B23K2103/08

Acupuncture needle packaging method and acupuncture needle
11484468 · 2022-11-01 ·

A method of acupuncture needle packaging includes inserting an acupuncture needle body of an acupuncture needle including an acupuncture needle handle at an upper portion thereof into an acupuncture needle tube starting from the acupuncture needle handle; disposing the acupuncture needle in the acupuncture needle tube in a state in which the upper portion of the acupuncture needle handle is exposed to an exterior of the acupuncture needle tube; ascending the upper portion of the acupuncture needle handle exposed to the exterior using a pressing jig; irradiating a laser to an area where the acupuncture needle tube and the acupuncture needle handle abut each other; and coupling the acupuncture needle handle and the acupuncture needle tube by thermally deforming the area where the acupuncture needle tube and the acupuncture needle handle abut each other with a heat generated by the laser.

Method of laser beam localized-coating

The present invention relates generally to laser welding in the manufacture of sheet metal components, such as for example automobile components. More particularly, the present invention relates to a process and a system for forming a localized anti-corrosion surface layer along a laser welded joint (weld bead), subsequent to the laser welding together of sheet metal plates having an anti-corrosion surface layer pre-coat.

BALANCE ADJUSTMENT METHOD FOR ROTOR AND TURBOCHARGER

A balance adjustment method for a rotor includes an imbalance acquisition step of acquiring imbalance position and amount of the rotor after a first balance correction step of correcting balance of the rotor by cutting a compressor wheel side, an excision target section determination step of determining, based on the imbalance position and amount of the rotor, an excision target range including an imbalance correction position of the turbine wheel and a removal amount in the excision target range, and a second balance correction step of correcting the balance of the rotor by repeatedly irradiating the excision target range determined in the excision target section determination step with laser light from a laser marker device to remove by the removal amount from the turbine wheel.

Method of manufacturing semiconductor devices, corresponding apparatus and semiconductor device
11610849 · 2023-03-21 · ·

A leadframe has a die pad area and an outer layer of a first metal having a first oxidation potential. The leadframe is placed in contact with a solution containing a second metal having a second oxidation potential, the second oxidation potential being more negative than the first oxidation potential. Radiation energy is then applied to the die pad area of the leadframe contacted with the solution to cause a local increase in temperature of the leadframe. As a result of the temperature increase, a layer of said second metal is selectively provided at the die pad area of the leadframe by a galvanic displacement reaction. An oxidation of the outer layer of the leadframe is then performed to provide an enhancing layer which counters device package delamination.

WIRE BONDING TOOL

A wire bonding tool includes a tool body with a tubular cavity extending through the tool body and a distal end. The distal end includes a flared opening at an end of the tubular cavity. The tool body further includes at least one protrusion at a level of the distal end.

COMPONENT WITH STRUCTURED PANEL(S) AND METHODS FOR FORMING THE COMPONENT
20230079677 · 2023-03-16 ·

A manufacturing method is provided during which a plurality of first apertures are formed in a first plate to provide an apertured first plate. The apertured first plate is configured from or otherwise includes first plate metal. A first sheet is bonded to the apertured first plate to form a first grid structure. The first apertures extend through the apertured first plate to the first sheet. The first sheet is configured from or otherwise includes first sheet metal.

Solder paste

Provided is a solder paste which uses a conventional flux, and for which long-term preservation is made possible and an easy preservation method can be realized by suppressing changes in the viscosity of the paste over time. This solder paste is provided with a solder powder, a zirconium oxide powder, and a flux, and changes in the viscosity of the paste over time are suppressed.

Debris-free laser ablation processing assisted by condensed frost layer

Laser ablation processing method for debris-free and efficient removal of materials comprises the step of using a refrigeration device to condense the water vapor and form a thin frost layer on the materials at temperatures below the freezing point. The residual debris produced during the ablation process deposits on the frost layer that covers the material, which is easily removed when the frost layer melts. At the same time, the frost layer in the laser irradiation area melts to a liquid layer, which can effectively reduce the deposition of debris on the inner wall of the groove and thus improve the efficiency and quality of laser ablation. The method is applicable to debris-free laser processing on an arbitrary curved surface.

FABRICATION OF METALLIC PARTS BY ADDITIVE MANUFACTURING
20230121858 · 2023-04-20 ·

In various embodiments, wire composed at least partially of arc-melted refractory metal material is utilized to fabricate three-dimensional parts by additive manufacturing.

SYSTEM AND APPARATUS FOR SEQUENTIAL TRANSIENT LIQUID PHASE BONDING

Embodiments of the present disclosure include method for sequentially mounting multiple semiconductor devices onto a substrate having a composite metal structure on both the semiconductor devices and the substrate for improved process tolerance and reduced device distances without thermal interference. The mounting process causes “selective” intermixing between the metal layers on the devices and the substrate and increases the melting point of the resulting alloy materials.