A laser welding method includes a pretreatment process and a welding process. At least one metal member of the plurality of metal members is formed from a metal-plated steel plate in which a base metal has been covered with a coating material that has a melting point lower than the base metal. In the pretreatment process, with the position of the first metal member in the in-plane direction fixed, processing is performed from the front surface of the first metal member to form on the back surface, a protrusion that bulges from the back surface. Then, in the welding process, the first metal member in which a protrusion has been formed is superposed on a second metal member with the protrusion therebetween while maintaining the position in the in-plane direction, and laser light is irradiated on the superposed region to weld the plurality of metal members to each other.

A welded blank assembly is formed by welding first and second sheet metal pieces together at a weld joint. At least one of the sheet metal pieces includes a boron steel or press hardenable steel base material layer and an aluminum-based coating material layer, along with a weld notch where at least a portion of the coating material layer is removed before welding. An additional material can be provided during welding to influence weld joint composition and/or a secondary heat source can be used to heat and flow a protective material in a weld region of the blank assembly. The weld notch has a width that may be related to the width of a heat-affected zone formed during welding.

The present invention disclosed a method of producing a three-dimensional porous tissue in-growth structure. The method includes the steps of depositing a first layer of metal powder and scanning the first layer of metal powder with a laser beam to form a portion of a plurality of predetermined unit cells. Depositing at least one additional layer of metal powder onto a previous layer and repeating the step of scanning a laser beam for at least one of the additional layers in order to continuing forming the predetermined unit cells. The method further includes continuing the depositing and scanning steps to form a medical implant.

A method for directly bonding a metal to a transparent substrate includes providing a substrate; placing a metal foil directly on a face of the substrate; irradiating a portion of the metal foil with a laser beam so that metal corresponding to the portion melts and bonds directly to the substrate and forms a metal pad; and pumping a gas above the portion to prevent oxidation of the melted metal.

A method for joining a modular hot gas component by welding and high-temperature soldering. In order to optimally join high-temperature components, a first component is plugged into pins of a second component, a soldering material is placed between the two components, and the pins of the second component are welded to the first component.

A composite member having an excellent heat resistance is provided. The composite member includes: a substrate composed of a composite material including a non-metal phase and a metal phase; and a metal layer that covers at least a portion of a surface of the substrate, wherein a metal included in each of the metal phase and the metal layer is mainly composed of Ag, and a ratio of a content of Cu to a total content of Ag and Cu in a boundary region of the metal layer with the substrate is less than or equal to 20 atomic %.

Hydrogen purification devices and their components are disclosed. In some embodiments, the devices may include at least one foil-microscreen assembly disposed between and secured to first and second end frames. The at least one foil-microscreen assembly may include at least one hydrogen-selective membrane and at least one microscreen structure including a non-porous planar sheet having a plurality of apertures forming a plurality of fluid passages. The planar sheet may include generally opposed planar surfaces configured to provide support to the permeate side. The plurality of fluid passages may extend between the opposed surfaces. The at least one hydrogen-selective membrane may be metallurgically bonded to the at least one microscreen structure. In some embodiments, the devices may include a permeate frame having at least one membrane support structure that spans at least a substantial portion of an open region and that is configured to support at least one foil-microscreen assembly.

A flux used for soldering with a tin-silver-copper alloy comprises an imidazole compound and/or an imidazoline compound; a dicarboxylic acid having 3 or more and 36 or less carbons; and a quaternary ammonium iodine salt. Relative to the total amount of the flux, the dicarboxylic acid content is 6 mass % or more and 25 mass % or less, and the iodine content is 200 ppm or more and 3600 ppm or less.

The present invention relates to a flux-cored wire which can be used for straight-polarity gas-shielded arc welding, wherein a flux contains one or several types of metal compound powders and, when one or several metal elements constituting the metal compound powders are formed into stable compounds under a high-temperature environment, the relationship between the weighted geometric mean value (Φ) of the work functions of the stable compounds and the wire diameter (D) of the flux-cored wire satisfies the following formula: {1.00≤Φ≤−0.0908D.sup.2+0.5473D+1.547}.

Apparatus and method for tool mark free stich bonding. In some embodiments, a method for wire bonding can include feeding a wire through a capillary tip and attaching a first end of the wire to a first location, thereby forming a ball bond. The method can further include moving the capillary tip towards a second location while the wire feeds out of the capillary tip. The method can further include attaching a second end of the wire to the second location while preventing contact between the capillary tip and the second location, thereby forming a stitch bond without a tool mark at the second location.