A wire bonding method includes bringing a capillary and a wire inserted through the capillary into pressure contact with a bonding point of a lead placed on an XY stage to bond the wire to the lead, including moving the XY stage in a state in which the capillary is in pressure contact with the lead to move the capillary along a movement locus including a plurality of arc portions.

A mold is used to form a solder joint to join the distal end of the guidewire to a wire coil. The mold has a cavity that can have different configurations so that the solder joint can be any of bullet shaped, micro-J shaped, cone shaped, truncated cone shaped, or have a textured surface.

A guide wire with improved joining strength is provided. The guide wire includes a first wire and a second wire are solid-phase-joined to each other, the first wire and the second wire are made of a Ni—Ti-based alloy. When a section of a crystal grain size is 1 μm in a number-based particle size distribution of crystal grains of a metallographic structure of a joint surface between the first wire and the second wire, the frequency of the crystal grains having a mode particle size is 25% or more and the frequency of the crystal grains having a crystal grain size with a representative diameter of (mode particle size (μm)−1 μm) or more and (mode particle size (μm)+1 μm) or less is 60% or more.

A core-wire exposed portion in an electric wire and at least one pair of pressure-welding pieces made of an electroconductive material are included. The core-wire exposed portion is a portion is which a core wire composed of a plurality of element wires is exposed. The pair of pressure-welding pieces are provided with a core wire pressure-welding section in which pressure-welding end surfaces are disposed facing each other at a distance and Kate the core-wire exposed portion press-fitted between the pressure-welding end surfaces. The core wire pressure-welding section is formed as a section that brings all of the element wires in the core-wire exposed portion, between the pressure-welding end surfaces, into contact with either of the pressure-welding end surfaces while being in an aligned state.

An ultrasonic welding system is provided. The ultrasonic welding system includes a support structure for supporting a workpiece. The ultrasonic welding system also includes a weld head assembly including an ultrasonic converter carrying a sonotrode. The ultrasonic welding system also includes a z-axis motion system carrying the weld head assembly. The z-axis motion system includes (i) a z-axis forcer for moving the weld head assembly along a z-axis of the ultrasonic welding system, and (ii) a z-axis overtravel mechanism disposed between the z-axis forcer and the weld head assembly.

A method for manufacturing a wiring system includes providing an electric cable having an electric conductor and a contact element with a termination portion, and removing a cable insulation in a first sub-portion of the electric cable. The cable insulation remains on the electric conductor in a second sub-portion of the electric cable offset from the first sub-portion. The electric conductor is welded at the first sub-portion to a termination surface of the termination portion. The first sub-portion is pressed against the termination portion and compressed during welding. A holding device encompasses the second sub-portion at least partially. The holding device supports the second sub-portion at least during the welding and compressing of the first sub-portion and maintains a position of the second sub-portion.

A mold is used to form a solder joint to join the distal end of the guidewire to a wire coil. The mold has a cavity that can have different configurations so that the solder joint can be any of bullet shaped, micro-J shaped, cone shaped, truncated cone shaped, or have a textured surface.

A clamping system for an ultrasonic welding apparatus configured to clamp a contact element in the ultrasonic welding apparatus is presented. The contact element has a flat elongate shape and a welding region, a clamping region, and a contacting region arranged along a longitudinal axis. The clamping system includes two clamping units mechanically connected to the ultrasonic welding apparatus which are arranged spaced apart from one another and are moveable toward one another. Each clamping unit defines a clamping finger which is movable to extend over the clamping region. Each clamping finger has a clamping face that is configured to press on a surface of the clamping region that is located opposite an anvil of the ultrasonic welding apparatus while in a clamped state.

A magnesium alloy is set forth, preferably for producing an, in particular wire-shaped or band-shaped, welding consumable for, in particular wire-based, laser deposition welding. The magnesium alloy consists of the following constituent substances with regard to the total weight of the alloy: 3.0% by weight to 9.0% by weight of aluminum (Al), 0.2% by weight to 2.0% by weight of calcium (Ca), 0.1% by weight to 0.8% by weight of manganese (Mn), 0.2% by weight to 2.0% by weight of aluminum nitride (AlN),
and magnesium and unavoidable, in particular production-related, contaminants as the rest.

A conductor connection device for joining a plurality of conductors with ultrasonic welding, the conductor connection device comprising: a horn including a contact surface that is brought into contact with the conductors, the horn being configured to be ultrasonically vibrated; a pair of restricting portions configured to be brought into contact with the contact surface and to be relatively movable along the contact surface; and an anvil that is relatively moved toward and away from the contact surface, the horn and the pair of restricting portions being moved relative to the anvil to sandwich the anvil between the pair of restricting portions facing each other, and at least one of the pair of restricting portions being moved toward the other.