An electromagnetic component assembly disposed in a power source of a welding or cutting system. The electromagnetic component assembly includes a core and a tubular winding. The tubular winding is placed near or around the core and conducts a current for an electromagnetic operation. The tubular winding includes a passageway for a process fluid, an inlet, at one end of the passageway, that receives the process fluid, and an outlet, at another end of the passageway, that directs the process fluid downstream toward a torch assembly. The passageway enhances cooling of the electromagnetic component assembly as the process fluid travels through the passageway from the inlet to the outlet.

A metal three-dimensional printing method includes steps of: A) laying a layer of metal powder in a chamber, and the chamber having a first gas filled therein; B) projecting a laser on the layer of metal powder along a predetermined path, thereby allowing the metal powder in a projected area to be melted and sintered for shape forming, applying a second gas at a predetermined flow rate on a surface of the metal powder in the projected area, and preventing the metal powder in the projected area from moving due to application of the second gas; wherein the second gas allows the metal powder being projected to be cooled; C) during projection of the laser, a cooling level of the metal powder being projected is changed by changing a flow rate of the second gas, thereby changing a sintering power of the metal powder.

The invention relates to a welding process for producing a component (10) by depositing multiple layers (100) of a metal material in layers, said layers lying one on top of the other. In said process, the base (10a) of the component (10) is placed in a liquid coolant (6) such that the coolant contacts the base (6), and a surface (10b) of the base (6) lies above the coolant level (3). A first layer (100) of the material is deposited onto the surface (10b) by welding the material to the surface (10b), and each subsequent layer (100) is deposited onto a temporary component surface (10bb) formed by the previously deposited layer (100) by welding the material to the temporary component surface (10bb), wherein the heat resulting from welding the material is absorbed by the coolant (6). The invention additionally relates to a device (1) for carrying out the method.

Aspects of the present disclosure relate to. In one example, a method of controlling an additive manufacturing machine includes: measuring a first temperature of a part being processed by the additive manufacturing machine; determining that the first measured temperature exceeds a temperature threshold; activating an auxiliary gas flow; cooling the auxiliary gas flow with a cooling system; and directing the cooled auxiliary gas flow towards the part.

Provided are a curved clamping mold and systems and methods using the curved clamping mold for manufacturing objects, especially titanium and titanium alloy objects, by directed energy deposition. The methods include thermally pre-bending the substrate onto which the object is to be manufactured to form a pre-bent substrate, attaching the pre-bent substrate to a jig using the curved clamping mold as an underlying support, pre-heating the substrate, and forming the object on the pre-heated, pre-bent substrate using a directed energy deposition technique.

A three-dimensional manufacturing apparatus according to at least one embodiment of the present disclosure includes: a manufacturing nozzle for melting a metal material with an energy beam while supplying the metal material to form a bead; a cooling medium nozzle for spraying a cooling medium toward a region including the bead in a workpiece so that the region is cooled locally; a temperature detection unit configured to detect at least a temperature of the region; and a control device for controlling at least one of a scanning rate of the cooling medium nozzle or an amount of the cooling medium to be sprayed per unit time based on a detection result from the temperature detection unit.

The present invention relates to a device for plasma cutting, comprising a cutting torch (100) provided with an electrode (120), which is coaxially surrounded by a nozzle (110), thereby defining a passage (112) for passing of a plasma gas between electrode and nozzle, wherein the nozzle is coaxially surrounded by a shielding cap (122), thereby defining a passage (114) for passing of a shielding flow between nozzle and shielding cap, the device further comprising an annular member (200) coaxially surrounding the cutting torch (100) configured and adapted to provide a further curtain flow coaxially surrounding the shielding flow through passage (250a and 250b) wherein annular member (200) is configured and adapted for use of CO.sub.2-snow or a mixture containing CO.sub.2-snow as shielding flow.

A method of fixing a membrane to a surface is disclosed. The method includes affixing a metallic washer having a heat-activated adhesive layer on a surface; arranging a membrane on top of the surface and the heat-activated adhesive layer of the metallic washer; heating the metallic washer to activate the heat-activated adhesive layer such that the membrane is fixable to the metallic washer; positioning a magnetic clamping heat sink assembly on the membrane; magnetically clamping the magnetic clamping heat sink assembly to the metallic washer causing the magnetic clamping heat sink assembly to apply a force against the membrane when the magnetic clamping heat sink assembly sufficiently overlaps the metallic washer to form a secure bond; and cooling the metallic washer, the heat-activated adhesive layer, and the membrane by removing heat through the magnetic clamping heat sink assembly.

A semiconductor laser device includes: a first conductivity side semiconductor layer, an active layer; and a second conductivity side semiconductor layer. The second conductivity side semiconductor layer includes a first semiconductor layer and a second semiconductor layer, the first semiconductor layer being closer to the active layer than the second semiconductor layer is. The second semiconductor layer defines a width of a current injection region for injecting current into an optical waveguide. The current injection region includes a width varying region in which a width varies. S1>S2, where S1 denotes a width of the width varying region on a front end face side, and S2 denotes a width of the width varying region on a rear end face side.

A method for forming a large-diameter special-shaped cross section thin-wall tubular part. A tailor welded barrel blank is adopted as an original blank for forming of the large-diameter special-shaped cross section thin-wall tubular part. After a desired shape is formed, the original weld joint is removed and butt joint tailor welding is performed on the tubular part again. Since the tailor weld joint of the original barrel blank is removed from the final part, there is no need to consider the consistency or coordination of the microstructure of the weld joint and the base metal during the forming process and the subsequent thermal treatment process.