The invention relates to a method for producing a permanently joined plate heat exchanger comprising a plurality of metal heat exchanger plates having a solidus temperature above 1000 C., provided beside each other and forming a plate package with first plate interspaces for a first medium and second plate interspaces for a second medium, wherein the first and second plate interspaces are provided in an alternating order in the plate package, wherein each heat exchanger plate comprises a heat transfer area and an edge area comprising bent edges which extend around the heat transfer area, wherein a first surface of the plates forms a convex shape and a second surface of the plates forms a concave shape, wherein the heat transfer area comprises a corrugation of elevations and depressions, wherein said corrugation of the plates and the bent edges are provided by pressing the plates. The invention also relates to a plate heat exchanger produced by the method.

Some embodiments relate to a semiconductor device package, which includes a substrate with a contact pad. A non-solder ball is coupled to the contact pad at a contact pad interface surface. A layer of solder is disposed over an outer surface of the non-solder ball, and has an inner surface and an outer surface which are generally concentric with the outer surface of the non-solder ball. An intermediate layer separates the non-solder ball and the layer of solder. The intermediate layer is distinct in composition from both the non-solder ball and the layer of solder. Sidewalls of the layer of solder are curved or sphere-like and terminate at a planar surface, which is disposed at a maximum height of the layer of solder as measured from the contact pad interface surface.

A braze alloy composition for sealing a ceramic component to a metal component in an electrochemical cell is presented. The braze alloy composition includes copper, nickel, and an active metal element. The braze alloy includes nickel in an amount less than about 30 weight percent, and the active metal element in an amount less than about 10 weight percent. An electrochemical cell using the braze alloy for sealing a ceramic component to a metal component in the cell is also provided.

A method for bonding of a first solid substrate to a second solid substrate which contains a first material with the following steps, especially the following sequence: formation or application of a function layer which contains a second material to the second solid substrate, making contact of the first solid substrate with the second solid substrate on the function layer, pressing together the solid substrates for forming a permanent bond between the first and second solid substrate, at least partially reinforced by solid diffusion and/or phase transformation of the first material with the second material, an increase of volume on the function layer being caused.

A method for joining a first metal part (11) with a second metal part (12), the metal parts (11,12) having a solidus temperature above 1100 QC. The method comprises: applying a melting depressant composition (14) on a surface (15) of the first metal part (11), the melting depressant composition (14) comprising a melting depressant component that comprises at least 25 wt % boron and silicon for decreasing a melting temperature of the first metal part (11); bringing (202) the second metal part (12) into contact with the melting depressant composition (14) at a contact point (16) on said surface (15); heating the first and second metal parts (11,12) to a temperature above 1100 QC; and allowing a melted metal layer (210) of the first metal component (11) to solidify, such that a joint (25) is obtained at the contact point (16). The melting depressant composition and related products are also described.

The present invention relates to a method for providing a braze alloy layered product comprising the following steps: applying at least one silicon source and at least one boron source on at least a part of a surface of a substrate, wherein the at least one boron source and the at least one silicon source are oxygen free except for inevitable amounts of contaminating oxygen, and wherein the substrate comprises a parent material having a solidus temperature above 1100 C.; heating the substrate having the applied boron source and the applied silicon source to a temperature lower than the solidus temperature of the parent material of the substrate; and cooling the substrate having the applied boron source and the applied silicon source, and obtaining the braze alloy layered product. The present invention relates further to a braze alloy layered product, a method for providing a brazed product, a method for providing a coated product, and uses of the braze alloy layered product.

A braze alloy composition for sealing a ceramic component to a metal component in an electrochemical cell is presented. The braze alloy composition includes copper, nickel, and an active metal element. The braze alloy includes nickel in an amount less than about 30 weight percent, and the active metal element in an amount less than about 10 weight percent. An electrochemical cell using the braze alloy for sealing a ceramic component to a metal component in the cell is also provided.

Components having cracks can be repaired more simply by the localized deposition of braze material onto a region that is to be repaired, and surrounding weld filler material. A method is disclosed for repairing a damaged component. The component has a substrate with cracks, wherein material is to be deposited at least in a region of a build-up region having the cracks. The method includes a braze material deposited at least in the region of the cracks and a weld filler material is deposited in the other regions of the build-up region, wherein the melting point of the braze material is at least 10K lower than that of the material of the substrate and the weld filler material, in which the braze material is always surrounded by a weld filler material in a plane, in particular completely surrounded.

Embodiments of the present invention are directed to flux-cored brazing consumables and preforms which have at least one protrusion which extends from an outer surface of the consumable such that the protrusion engages with a surface of a component to be brazed. The protrusion aids in securing the brazing consumable in position during manufacture, assembly and transport of an assembly to be brazed, prior to a brazing operation.

An electrically assisted pressure joining apparatus and an electrically assisted pressure joining method join a first metal member and a second metal member together, and includes an electrode portion, an intermediate portion including a plurality of micropores and inserted between a first metal member and a second metal member, and a pressure portion connected to the electrode portion to receive a current from the electrode portion and transfer the current to the first metal member and the second metal member to apply a pressure to the first metal member such that the first metal member and the second metal member are joined together by the intermediate portion.