A micro/nanoparticle-reinforced composite solder for low-temperature soldering and a preparation method thereof belong to the manufacturing field of lead-free low-temperature soldering solders. Micro/nanoparticle-reinforced tin-based alloy solder powder is formed by diffusely mixing micro/nano-sized Cu, Ag and Sb particles with a molten metal tin and atomizing the mixture, and then blended with low-melting-point SnBi-based alloy solder powder and a conventional flux to prepare a micro/nanoparticle-reinforced composite solder. In soldering at a temperature below 200° C., tin atoms in the molten micro/nanoparticle-reinforced tin-based alloy form an intermetallic compound on a soldering pan in preference to the low-melting-point SnBi-based alloy, and the micro/nanoparticles are dispersed in soldered joints to form a “separator effect”, which blocks atoms in the SnBi-based alloy from being precipitated and bonded with the soldering pan, thereby inhibiting the growth of a Bi-rich layer, and solving the problem of brittle and unreliable soldered joints in lead-free low-temperature soldering.

In various embodiments, metallic wires are fabricated by combining one or more powders of substantially spherical metal particles with one or more powders of non-spherical particles within one or more optional metallic tubes. The metal elements within the powders (and the one or more tubes, if present) collectively define a high entropy alloy of five or more metallic elements or a multi-principal element alloy of four or more metallic elements.

Devices, systems, and/or methods that can facilitate plating one or more metal layers onto a niobium-titanium substrate are provided. According to an embodiment, a device can comprise a niobium-titanium substrate. The device can further comprise a first metal layer plated on a portion of the niobium-titanium substrate. The device can further comprise a second metal layer plated on the first metal layer. The device can further comprise a third metal layer plated on the second metal layer.

Devices, systems, and/or methods that can facilitate plating one or more metal layers onto a niobium-titanium substrate are provided. According to an embodiment, a device can comprise a niobium-titanium substrate. The device can further comprise a first metal layer plated on a portion of the niobium-titanium substrate. The device can further comprise a second metal layer plated on the first metal layer. The device can further comprise a third metal layer plated on the second metal layer.

A manufacturing method of a textured and coated electrode wire, comprising: selecting a copper-zinc alloy as a core material, preparing, by means of electroplating/hot-dipping, a metal zinc coating on a surface of the wire material, then performing pre-treatment on the coated electrode wire by means of discontinuous diffusion annealing to obtain a coated electrode wire material having a multi-layer structure of Zn/β-brass & γ-brass/α-brass, and then using multiple cold drawing treatments and a stress-relief annealing treatment to modify the electrode wire and obtain a textured and coated electrode wire material. Compared to conventional copper alloy electrode wires and zinc-coated electrode wires, the material has advantages of a fast cutting speed, low cutting cost, low environmental pollution, etc., wherein the cutting speed increases by 12% or more when compared with copper alloy electrode wire, the wire breakage rate during cutting processes decreases by 30%, and the replacement time interval of an ion-exchange resin filter for cooling water increases by 10%.

A manufacturing method of a textured and coated electrode wire, comprising: selecting a copper-zinc alloy as a core material, preparing, by means of electroplating/hot-dipping, a metal zinc coating on a surface of the wire material, then performing pre-treatment on the coated electrode wire by means of discontinuous diffusion annealing to obtain a coated electrode wire material having a multi-layer structure of Zn/β-brass & γ-brass/α-brass, and then using multiple cold drawing treatments and a stress-relief annealing treatment to modify the electrode wire and obtain a textured and coated electrode wire material. Compared to conventional copper alloy electrode wires and zinc-coated electrode wires, the material has advantages of a fast cutting speed, low cutting cost, low environmental pollution, etc., wherein the cutting speed increases by 12% or more when compared with copper alloy electrode wire, the wire breakage rate during cutting processes decreases by 30%, and the replacement time interval of an ion-exchange resin filter for cooling water increases by 10%.

In various embodiments, additive manufacturing is utilized to fabricate three-dimensional metallic parts using metallic alloy wire as a feedstock material.

The invention relates to a method for producing a welding wire that includes the steps of providing a hollow wire, through at least part of which at least one cavity extends; producing the welding wire by introducing a welding material containing titanium aluminide or at least one nickel-based superalloy into the at least one cavity, the at least one cavity being evacuated or being filled with a protective gas before, during and/or after the introduction of the welding material, and the hollow wire being formed from nickel if the welding material contains the at least one nickel-based superalloy. Further aspects of the invention relate to a welding wire and to a component having at least one component region obtained by hardfacing using at least one such welding wire.

A device for manufacturing a plate solder according to the present invention includes a reel on which a thread solder is wound; a cutter that cuts the thread solder, provided between the reel and an end part of the thread solder extending from the reel; an aggregating part that aggregates a plurality of cut thread solders such that the plurality of thread solders are in contact with one another; and a roller that rolls the plurality of aggregated thread solders and pressure bonds them to one another to form a plate solder.

A device for manufacturing a plate solder according to the present invention includes a reel on which a thread solder is wound; a cutter that cuts the thread solder, provided between the reel and an end part of the thread solder extending from the reel; an aggregating part that aggregates a plurality of cut thread solders such that the plurality of thread solders are in contact with one another; and a roller that rolls the plurality of aggregated thread solders and pressure bonds them to one another to form a plate solder.