A composition for welding or brazing aluminum comprises silicon (Si) and magnesium (Mg) along with aluminum in an alloy suitable for use in welding and brazing. The Si content may vary between approximately 5.0 and 6.0 wt %, and the Mg content may vary between approximately 0.15 wt % and 0.50 wt %. The alloy is well suited for operations in which little or no dilution from the base metal affects the Si and/or Mg content of the filler metal. The Si content promotes fluidity and avoids stress concentrations and cracking. The Mg content provides enhanced strength. Resulting joints may have a strength at least equal to that of the base metal with little or no dilution (e.g., draw of Mg). The joints may be both heat treated and artificially aged or naturally aged.

In various embodiments, metallic wires are fabricated by combining one or more powders of substantially spherical metal particles with one or more powders of non-spherical particles within one or more optional metallic tubes. The metal elements within the powders (and the one or more tubes, if present) collectively define a high entropy alloy of five or more metallic elements or a multi-principal element alloy of four or more metallic elements.

A method of titanium wire additive manufacturing is disclosed. The method may comprise mixing a plurality of powdered metals comprising titanium, iron, vanadium, and aluminum to produce a powder blend, sintering the powder blend to form a billet, performing a wire forming operation to produce a worked wire, heat treating the worked wire to produce a heat treaded wire, loading the heat treated wire into a wirefeed additive manufacturing machine, and producing a metallic component from the heat treated wire. The titanium may be a titanium hydride powder.

A method for producing a feedstock wire is produced from a first metal strip and at least one further metal strip by roll forming, wherein in particular the first metal strip and the at least one further metal strip are made of differing metals, preferably of differing meals having differing yield points, wherein a jacket, which in the final shape completely surrounds the at least one further metal strip in the circumferential direction, is formed from the first metal strip in a plurality of passes by roll forming using a plurality of roll stands, and wherein, first, exclusively only the first metal strip is formed to a preliminary shape in a plurality of passes using a first group of roll stands and, thereafter, the first metal strip and the at least one further metal strip are jointly formed to the final shape in a second group of roll stands.

A silver-copper cutting electrode assembly, and method of manufacture is provided with optimized attributes to allow for improved durability, integrity and manufacturability. An electrode has a silver tip portion which is brazed to a copper body portion where the silver portion and joint have a particular structural relationship.

A silver-copper cutting electrode assembly, and method of manufacture is provided with optimized attributes to allow for improved durability, integrity and manufacturability. An electrode has a silver tip portion which is brazed to a copper body portion where the silver portion and joint have a particular structural relationship.

Devices, systems, and/or methods that can facilitate plating one or more metal layers onto a niobium-titanium substrate are provided. According to an embodiment, a device can comprise a niobium-titanium substrate. The device can further comprise a first metal layer plated on a portion of the niobium-titanium substrate. The device can further comprise a second metal layer plated on the first metal layer. The device can further comprise a third metal layer plated on the second metal layer.

Devices, systems, and/or methods that can facilitate plating one or more metal layers onto a niobium-titanium substrate are provided. According to an embodiment, a device can comprise a niobium-titanium substrate. The device can further comprise a first metal layer plated on a portion of the niobium-titanium substrate. The device can further comprise a second metal layer plated on the first metal layer. The device can further comprise a third metal layer plated on the second metal layer.

A method for producing a brazing wire consists of unwinding a solid metal or metal alloy wire, of circular or substantially circular cross-section and subjecting the wire to a stamping operation between rotating rollers, the periphery of which respectively having a die for receiving the full wire and a punch capable of deforming the wire and of generating a U-shaped cross-section across substantially the entire original diameter of the wire. The method also consists of filling the volume defined by the U using brazing flux or pickling flux in a powder or paste form and closing the arms of the U, after filling of the volume with the flux, one on top of the other with the end of one of the arms of the U overlapping the other. The method also consists of calibrating and shaping the resulting wire, according to the desired diameter and cross-section.

A micro/nanoparticle-reinforced composite solder for low-temperature soldering and a preparation method thereof belong to the manufacturing field of lead-free low-temperature soldering solders. Micro/nanoparticle-reinforced tin-based alloy solder powder is formed by diffusely mixing micro/nano-sized Cu, Ag and Sb particles with a molten metal tin and atomizing the mixture, and then blended with low-melting-point SnBi-based alloy solder powder and a conventional flux to prepare a micro/nanoparticle-reinforced composite solder. In soldering at a temperature below 200° C., tin atoms in the molten micro/nanoparticle-reinforced tin-based alloy form an intermetallic compound on a soldering pan in preference to the low-melting-point SnBi-based alloy, and the micro/nanoparticles are dispersed in soldered joints to form a “separator effect”, which blocks atoms in the SnBi-based alloy from being precipitated and bonded with the soldering pan, thereby inhibiting the growth of a Bi-rich layer, and solving the problem of brittle and unreliable soldered joints in lead-free low-temperature soldering.