B23K2101/36

SOLDER ALLOY, SOLDER PASTE, SOLDER BALL, SOLDER PREFORM, SOLDER JOINT, IN-VEHICLE ELECTRONIC CIRCUIT, ECU ELECTRONIC CIRCUIT, IN-VEHICLE ELECTRONIC CIRCUIT DEVICE AND ECU ELECTRONIC CIRCUIT DEVICE

A solder alloy comprises Ag: 3.1 to 4.0% by mass, Cu: 0.6 to 0.8% by mass, Bi: 1.5 to 5.5% by mass, Sb: 1.0 to 6.0% by mass, Co: 0.001 to 0.030% by mass, Fe: 0.02 to 0.05% by mass, and a balance Sn.

Moving unit for moving two soldering assemblies for processing circuits boards, and soldering system for selective wave soldering with a moving unit
20220355423 · 2022-11-10 · ·

Moving unit for moving two soldering assemblies connected by means of a coupling device, soldering system for selective wave soldering of circuit boards with such a moving unit, and associated method.

APPARATUS FOR MANUFACTURING DISPLAY DEVICE AND METHOD FOR MANUFACTURING DISPLAY DEVICE
20220355417 · 2022-11-10 ·

An apparatus for manufacturing a display device and a method for manufacturing a display device are provided. The apparatus includes a stage; a laser module disposed above the stage and configured to output a laser beam; a scanner configured to receive the laser beam output from the laser module and irradiate the laser beam onto the stage; and a controller configured to control the laser module to irradiate the laser beam to a processing position while moving both the scanner and the stage in a first direction according to the processing position and a shape of a processing pattern.

Ignition coil for internal combustion engine and production method for the same

An ignition coil includes a not-illustrated coil, a plate assembly, and a case assembly. The plate assembly and the case assembly are combined with each other by laser welding at a recess and a rib (projection) which are respective abutting portions, thereby forming storage spaces for storing the coil.

Flux and Solder Material
20230103270 · 2023-03-30 · ·

An iodine-containing cyclic compound including no carboxy group and including one ring skeleton or a plurality of ring skeletons forming a fused ring in one molecule, is provided. The ring of the ring skeleton includes only a carbon atom, or a carbon atom, and a nitrogen atom and/or an oxygen atom, and an iodine atom is bonded to at least one of the atoms constituting the ring of the ring skeleton.

LIQUID CRYSTAL DISPLAY PANEL AND DISPLAY DEVICE

The present disclosure provides a liquid crystal display panel and a display device. The liquid crystal display panel includes an array substrate. A hollow structure is defined in a common electrode layer. The hollow structure includes a first hollow structure corresponding to a display area. An area of the first hollow structure progressively increases along a direction from an array routing area to the display area, so that an area of the common electrode layer corresponding to the display area progressively decreases along the direction from the array routing area to the display area, thereby making RC loadings uniform and keeping charging rates in various areas same.

Bonding connector with fuse section and battery module with insulative P-group separator

An embodiment is directed to a contact plate configured to establish electrical bonds between battery cells in a battery module, including at least one primary conductive layer, and a set of bonding connectors that are configured to provide direct electrical bonds between the contact plate and terminals of a group of battery cells, the set of bonding connectors being configured to connect the group of battery cells in parallel with each other, wherein at least one bonding connector in the set of bonding connectors is configured with a higher fuse rating than each other bonding connector in the set of bonding connectors so as to contain arcs among the set of bonding connectors to the at least one bonding connector.

Component joining apparatus, component joining method and mounted structure

A component joining apparatus, which can realize positioning between a component and a substrate with high accuracy by avoiding influence of thermal expansion of the substrate at the time of joining the component to the substrate by heating at a high temperature, includes a component supply head holding a component and a heating stage heating and holding a substrate, in which a heating region where the heating stage contacts the substrate includes a joining region of the substrate in which the component is joined, and the substrate is larger than the heating stage and a peripheral part of the substrate does not contact the heating stage.

Laser processing device and laser processing method

A laser processing device and a laser processing method are provided. The laser processing device includes: at least two lasers each configured to generate a laser beam; focusing members corresponding to the at least two lasers respectively and configured to adjust focus positions of at least two laser beams generated by the at least two lasers; and a beam combination member configured to receive the at least two laser beams whose focus positions have been adjusted, and output the at least two laser beams coaxially.

Display panel and manufacturing method therefor, display device

A display panel includes a base, a plurality of conductive connectors disposed on the base, a plurality of leads arranged on the base along an edge of the display panel, and at least one groove located between the conductive connectors and the edge. One end of each lead is connected to a corresponding conductive connector, and another end thereof extends to the edge of the display panel. At least one lead is divided into at least two parts by the at least one groove, and a depth of the groove is greater than or equal to a thickness of the lead.