second component (104) and by causing compression of the hermetic element (106) against the interior member (108).

A method for forming a pressure fit hermetic seal between a second component (104) and an interior member (108) is disclosed. The method comprises steps of coupling the second component (104) to a first component (102) by applying heat to one or more of the first component (102) and the second component (104) and allowing the first component (102) and the second component (104) to cool, wherein the applying heat step and allowing to cool step form the hermetic seal by causing compression of a hermetic element (106) against the second component (104) and by causing compression of the hermetic element (106) against the interior member (108).

A reinforcing member for cold forming according to an embodiment comprises: a blank member; and a reinforcing patch member provided to cover at least a portion of the blank member and coupled to the blank member by a plurality of welded portions, wherein the entire region of a heat-affected zone formed around the welded portions in the blank member is positioned in a region corresponding to the reinforcing patch member, and a heat-affected zone formed around a first welded portion from among the welded portions may contact the central point of a second welded portion adjacent to the first welded portion or may be formed to be spaced apart from the central point of the second welded portion.

A welding method for welding grouped conductor ends of a component for an electrical machine by means of a welding device. In the method, a relative position of a first conductor end and a second conductor end of grouped conductor ends and then a first size parameter of a molten pool formed during welding are detected. Subsequently, a second size parameter of the molten pool formed during welding is detected. In a further method step, a value of the molten pool is determined from the first size parameter, the second size parameter and the relative position. Finally, a welding energy input is controlled depending on the determined value of the molten pool.

The beam rotation device described herein has a base support with a first vertical jaw arm, a second vertical jaw arm, and a support arm. The second vertical jaw arm may be pivotally coupled to the device so as to go from a first, closed position to a second, opened position to receive a steel beam (e.g., I-beam). Once the steel beam is placed within the device, the support arm may hold the beam stationary to allow a worker to weld or perform other tasks. It will be appreciated that multiple beam rotation devices may be coupled together and work in tandem to receive and rotate a beam. The beam rotation device creates a safer working environment than the rotators found in the art by having a pivotable second vertical jaw arm that may open to receive a beam and a support arm to hold the beam during fabrication.

The beam rotation device described herein has a base support with a first vertical jaw arm, a second vertical jaw arm, and a support arm. The second vertical jaw arm may be pivotally coupled to the device so as to go from a first, closed position to a second, opened position to receive a steel beam (e.g., I-beam). Once the steel beam is placed within the device, the support arm may hold the beam stationary to allow a worker to weld or perform other tasks. It will be appreciated that multiple beam rotation devices may be coupled together and work in tandem to receive and rotate a beam. The beam rotation device creates a safer working environment than the rotators found in the art by having a pivotable second vertical jaw arm that may open to receive a beam and a support arm to hold the beam during fabrication.

A BGA structure having larger solder balls in high stress regions of the array is disclosed. The larger solder balls have higher solder joint reliability (SJR) and as such may be designated critical to function (CTF), whereby the larger solder balls in high stress regions carry input/output signals between a circuit board and a package mounted thereon. The larger solder balls are accommodated by recessing each ball in the package substrate, the circuit board, or both the package substrate and the circuit board. Additionally, a ball attach method for mounting a plurality of solder balls having different average diameters is disclosed.

A BGA structure having larger solder balls in high stress regions of the array is disclosed. The larger solder balls have higher solder joint reliability (SJR) and as such may be designated critical to function (CTF), whereby the larger solder balls in high stress regions carry input/output signals between a circuit board and a package mounted thereon. The larger solder balls are accommodated by recessing each ball in the package substrate, the circuit board, or both the package substrate and the circuit board. Additionally, a ball attach method for mounting a plurality of solder balls having different average diameters is disclosed.