A method of additive manufacture is disclosed. The method may include creating, by a 3D printer contained within an enclosure, a part having a weight greater than or equal to 2,000 kilograms. A gas management system may maintain gaseous oxygen within the enclosure atmospheric level. In some embodiments, a wheeled vehicle may transport the part from inside the enclosure, through an airlock, as the airlock operates to buffer between a gaseous environment within the enclosure and a gaseous environment outside the enclosure, and to a location exterior to both the enclosure and the airlock.

An interchangeable carrier system, in particular for workstations for producing components for exhaust systems of internal combustion engines, includes a base unit and a carrier unit, which is to be releasably fixed to the base unit in a working position, wherein a coupling/fixing arrangement is provided on the base unit and a counterpart coupling/fixing arrangement, which can be brought into positive coupling engagement with the coupling/fixing arrangement during a sliding movement of the carrier unit in a sliding movement direction into the working position, is provided on the carrier unit, and wherein, when the carrier unit is positioned in the working position, the carrier unit can be fixed with respect to the base unit by the coupling/fixing arrangement.

A welding jig (3, 103, 203) for holding a horizontal member relative to a vertical member is disclosed. The jig has a base (5, 105, 205) having a clamp (8, 108, 208) able to clamp the base to the vertical member and constituting a first, coarse, vertical adjustment mechanism. A frame (11, 111, 211) is interconnected to the base by a first threaded member (12, 112, 212) constituting a second, fine, vertical adjustment mechanism. A pair of supports (21, 121, 221) is slidingly mounted on the frame and movable between predetermined positions to constitute a first, coarse, horizontal adjustment mechanism. First and second vise parts (43, 44, 143, 144, 271, 272) each threadably mounted on a corresponding one of the supports and movable towards and away from each other constitute a vise mechanism for clamping the horizontal member.

A display processing mask manufacturing apparatus includes a stage, a clamp arranged outside the stage, and a chuck configured to move in a direction and arranged above the stage. The clamp includes a first clamp and a second clamp spaced apart from the first clamp in a first direction and arranged at a position opposite to a position of the first clamp with respect to the stage, and the chuck includes a first chuck and a second chuck spaced apart from the first chuck in a second direction crossing the first direction.

A soldering component and a method of fitting it to boards are introduced. The soldering component includes a body and a fitting portion. The fitting portion is fitted to an object. The body has an engaging portion with an elastic retraction space conducive to elastic retraction of two or more engagement portions, allowing the engagement portions to engage with another object. The soldering component has a weldable surface to be soldered to a weldable surface of the object. The weldable surface of the object has a built-in solder layer adapted to be heated for soldering the soldering component and the weldable surface of the object together. The soldering component is disposed in a carrier, taken out with a tool, compared with the object by a comparison device to determine a fitting position on the object, positioned at the fitting position with the tool, thereby being fitted to the object.

A wafer manufacturing apparatus includes a chuck table configured to hold an SiC ingot by a suction surface with a wafer to be manufactured on an upper side, an ultrasonic oscillating unit configured to oscillate an ultrasonic wave, a water supply unit, and a peeling unit configured to suck and hold the wafer to be manufactured, and peel the wafer to be manufactured. The chuck table includes a porous plate forming the suction surface and a base supporting the porous plate, and sucks and holds the SiC ingot even in a state in which an area of a second surface of the SiC ingot is smaller than an area of the suction surface, and the water flows on the suction surface exposed on the periphery of the SiC ingot.

A wafer manufacturing apparatus includes a chuck table configured to hold an SiC ingot by a suction surface with a wafer to be manufactured on an upper side, an ultrasonic oscillating unit configured to oscillate an ultrasonic wave, a water supply unit, and a peeling unit configured to suck and hold the wafer to be manufactured, and peel the wafer to be manufactured. The chuck table includes a porous plate forming the suction surface and a base supporting the porous plate, and sucks and holds the SiC ingot even in a state in which an area of a second surface of the SiC ingot is smaller than an area of the suction surface, and the water flows on the suction surface exposed on the periphery of the SiC ingot.

Disclosed is a pressing jig for welding an electrode lead located in a lead slit formed at the bus bar to the bus bar in a closely adhered state. The pressing jig includes a first frame having a first distance adjusting unit and a first pressing unit, and a second frame having a second distance adjusting unit facing the first distance adjusting unit and a second pressing unit facing the first pressing unit. The first frame and the second frame are coupled so that a distance between first pressing unit and the second pressing unit is increased when a distance between the first distance adjusting unit and the second distance adjusting unit is decreased, and the distance between first pressing unit and the second pressing unit is decreased when the distance between the first distance adjusting unit and the second distance adjusting unit is increased.

A method and an apparatus for collecting powder samples in real-time in powder bed fusion additive manufacturing may involves an ingester system for in-process collection and characterizations of powder samples. The collection may be performed periodically and uses the results of characterizations for adjustments in the powder bed fusion process. The ingester system of the present disclosure is capable of packaging powder samples collected in real-time into storage containers serving a multitude purposes of audit, process adjustments or actions.

A system, a non-transitory computer readable medium for executing instructions, and a method for fabricating a subsea connector, including selecting a substrate on which to form the subsea connector, positioning the substrate on a welding positioner base, and applying a first weld bead using a first multiple axis robot, applying a second weld bead using a second multiple axis robot, forming a plurality of weld bead layers comprising the first weld bead and the second weld bead, and forming a subsea connector formed from the plurality of weld bead layers.