B23K2101/007

Semiconductor device and laser marking method

A semiconductor device that is a facedown mountable, chip-size-package type semiconductor device, the semiconductor device including: a semiconductor substrate; and a metal layer that is disposed on the semiconductor substrate and is exposed to outside. One or more marks are provided on an exposed surface of the metal layer. The one or more marks each include an outline portion defining an outline of the mark, and a central portion located inward of the outline portion. In a plan view of the exposed surface of the metal layer, the outline portion has a color different from at least one of a color of the central portion or a color of a base portion that is a portion of the exposed surface of the metal layer on which the one or more marks are not provided.

SEMICONDUCTOR DEVICE AND LASER MARKING METHOD
20250273588 · 2025-08-28 ·

A semiconductor device that is a facedown mountable, chip-size-package type semiconductor device, the semiconductor device including: a semiconductor substrate; and a metal layer that is disposed on the semiconductor substrate and is exposed to outside. One or more marks are provided on an exposed surface of the metal layer. The one or more marks each include an outline portion defining an outline of the mark, and a central portion located inward of the outline portion. In a plan view of the exposed surface of the metal layer, the outline portion has a color different from at least one of a color of the central portion or a color of a base portion that is a portion of the exposed surface of the metal layer on which the one or more marks are not provided.

LASER MARKING APPARATUSES AND A MARKER UNIT

The invention relates to means for marking the end closures of beverage and food containers using a laser beam, The aim of improving the quality of a laser marking by providing for optimal action of a laser beam on differently oriented regions to be marked is achieved in that the laser marker unit is equipped with a module for determining the orientation of a closure, said module being in the form of a computer vision camera, and the rejection unit contains a video camera with an image analyzer capable of sending a signal to reject a closure by pushing the rejected closure off a conveyor.