A process of repairing a component includes identifying a void in a component; determining at least one approximate physical configuration of the void; inserting borescope into the component in order to view the void; providing a repair rod approximately equivalent to at least one of the least one approximate physical configuration of the void; inserting the repair rod into component; confirming insertion of the repair rod in the void; separating the repair rod to leave a repair plug in the void; and depositing braze paste over the repair plug in the void.

A process of repairing a component includes identifying a void in a component; determining at least one approximate physical configuration of the void; inserting borescope into the component in order to view the void; providing a repair rod approximately equivalent to at least one of the least one approximate physical configuration of the void; inserting the repair rod into component; confirming insertion of the repair rod in the void; separating the repair rod to leave a repair plug in the void; and depositing braze paste over the repair plug in the void.

A method of manufacturing a plate-shaped solder according to the invention of the present application includes an aggregating step of aggregating a plurality of thread solders and a crimping step of crimping the plurality of aggregated thread solders to one another to form a plate-shaped solder. A manufacturing device of a plate-shaped solder according to the invention of the present application includes an aggregating portion for aggregating a plurality of thread solders and a crimping portion for crimping the plurality of thread solders to one another in the aggregating portion to form a plate-shaped solder.

A method of manufacturing a plate-shaped solder according to the invention of the present application includes an aggregating step of aggregating a plurality of thread solders and a crimping step of crimping the plurality of aggregated thread solders to one another to form a plate-shaped solder. A manufacturing device of a plate-shaped solder according to the invention of the present application includes an aggregating portion for aggregating a plurality of thread solders and a crimping portion for crimping the plurality of thread solders to one another in the aggregating portion to form a plate-shaped solder.

Molded solder includes first metal powder and second metal powder. The first metal powder has a first solidus temperature and a first liquidus temperature and includes an alloy containing metal elements. The second metal powder has a melting temperature or a second solidus temperature and a second liquidus temperature and includes single metal element or an alloy containing metal elements. The melting temperature and the second liquidus temperature are higher than the first liquidus temperature. The molded solder is so constructed that a mixture of the first metal powder and the second metal powder are press-molded. The molded solder is so constructed that a first solidus temperature of a solder becomes higher when the molded solder becomes the solder after the first metal powder has been melted by heating the molded solder at a temperature equal to or higher than the first liquidus temperature.

A method of titanium rod additive manufacturing may comprise: mixing a plurality of powdered metals comprising titanium, iron, vanadium, and aluminum to produce a powder blend; isostatic pressing the powder blend to form a billet having a cross-sectional profile; cutting the billet to form a rod feedstock having the first cross-sectional profile; loading the rod feedstock into an additive manufacturing machine configured to deposit the rod feedstock; and producing a metallic component from the rod feedstock.

A method of forming a rod feedstock for titanium stir friction welding additive manufacturing may comprise: mixing a plurality of powdered metals comprising titanium, iron, vanadium, and aluminum to produce a powder blend; at least one of die pressing the powder blend to form a die pressed powder or continuously powder rolling the powder blend to form a die pressed powder; and sintering the powder blend to form a rod feedstock having a cross-sectional profile.

A solder material for use in electronic assembly, the solder material comprising: solder layers; and a core layer comprising a core material, the core layer being sandwiched between the solder layers, wherein: the thermal conductivity of the core material is greater than the thermal conductivity of the solder.

Provided is a wire for electric bonding, which includes a solder wire and a composition for bonding adjacent to the solder wire, the solder wire is wet when reaches to a melting point as heat is transferred, the composition for bonding includes an epoxy resin, a reducing agent, and a curing agent, the reducing agent removes a metal oxide formed on a surface of the solder wire, and the epoxy resin is cured by chemically reacting with the reducing agent and the curing agent at a curing temperature.

Provided is an austenitic stainless steel weld joint that is excellent in polythionic acid SCC resistance and naphthenic acid corrosion resistance, and is also excellent in creep ductility. An austenitic stainless steel weld joint includes a base material and a weld metal. The weld metal has a chemical composition at its width-center position and at its thickness-center position consisting of, in mass %, C: 0.050% or less, Si: 0.01 to 1.00%, Mn: 0.01 to 3.00%, P: 0.030% or less, S: 0.015% or less, Cr: 15.0 to 25.0%, Ni: 20.0 to 70.0%, Mo: 1.30 to 10.00%, Nb: 0.05 to 3.00%, N: 0.150% or less, and B: 0.0050% or less, with the balance: Fe and impurities.