Embodiments of the present disclosure include method for sequentially mounting multiple semiconductor devices onto a substrate having a composite metal structure on both the semiconductor devices and the substrate for improved process tolerance and reduced device distances without thermal interference. The mounting process causes “selective” intermixing between the metal layers on the devices and the substrate and increases the melting point of the resulting alloy materials.

A soldering material (1) for active soldering, in particular for active soldering of a metallization (3) to a carrier layer (2) comprising ceramics, wherein the soldering material comprises copper and is substantially silver-free.

The disclosure describes example techniques and assemblies for joining a first component and a second component. The techniques may include positioning the first and second component adjacent to each other to define a joint region between adjacent portions of the first component and the second component, the joint region being coated with an adhesion resistant coating. The techniques may also include positioning a braze material in the joint region, heating the braze material to form an at least softened material, and cooling the at least softened material to form a mechanical interlock including the braze material in the joint region joining the first and second components. The braze material does not metallurgically bond to the joint surface.

A process for a producing crude solder product and a copper product includes the steps of providing a black copper comprising >=50% wt of copper together with >=1.0% wt of tin and/or >=1.0% wt of lead, and refining a first portion of the black copper to obtain a refined copper product together with at least one copper refining slag. The process further includes the steps of recovering a first crude solder product from the copper refining slag, thereby forming a solder refining slag in equilibrium with the first crude solder product, and contacting a different portion of the black copper with the solder refining slag thereby forming a spent slag and a lead-tin based metal, followed by separating the spent slag from the lead-tin based metal.

Some implementations of the disclosure relate to a lead-free solder paste with mixed solder powders that is particularly suitable for high temperature soldering applications involving multiple board-level reflow operations. In one implementation, the solder paste consists of 10 wt % to 90 wt % of a first solder alloy powder, the first solder alloy powder consisting of an SnSbCuAg solder alloy that has a wt % ratio of Sn:Sb of 0.75 to 1.1; 10 wt % to 90 wt % of a second solder alloy powder, the second solder alloy powder consisting of an Sn solder alloy including at least 80 wt % of Sn; and a remainder of flux.

Hydrogen purification devices and their components are disclosed. In some embodiments, the devices may include at least one foil-microscreen assembly disposed between and secured to first and second end frames. The at least one foil-microscreen assembly may include at least one hydrogen-selective membrane and at least one microscreen structure including a non-porous planar sheet having a plurality of apertures forming a plurality of fluid passages. The planar sheet may include generally opposed planar surfaces configured to provide support to the permeate side. The plurality of fluid passages may extend between the opposed surfaces. The at least one hydrogen-selective membrane may be metallurgically bonded to the at least one microscreen structure.

The invention relates to a device and a method for changing the welding direction of the welding shoulder of a system for a friction stir welding process virtually without delay when required by the geometric arrangement of the joint partners to be welded or by a material unevenness, having the following method features: a) a main part (1) with a horizontally movable bridge support (5) has a friction welding head (12) which can be vertically adjusted together therewith and which has a pin receiving area (13) for mounting and driving a welding pin tip (14), wherein the welding shoulder (18) has a welding shoulder receiving area (17) which is supported at multiple points, and b) the welding shoulder receiving area (17) can be adjusted to any angle of attack relative to the joint partners by means of different push-pull rods (16) during the welding process.

A method for making a cold plate includes the steps of positioning a finstock structure in a cavity of a substrate; and applying a cover to the finstock structure and substrate, wherein the applying step comprises ultrasonically additive manufacturing the cover to the substrate and the finstock structure, whereby the cover joins with the substrate and the finstock structure. The resulting cold plate assembly includes a substrate having a cavity, a finstock structure within the cavity, and a cover closing the finstock structure within the cavity, the cover being integrally joined to the substrate and to the finstock structure.

A method of joining a first metal and a second metal is described. The first metal comprises Pb in an amount of at least 50 wt. % by weight of the first metal. The method comprises fusing the first metal and the second metal using non-consumable electrode arc welding.

A method for forming a three-dimensional article through successive fusion of parts of a metal powder bed is provided, comprising the steps of: distributing a first metal powder layer on a work table inside a build chamber, directing at least one high energy beam from at least one high energy beam source over the work table causing the first metal powder layer to fuse in selected locations, distributing a second metal powder layer on the work table, directing at least one high energy beam over the work table causing the second metal powder layer to fuse in selected locations, introducing a first supplementary gas into the build chamber, which first supplementary gas comprising hydrogen, is capable of reacting chemically with or being absorbed by a finished three-dimensional article, and releasing a predefined concentration of the gas which had reacted chemically with or being absorbed by the finished three dimensional article.