There is provided a laser light irradiating device that includes a spatial light modulator configured to modulate laser light output from a laser light source according to a phase pattern and emit the modulated laser light, an objective lens configured to converge the laser light emitted from the spatial light modulator onto the object, a focusing lens arranged between the spatial light modulator and the objective lens in an optical path of the laser light and configured to focus the laser light, and a slit member arranged at a focal position on a rear side of the focusing lens in the optical path of the laser light and configured to block a part of the laser light.

The disclosure provides, in part a seal system for sealing a film. The disclosure further provides, in part, a sealed film comprising a first and a second substrate; a first and a second electrode disposed on the surface of at least one of the substrates; a switching material disposed between the first and second substrates; a first seal and a second seal; the first seal disposed along an edge of the switching material, separating the switching material from the second seal.

A device chip manufacturing method includes attaching a wafer to the first surface of a semiconductor ingot, separating the semiconductor ingot into a subject part and a remaining part after attachment, the subject part being attached to the wafer to form a laminated wafer having a front side as an exposed surface of the subject part and a back side as an exposed surface of the wafer, setting a plurality of crossing division lines on the front side of the laminated wafer to thereby define a plurality of separate regions after separation, and next forming a plurality of devices in the respective separate regions, and then dividing the laminated wafer along the division lines after forming the devices, thereby forming the plural device chips including the respective devices.

A method and apparatus for using a laser to form and release an element of an actuator. The method comprising forming an actuator from sheet stock using a laser, where the actuator is three dimensional; and releasing an element of the actuator from the sheet stock using the laser.

A method for manufacturing a cutting tool includes: the cutting tool comprising a tool body made of a sintered alloy, a hard coating which is disposed on an outer surface of the tool body and has at least a layer formed of any of a carbide, a nitride, and a carbonitride, or a composite compound thereof, and a cutting edge which is formed at a ridge portion of the tool body and includes a portion of the hard coating located at the ridge portion, a laser peening step of directly irradiating the hard coating with a pulsed laser having a pulse width of 100 ps or less to apply compressive residual stress to the hard coating and a surface region of the tool body.

A device for modifying a region of a substrate includes a laser radiation source for pulsed laser radiation. A transmissive medium having a higher intensity-dependent refraction index than air is arranged between a laser machining head and the substrate such that an individual pulse of the pulsed laser radiation from the laser machining head is deflected through the transmissive medium and across a thickness of the substrate from an original focal depth to a focal depth different from the original focal depth to modify the substrate along a beam axis of the laser radiation in a region of a recess or through-opening to be formed in the substrate without removing an amount of the substrate material necessary to form the recess or through-opening. A length between the focal depths is greater than and extends across the thickness of the substrate.

An asset verification system, comprising: a reader comprising a holder configured to hold an asset in a tag-reading position, a light source consisting of at least one light to provide illumination to the asset, magnifying optics configured with an effective magnification for both sufficiently separating dots in a tag in the body of the asset and viewing the tag at an effective magnification greater than 10×, reflective optics for conveying an image of the tag through the reader, and, position controls for adjusting the positioning of the asset with respect to the magnifying optics; a multi-function hardware device comprising an optical sensor for reading the tag of the asset projected to the optical sensor by the reader; and, a database having information related to the asset including an association of the tag to the asset stored thereon.

Disclosed is a way of providing a surface processing method for concrete in which vitrifying is suppressed even when high-speed processing is performed. In a surface processing method of concrete, a surface of the concrete is irradiated with a laser beam so that a beam spot is scanned along a predetermined scanning pattern and the scanning pattern moves along the surface at a predetermined feed speed. When the beam spot repeatedly passes through a predetermined portion in the scanning pattern, an overlap ratio, which is a ratio of overlapping of a passage path of the beam spot over a passage path of the beam spot in an immediately preceding irradiation, is 90% or less.

The laser machining device includes an observation image acquiring unit configured to repeatedly acquire an observation image of a machining spot of laser light emitted from a laser optical system to a street on a wafer while a machined groove is being formed, a luminance detector configured to detect a luminance of a plasma generated at the machining spot by emission of the laser light based on the observation image every time the observation image acquiring unit acquires the observation image, a correspondence information obtaining unit configured to obtain correspondence information indicating a correspondence relationship among the luminance, energy of the laser light and a machined state of the machined groove, and a machined state assessing unit configured to assess the machined state with reference to the correspondence information based on the luminance and known energy of the laser light every time the luminance detector detects the luminance.

The present disclosure provides a stealth dicing method and apparatus. With the method, the focusing element focuses the laser beam on the surface of material to be diced, and the dynamic-equilibrium plasma channel is formed in the material to be diced by means of self-focusing and defocusing effect of plasma generated by ionizing the material to be diced. The modified layer may be formed in the material to be diced throughout the plasma channel, so as to realize stealth dicing.