B23K2103/18

FRICTION HEAD AND FRICTION ADDITIVE MANUFACTURING METHOD OF ADJUSTING COMPONENTS AND SYNCHRONOUSLY FEEDING MATERIAL

A friction head and a friction additive manufacturing method of adjusting components and synchronously feeding material are provided. The friction head includes a friction body, a charging part and a feeding part. An axis of the friction body, an axis of the charging part and an axis of the feeding part are coincided with one another. The charging part and the feeding part are sleeved on the friction body. Spiral groove(s) extending in a same direction is formed in an inner ring wall of the feeding part. The spiral groove(s) extends through the inner ring wall of the feeding part and is symmetrical about the axis of the feeding part. The spiral groove(s) and a lower outer surface of the feeding part form spiral feeding channel(s). An upper end of each feeding channel is communicated with a corresponding one of feeding hole(s).

Method for brazing titanium alloy components with zirconia-based ceramic components for horology or jewellery
11498879 · 2022-11-15 · ·

A method for brazing a first ceramic component and a second metal alloy component, to make a structural or external timepiece element, a zirconia-based ceramic is chosen for the first component and a titanium alloy for the second component, a first recess is made inside the first component, set back from a first surface in a junction area with a second surface of the second component, braze material is deposited on this first surface and inside each recess, the second surface is positioned in alignment with the first surface to form an assembly, this assembly is heated in a controlled atmosphere to above the melting temperature of the braze material, in order to form the braze in the junction area.

WELD-BRAZING TECHNIQUES
20230050740 · 2023-02-16 ·

A method includes positioning a braze material along a defect of a component of a turbine system, positioning a cover over the braze material, and focusing a heat source on the cover to melt the braze material along the defect.

Hollow welding pin for assembling two different materials.
20220355409 · 2022-11-10 ·

A method for assembling a sheet (40) and an iron-based metal part (80) comprising a step of fitting a tubular pin (10) which is open at both ends by punching through the sheet (40) with a shank of the pin with the pin being retained (10) by the sheet, wherein a pad is detached from the first sheet (40), and a flange of the pin abuts against the surface of the sheet (40) once the through-punching has been carried out, and the elastic returns of the shank of the pin (10) and the sheet (40) compress the outer surface of the shank, or by overmoulding the pin in the sheet, and subsequently a step of welding a metal tube of the pin (10) to the iron-based metal part (80) by bringing a flee end (24) of the metal tube into contact with the surface of the iron-based metal part (80) by means of electric resistance welding (90).

COPPER/CERAMIC ASSEMBLY, INSULATED CIRCUIT BOARD, METHOD FOR PRODUCING COPPER/CERAMIC ASSEMBLY, AND METHOD FOR PRODUCING INSULATED CIRCUIT BOARD
20220359340 · 2022-11-10 · ·

A copper/ceramic bonded body includes: a copper member (12) made of copper or a copper alloy; and a ceramic member (11) made of nitrogen-containing ceramics, the copper member (12) and the ceramic member (11) being bonded to each other, in which a Mg solid solution layer in which Mg is solid-soluted in a Cu matrix is formed at a bonding interface between the copper member (12) and the ceramic member (11), an active metal nitride layer (41) containing a nitride of one or more active metals selected from Ti, Zr, Nb, and Hf is formed on a ceramic member (11) side, and a thickness of the active metal nitride layer (41) is set to be in a range of 0.05 μm or more and 1.2 μm or less.

Devices and Methods for Performing Shear-Assisted Extrusion and Extrusion Processes

The present disclosure provides methods for preparing an extruded product from a solid billet. The methods can include providing an as-cast billet for extrusion; applying a simultaneous rotational shear and axial extrusion force to the as-cast billet to plasticize the as-cast billet; and extruding the plasticized as-cast billet with an extrusion die to form an extruded product. Methods for preparing extruded products from billets can also include: providing a billet for extrusion; while maintaining a majority of the billet below 100° C., applying a simultaneous rotational shear and axial extrusion force to one end of the billet to plasticize the one end of the billet; and extruding the plasticized one end of the billet with an extrusion die to form an extruded product. Methods for preparing an extruded product from a billet can also include providing a billet for extrusion; applying a simultaneous rotational shear and axial extrusion force to the billet to plasticize the billet; extruding the plasticized billet with an extrusion die to form an extruded product; and artificially aging the extruded product for less than the ASTM recommended amount of time.

Room temperature glass-to-glass, glass-to-plastic and glass-to-ceramic/semiconductor bonding

A process for room temperature substrate bonding employs a first substrate substantially transparent to a laser wavelength is selected. A second substrate for mating at an interface with the first substrate is then selected. A transmissivity change at the interface is created and the first and second substrates are mated at the interface. The first substrate is then irradiated with a laser of the transparency wavelength substantially focused at the interface and a localized high temperature at the interface from energy supplied by the laser is created. The first and second substrates immediately adjacent the interface are softened with diffusion across the interface to fuse the substrates.

Component joining apparatus, component joining method and mounted structure

A component joining apparatus, which can realize positioning between a component and a substrate with high accuracy by avoiding influence of thermal expansion of the substrate at the time of joining the component to the substrate by heating at a high temperature, includes a component supply head holding a component and a heating stage heating and holding a substrate, in which a heating region where the heating stage contacts the substrate includes a joining region of the substrate in which the component is joined, and the substrate is larger than the heating stage and a peripheral part of the substrate does not contact the heating stage.

BONDED BODY AND METHOD FOR MANUFACTURING BONDED BODY
20230099179 · 2023-03-30 · ·

A bonded body is a bonded body in which a first metal member is bonded to a second metal member, where the first metal member is formed of a material having a hardness higher than that of the second metal member. The bonded body has a structure in which the second metal member is inserted into a protruded and recessed portion formed on a bonding surface of the first metal member, and the bonded body has a region in which the first metal member is in direct contact with the second metal member, and a gap between the first metal member and the second metal member is filled with a resin material.

Manufacturing method for printed circuit board and laser processing machine

A manufacturing method for a printed circuit board includes: passing a first laser beam output from a laser output device through a first aperture so as to define an outer diameter of the first laser beam, positioning the first laser beam by an optical axis positioning device including a galvano device and an fθ lens, and irradiating the printed circuit board with the first laser beam such that a through-hole is formed in a copper layer; and passing a second laser beam output from the laser output device through a second aperture so as to define an outer diameter of the second laser beam whereby a diameter of the second aperture is smaller than a diameter of the first aperture, positioning the second laser beam by the optical axis positioning device, and irradiating the printed circuit board with the second laser beam such that an insulating layer is processed.