Patent classifications
B23K2101/32
Process for Producing Tinned Copper Wires
Provided is a process for producing a tinned copper wire. The process comprises subjecting a copper wire sequentially to activation treatment, a first hot tinning treatment, a first cooling, a second hot tinning treatment, and a second cooling to obtain a tinned copper wire. The first hot tinning treatment is carried out at a first temperature and the second hot tinning treatment is carried out at a second temperature. The first temperature is higher than the second temperature. The first temperature is at least 38° C. higher than the melting point of tin. The second temperature is at least 8° C. higher than the melting point of tin.
Terminal connecting method
A terminal connecting method includes setting a conductor having a plurality of strands on an upper surface of a bottom portion of an electric wire crimping part of a terminal, caulking the conductor in a manner to cover the conductor, thereby crimping the conductor by a caulking portion extended from the bottom portion, and welding the plurality of strands together in a strands exposed portion of the conductor exposed from tip end edges of the caulking portion by friction between the plurality of strands and a friction tool, after caulking and crimping.
SECURED STRAND END DEVICES
Methods for securing strand ends of devices configured for insertion into an anatomical structure, and the resulting devices.
Binding machine and method for securing a part of a binding element in a loop around one or more objects
A binding machine comprising: —a feeding device for feeding a binding element (3) in the form of a wire or strap around one or more objects and subsequently retracting the binding element to draw it tightly around said objects; and —a laser welding device (12) for forming a welded joint between a first section at the leading end of the binding element and an adjoining second section at the trailing end of the part (3a) of the binding element fed around said objects to thereby secure this part of the binding element in a loop around the objects. The laser welding device directs a laser beam onto an area (30) at the trailing end of said second section in order to reduce the tensile strength of the binding element, wherein the feeding device retracts the binding element in order to subject this area to tensile stress and thereby cause the binding element to be broken off.
Wire for gas-shielded arc welding
A wire for gas-shielded arc welding includes, based on a total mass of the wire: C: 0.01 mass % or more and 0.10 mass % or less, Si: 0.05 mass % or more and 0.55 mass % or less, Mn: 1.60 mass % or more and 2.40 mass % or less, Ti: 0.05 mass % or more and 0.25 mass % or less, Cu: 0.01 mass % or more and 0.30 mass % or less, S: 0.001 mass % or more and 0.020 mass % or less, N: 0.0045 mass % or more and 0.0150 mass % or less, Al: 0.10 mass % or less, and P: 0.025 mass % or less, with the remainder being Fe and inevitable impurities. In the wire, the following relationship is satisfied: 0.1≤[Ti]/[Si]≤3.0, where [Si] is the content of Si (mass %) and [Ti] is the content of Ti (mass %).
SYSTEM AND METHOD FOR REMOVING A PROTECTIVE SHIELD FROM AN ELECTRICAL CABLE
A system and method for removing a protective shield from an electrical cable using an ablation process is disclosed. The circumference of the protective shield may not be perfectly circular. To compensate, a measurement, such as a distance measurement to a point on a surface of the electrical cable, is performed. Based on the distance measurement, the system performs a compensation operation, such as moving the lens in the laser system in order to compensate. Thereby, the focus of the laser radiation may be placed consistently at a predetermined position relative to the surface of the protective shield, thereby sufficiently ablating the protective shield without harming interior layers of the electrical cable. Further, the protective shield may be wrapped so that there is an overlap. To account for this, the protective shield on both sides of the ablated groove is held and twisted in order to shear along the groove.
DEVICE FOR WELDING ROD-SHAPED ELECTRICAL CONDUCTORS AND SONOTRODE FOR SUCH A DEVICE
The invention relates to a device for welding rod-shaped electrical conductors (28, 29) and to a sonotrode (16) for such a device, comprising a compression space for receiving two connection regions (26, 27) of the conductors (28, 29) to be connected, said connection regions (26, 27) extending in a first axial direction (x-axis), the compression space being defined by a working surface (19) of a sonotrode (16), which transmits ultrasonic vibrations, and a counterface of an anvil at two opposite sides in a second axial direction (z-axis) and by a boundary surface of a slider element, which is displaceable in the second axial direction (z-axis), and a boundary surface of a boundary element on two opposite sides in a third axial direction (y-axis). In a special contact zone (50), which is a section of the working surface (19) of the sonotrode (16) and serves to subject at least one connection region (26, 27) to ultrasonic vibrations, the working surface (19) has a surface configuration that differs from a contact zone (30) formed by the remaining working surface (19).
Welding assembly and method
A welding assembly including a current generator, a first electrode electrically coupled to the current generator, the first electrode including a first engagement surface, a second electrode electrically coupled to the current generator, the second electrode including a second engagement surface, a width-determining fixture positioned between the first electrode and the second electrode to define a welding volume having a width, and an electrically nonconductive material positioned to electrically insulate at least one of the first electrode and the second electrode from an electrical conductor outside the width.
Power-operated mold clamping system for exothermic reaction welding
A mold clamping system for exothermic reaction welding adapted to be power-operated by a power device, the combination comprising a first member adapted to support a first mold portion; a second member adapted to support a second mold portion; and a drive mechanism, adapted to be coupled to the power device, coupled to at least one of said first and second members and capable of moving the first and second members between a first position, in which the first and second mold portions are spaced apart, and a second position, in which the first and second mold portions are engaged, upon actuation of the power device in a first and a second direction, respectively.
Method of reducing photoelectron yield and/or secondary electron yield of a ceramic surface; corresponding apparatus and product
A method of reducing photoelectron yield (PEY) and/or secondary electron yield (SEY) of a ceramic surface comprises applying pulsed laser radiation comprising a series of laser pulses emitted by a laser (4) to the surface of a target (10) to produce a periodic arrangement of structures on the surface of the target (10).