Patent classifications
B23K2103/16
Erosion resistant hard composite materials
A hard composite composition may comprise a binder and a polymodal blend of matrix powder. The polymodal blend of matrix powder may have at least one first local maxima at a particle size of about 0.5 nm to about 30 m, at least one second local maxima at a particle size of about 200 m to about 10 mm, and at least one local minima between a particle size of about 30 m to about 200 m that has a value that is less than the first local maxima.
3D-PRINTED (LATTICE STRUCTURED) METAL - PLASTIC MATRIX COMPOUND MATERIAL
The present disclosure relates to a method of producing a compound material comprising at least one metal and at least one polymer, a compound material comprising at least one metal and at least one polymer, comprising a 3D-lattice of the at least one metal and a polymer introduced into the 3D-lattice, a component for a vehicle comprising the compound material and a vehicle comprising the component.
METHOD FOR STRUCTURING A SUBSTRATE SURFACE
A method for generating a structured surface on a substrate includes analyzing a substrate surface of the substrate and selecting, as a function of a condition of the substrate surface, method parameters including focus diameter, pulse peak power, pulse energy, point spacing, pulse length, pulse spacing and/or pulse sequence. The method further includes generating, by partial ablation and partial deposition via treatment with an intensive pulsed laser beam, surface structures having dimensions in the sub-micrometer range such that a multi-scale surface structure in the sub-micrometer and micrometer range adapted to intrinsically inhomogeneous properties of the substrate surface in the sub-micrometer range is generated. The substrate is an inhomogeneous substrate.
Method of producing insulating three-dimensional (3D) structures using 3D printing
A method of manufacturing a highly insulating three-dimensional (3D) structure is provided. The method includes depositing a first layer of hollow microspheres onto a base. The hollow microspheres have a metallic coating formed thereon. A laser beam is scanned over the hollow microspheres so as to sinter the metallic coating of the hollow microspheres at predetermined locations. At least one layer of the hollow microspheres is deposited onto the first layer. Scanning by the laser beam is repeated for each successive layer until a predetermined 3D structure is constructed. The 3D structure includes a composite thermal barrier coating (TBC), which may be applied to a surface of components within an internal combustion engine, and the like. The composite TBC is bonded to the components of the engine to provide low thermal conductivity and low heat capacity insulation that is sealed against combustion gasses.
METHOD AND DEVICE FOR ETCHING PATTERNS INSIDE OBJECTS
Systems and methods for etching complex patterns on an interior surface of a hollow object are disclosed. A method generally includes positioning a laser system within the hollow object with a focal point of the laser focused on the interior surface, and operating the laser system to form the complex pattern on the interior surface. Motion of the laser system and the hollow object is controlled by a motion control system configured to provide rotation and/or translation about a longitudinal axis of one or both of the hollow object and the laser system based on the complex pattern, and change a positional relationship between a reflector and a focusing lens of the laser system to accommodate a change in distance between the reflector and the interior surface of the hollow object.
Mounting assembly
A mounting assembly for a spot-joining apparatus comprises a first support arm (24). The first support arm (24) has a mounting surface (26), and receiving portion configured to receive an actuator or an anvil. The mounting assembly also comprises an alignment bracket (28) configured to engage with the actuator or anvil. The alignment bracket (28) is movable between a plurality of locations on the mounting surface (26) of the first support arm (24). The mounting assembly further comprises a clamp assembly (52, 29, 66a, 66b, 70, 70b or 52, 29, 88, 92, 98, 90, 96) configured to secure the alignment bracket (28) in any of the plurality of locations.
Thin electronic package elements using laser spallation
Discussed generally herein are methods and devices for flexible fabrics or that otherwise include thin traces. A device can include a flexible polyimide material, and a first plurality of traces on the flexible polyimide material, wherein the first plurality of traces are patterned on the flexible polyimide material using laser spallation.
Bone replacement materials
Particular aspects provide novel devices for bone tissue engineering, comprising a metal or metal-based composite member/material comprising an interior macroporous structure in which porosity may vary from 0-90% (v), the member comprising a surface region having a surface pore size, porosity, and composition designed to encourage cell growth and adhesion thereon, to provide a device suitable for bone tissue engineering in a recipient subject. In certain aspects, the device further comprises a gradient of pore size, porosity, and material composition extending from the surface region throughout the interior of the device, wherein the gradient transition is continuous, discontinuous or seamless and the growth of cells extending from the surface region inward is promoted.
INDUCTION WELDING PROCESS FOR WELDING TWO PARTS USING AT LEAST ONE SUSCEPTOR COMPRISING DISCONTINUOUS CONDUCTIVE ELEMENTS, AND ASSEMBLY OF AT LEAST TWO PARTS OBTAINED USING SAID INDUCTION WELDING PROCESS
Induction welding process for welding two parts using at least one susceptor including discontinuous conductive elements, and assembly of at least two parts obtained using the induction welding process. An induction welding process can join at least first and second parts, and the process can include a step of positioning at least one susceptor, including discontinuous conductive elements, between the first and second contact faces of the first and second parts, and steps of holding the first and second parts pressed against each other and of producing an electromagnetic field to generate an induced current that engenders heating of the susceptor. An assembly of two parts can be obtained using the process.
Metal cored solder decal structure and process
A system of producing metal cored solder structures on a substrate includes: a decal, a carrier, and receiving elements. The decal includes one or more apertures each of which is tapered from a top surface to a bottom surface thereof. The carrier is positioned beneath the bottom of the decal and includes cavities in a top surface. The cavities are located in alignment with the apertures of the decal. The decal is positioned on the carrier having the decal bottom surface in contact with the carrier top surface to form feature cavities defined by the decal apertures and the carrier cavities. The feature cavities are shaped to receive one or more metal elements and are configured for receiving molten solder cooled in the cavities. The decal is separable from the carrier to partially expose metal core solder contacts. The receiving elements receive the metal core solder contacts thereon.