The present invention relates to a blend of at least one boron source and at least one silicon source, wherein the blend comprises boron and silicon in a weight ratio boron to silicon within a range from about 5:100 to about 2:1, wherein silicon and boron are present in the blend in at least 25 wt %, and wherein the at least one boron source and the at least one silicon source are oxygen free except for inevitable amounts of contaminating oxygen, and wherein the blend is a mechanical blend of powders, and wherein particles in the powders have an average particle size less than 250 m. The present invention relates further to a composition comprising the blend a substrate applied with the blend, a method for providing a brazed product, and uses.

Some embodiments relate to a semiconductor device package, which includes a substrate with a contact pad. A non-solder ball is coupled to the contact pad at a contact pad interface surface. A layer of solder is disposed over an outer surface of the non-solder ball, and has an inner surface and an outer surface which are generally concentric with the outer surface of the non-solder ball. An intermediate layer separates the non-solder ball and the layer of solder. The intermediate layer is distinct in composition from both the non-solder ball and the layer of solder. Sidewalls of the layer of solder are curved or sphere-like and terminate at a planar surface, which is disposed at a maximum height of the layer of solder as measured from the contact pad interface surface.

The described embodiments of mechanisms of forming a package on package (PoP) structure involve bonding with connectors with non-solder metal balls to a packaging substrate. The non-solder metal balls may include a solder coating layer. The connectors with non-solder metal balls can maintain substantially the shape of the connectors and control the height of the bonding structures between upper and lower packages. The connectors with non-solder metal balls are also less likely to result in bridging between connectors or disconnection (or cold joint) of bonded connectors. As a result, the pitch of the connectors with non-solder metal balls can be kept small.

In some examples, the disclosure describes a technique that includes covering a joint surface of a first part including a titanium aluminum (TiAl) alloy with a braze material including aluminum, where covering the joint surface includes at least one of electroplating the braze material on the joint surface, hot dipping the braze material on the joint surface, or positioning a foil of the braze material adjacent to the joint surface, positioning a second part including a titanium alloy in contact with the first part to define a joint region, where the joint region includes the braze material interposed between the second part and the joint surface of the first part, and heating the joint region to at least partially melt the braze material to form a braze joint connecting the first part to the second part.

Disclosed is a method for producing a permanently joined plate heat exchanger comprising a plurality of metal heat exchanger plates having a solidus temperature above 1100 C., provided beside each other and forming a plate package with first plate interspaces for a first medium and second plate interspaces for a second medium, wherein the first and second plate interspaces are provided in an alternating order in the plate package, wherein each heat exchanger plate comprises a heat transfer area and an edge area comprising bent edges which extend around the heat transfer area, wherein a first surface of the plates forms a convex shape and a second surface of the plates forms a concave shape, wherein the heat transfer area comprises a corrugation of elevations and depressions, wherein said corrugation of the plates and the bent edges are provided by pressing the plates. Also disclosed is a plate heat exchanger produced by the method.

Disclosed is a method for producing a permanently joined plate heat exchanger comprising a plurality of metal heat exchanger plates having a solidus temperature above 1100 C., provided beside each other and forming a plate package with first plate interspaces for a first medium and second plate interspaces for a second medium, wherein the first and second plate interspaces are provided in an alternating order in the plate package. Each heat exchanger plate comprises a heat transfer area and an edge area which extend around the heat transfer area. The heat transfer area comprises a corrugation of elevations and depressions, wherein said corrugation of the plates are provided by pressing the plates. Also disclosed is a plate heat exchanger produced by the method.

A mounting bolt for a sub-frame is disclosed. A mounting bolt for a sub-frame that is used to engage a sub-frame to a front side member of a vehicle according to one or a plurality of exemplary embodiments of the present invention may include a bolt body that is inserted into a penetration hole of a mounting bracket fixed on the front side member and is joined to the mounting bracket through a first flange that is formed at an upper end circumference thereof, a support body at which a second flange is formed at a lower end circumference to have a hollow space and is disposed on the bolt body, and a joining plate that is interposed between the first flange and the second flange and is welded with a first join protrusion that is formed on an upper surface of the first flange and a second join protrusion that is formed on a lower surface of the second flange by electrical resistance.

A method includes disposing ZrH.sub.2 nanoparticles on a first metallic material. The method includes performing a diffusion bonding operation to bond the first metallic material to a second metallic material. At least one of the first metallic material or the second metallic material includes a surface oxide layer. During the diffusion bonding operation, the ZrH.sub.2 nanoparticles chemically react with the surface oxide layer.

A solder material (30) for bonding a metal layer (20) to a ceramic layer (10), in particular for forming a metal-ceramic substrate as a carrier for electrical components, comprising: a base material and an active metal, wherein the solder material (30) is a foil comprising the base material in a first layer (31) and the active metal in a second layer (32), and wherein the foil has a total thickness (GD) which is less than 50 m, preferably less than 25 m and particularly preferably less than 15 m.

Disclosed are methods and structures for joining metallic members. A welding material can be used between two metallic members that comprise different metals. The different metals can normally form brittle intermetallic compounds when welded to one another, and the welding material can inhibit the formation of the brittle intermetallic compounds.