Patent classifications
B23K2103/30
Hinge lid container with lid flap
A hinge lid container (10) for consumer articles comprises a box (12) and a hinge lid (14) connected to the box along a hinge line and pivotable about the hinge line between a closed position and an open position. The hinge lid comprises a first lid wall (16) and a lid flap (18) depending from the first lid wall along an edge fold line, the lid flap being folded inward towards the inner surface of the first lid wall. The container is at least partially formed from a blank having a thickness (T), the laminar blank defining an edge fold portion of the container connecting the first lid wall and the lid flap. The inner surface of the edge fold portion defines an ablation area (A) having a length in the longitudinal direction of the edge fold portion and a width (W) extending transversely to said length.
Methods and systems for cutting or perforating a web with a laser
Methods and systems for cutting or perforating webs are disclosed. A method of cutting or perforating a web can include providing a web including a film. The film can include a polyolefin polymer and a plurality of particles. The film can include a width and length defining a surface. The method can further include stretching the film to provide a stretched film. Stretching the film can provide a plurality of voids in the stretched film. The method can additionally include providing a laser assembly. The method can include directing abeam of light from the laser assembly upon the surface of the web to cut or perforate the web in at least one location.
PACKAGING FILM HAVING UNIQUE DIRECT FOOD CONTACT IDENTIFIERS
Method for producing a packaging film strip for providing a number of individual packaging film parts for packing food or beverages, wherein the packaging film contains for each designated individual packaging film part an area having a printed two-dimensional code as unique packaging or product identifier. The process comprises the steps of providing at least one first substrate film strip (10, 25), applying on one side of said at least one first substrate film strip (10, 25) an artwork printing (20) for each individual packaging film part, depositing a DFC ink area (28) for each individual packaging film part onto the surface of the substrate film strip (10, 12) lying opposite to the artwork printing (20), slitting the packaging film to provide a series of individual packaging film parts running along the longside of the packaging film, ablating the individual DFC ink areas (28) by a computer-controlled laser beam (8) for providing a predetermined and individual code (2, 3, 30) as unique packaging or product identifier, cleaning the surface of the film strip comprising the individual codes (2, 3, 30), and checking the quality of the codes (2, 3, 30).
LASER ETCHING APPARATUS AND A METHOD OF LASER ETCHING USING THE SAME
A laser etching apparatus includes a chamber, a laser port, a laser emitter, a particle grabber, and a revolving window module. The chamber is configured to receive a substrate. The laser port is disposed below the chamber in a downward direction. The laser emitter is configured to emit a laser to the substrate disposed within the chamber through the laser port. The particle grabber is disposed within the chamber and includes a body disposed over the laser port. An opening is formed through the body. The opening is configured to pass the laser therethrough. The revolving window module includes a revolving window and a driving part configured to drive the revolving window. The revolving window is disposed between the particle grabber and the laser port.
Device and process for marking an ophthalmic lens with a pulsed laser of wavelength and energy selected per pulse
A device for marking an ophthalmic lens (3), the lens (3) being made of at least one preset material, includes a laser (1) configured to produce permanent engravings on the lens (3) and configured to emit a focused beam of pulsed ultraviolet laser radiation that includes at least one radiation wavelength ranging between 200 nm and 300 nm, has a pulse length ranging between about 0.1 ns and about 5 ns, and has an energy per pulse ranging between about 5 μJ and about 100 μJ. A laser marking process configured to produce permanent engravings on an ophthalmic lens (3) via this device is also described.
Laser etching apparatus and a method of laser etching using the same
A laser etching apparatus includes a chamber, a laser port, a laser emitter, a particle grabber, and a revolving window module. The chamber is configured to receive a substrate. The laser port is disposed below the chamber in a downward direction. The laser emitter is configured to emit a laser to the substrate disposed within the chamber through the laser port. The particle grabber is disposed within the chamber and includes a body disposed over the laser port. An opening is formed through the body. The opening is configured to pass the laser therethrough. The revolving window module includes a revolving window and a driving part configured to drive the revolving window. The revolving window is disposed between the particle grabber and the laser port.
ULTRASONIC-ASSISTED SOLDER TRANSFER
Apparatus and methods are disclosed for transferring solder to a substrate. A substrate belt moves one or more substrates in a belt direction. A decal has one or more through holes in a hole pattern that hold solder. Each of the solder holes can align with respective locations on one of the substrates. An ultrasonic head produces an ultrasonic vibration in the solder in a longitudinal direction perpendicular to the belt direction. The ultrasonic head and substrate can be moved together in the longitudinal direction to maintain the ultrasonic head in contact with the solder while the ultrasonic head applies the ultrasonic vibration. Various methods are disclosed including methods of transferring the solder with or without external heating.
Fusible Metal Clay, Structures Formed Therefrom, and Associated Methods
Structures for a tool surface of a downhole tool are constructed from a metal clay molded in a wet state. The wet state clay is a workable combination that can have a braze alloy grain, a tungsten carbide grain, and a binder. Additional cutting inserts can be embedded in the molded clay. Heat treatment applied to the molded metal clay causing the binder to be combusted and consumed. The braze alloy melts and then cools into a fused state with the tungsten carbide grain therein. The structure can affix to the tool surface of the tool by first being fused and then attached by brazing to the tool. Alternatively, the structure can be positioned in a fusible state adjacent the tool surface. When the heat treatment is applied, the structure fuses together and forms a metallurgical bond with the tool surface of the tool.
HIGH FREQUENCY WELDING FOR HEADGEAR
Welded headgear sections can be produced by using a weld tool having pins protruding from a weld region contact surface to deliver high-frequency electromagnetic energy to a weld region defined by overlapping top and bottom headgear straps. The pins fully penetrate the top strap and at least partially penetrate the bottom strap. The pins concentrate the electromagnetic energy to achieve a weld joint of acceptable weld strength and aesthetic appeal.
Flux and solder paste
It is an object of the present invention to provide a flux containing flux components homogeneously dispersed without precipitation of aggregates in addition to having an appropriate balance between fluidity and shape retention property, and a solder paste. A flux comprising 0.5 to 3.5 mass % of a sorbitol-type thixotropic agent selected from the group consisting of dibenzylidene sorbitol, bis(4-methylbenzylidene)sorbitol and a combination thereof, and 2 to 350 mass ppm of a sorbitol-type additive selected from the group consisting of sorbitol, monobenzylidene sorbitol, mono(4-methylbenzylidene)sorbitol and a combination thereof, and a glycol ether-type solvent.