B23K2101/32

Welding System and Method

A welding system for welding a first elongated element and a second elongated element together by a laser beam that is emitted from a laser welding head after the ideal welding center point of the aligned first and second elongated elements has been positioned at a focal point of the laser beam that is emitted from the laser welding head.

Ultrasonic welding systems and methods of using the same

An ultrasonic welding system is provided. The ultrasonic welding system includes a support structure for supporting a workpiece. The ultrasonic welding system also includes a weld head assembly including an ultrasonic converter carrying a sonotrode. The ultrasonic welding system also includes a z-axis motion system carrying the weld head assembly. The z-axis motion system includes (i) a z-axis forcer for moving the weld head assembly along a z-axis of the ultrasonic welding system, and (ii) a z-axis overtravel mechanism disposed between the z-axis forcer and the weld head assembly.

Method And Device For Welding Wire Segment Pairs
20170310198 · 2017-10-26 · ·

A method for welding a plurality of wire segment pairs is disclosed. Each wire segment pair has two adjacent wire segments, and each adjacent wire segment has a contact region where the wire segment is to be welded to the respective other wire segment. The wire segment pairs are successively guided between two elements of a pressing unit, and at a weld moment in which at least one of the wire segment pairs is located between the two elements. The pressing unit exerts a pressing force onto the wire segment pair such that the contact regions of the wire segments are pressed against each other. At each weld moment, laser radiation is irradiated onto the wire segment pair to which the pressing unit is exerting the pressing force, and the laser radiation is irradiated onto a region in which the contact regions are pressed against each other.

Melt cutter
09796040 · 2017-10-24 ·

A melt cutter includes a case, an electricity-connecting portion, a heating device, a working portion, a control portion, and a heat-dissipating device. The case has a heat-dissipating zone. The electricity-connecting portion is disposed in the case for connecting with an electricity source. The working portion is disposed in the case and has a gap with changeable size for clamping an object. The control portion alternatively triggers the heating device to heat and to transmit heat to the working portion, and it also reduces the size of the gap for melting and cutting the object. The heat-dissipating device is disposed at the heat-dissipating zone and is electrically connected with the electricity-connecting portion. Thereby, the heat-dissipating device helps air communication between interior and exterior of the case.

METHOD OF CONNECTING A WIRE TO A FEEDTHROUGH

One aspect relates to a feedthrough system. The feedthrough system includes a feedthrough and a wire. At least a portion of the feedthrough is made of an insulator and at least one area forming an electrically conductive cermet pathway. The cermet pathway may include an electrically conductive metal. The wire may be at least partially connected to the cermet pathway so that the material of the wire forms a joint microstructure with the electrically conductive material in the cermet pathway.

METHODS FOR MANAGING THE SCATTERING OF INCIDENT LIGHT AND ARTICLES CREATED THEREFROM

The present disclosure provides engineered surfaces that exhibit reduced specular reflection and gloss while still providing a high intensity of reflected light at multiple incident angles. The structured metal surfaces include engineered topography that increases diffuse reflection, leading to a greater intensity of light perceived at multiple viewing angles. A viewer engaging such surfaces is likely to perceive a stronger ‘white’ reflection of the incident light and an improvement, particularly in orthodontic and other oral applications, of aesthetic appearance. Methods of creating the engineered surfaces and orthodontic articles incorporating the engineered surfaces are also disclosed.

REMOTE CONTROL FOR EXOTHERMIC REACTION MOLD
20170232551 · 2017-08-17 ·

A programmable exothermic reaction controller includes input/output control circuitry for inputting and outputting information to/from the controller, processing circuitry including user programmable parameters, wherein the parameters are programmable using the input/output control circuitry and an output connector connectable to an ignitor cable.

Solder alloy

A solder alloy has an alloy composition containing Zn of 3 through 25 mass %, Ti of 0.002 through 0.25 mass %, Al of 0.002 through 0.25 mass % and balance of Sn, a solder joint made of the solder alloy, and a jointing method using the solder alloy.

HAIRPIN WELDING METHOD AND APPARATUS
20210402518 · 2021-12-30 ·

A hairpin welding method welds wire ends of at least two copper wires, arranged flush next to one another, to one another by a laser beam. The laser beam is generated with a beam cross section that impinges on the wire ends at an end side and has a round core region and a ring region surrounding the round core region. A ratio of an external diameter of the ring region to a diameter of the core region is between 7:1 and 2:1. A ratio of a laser power in the core region to a laser power in the ring region is between 10:90 and 70:30.

Method for processing an ultra-high density space interconnect lead under light source guidance

A method for processing an ultra-high density interconnect wire under light source guidance, comprising preparing a photo-thermal response conductive paste, and putting it into an air pressure injector; driving the air pressure injector; the air pressure injector extrudes the photo-thermal response conductive paste, so that the photo-thermal response conductive paste is connected with the first chip to form an interconnection wire; stopping extruding the photo-thermal response conductive paste, and driving the air pressure injector to pull off the interconnection wire; a linear light source emits light and irradiates on the interconnection wire to bend to an upper side of a second chip bonding pad; an extrusion mechanism presses a free end of the interconnection wire on the second chip bonding pad; the first chip and the second chip are subjected to glue dripping encapsulation.