A method of manufacturing a part using a cutting machine includes placing a non-porous sheet on a surface of a material cutting machine, removing material from the non-porous sheet to form a plurality of sections of the part, and while the non-porous sheet is present on the material cutting machine, forming fastening holes within the sections. The method further includes removing the sections from a remainder of the sheet, placing the sections together such that each section of the part abuts another section, and inserting fasteners through the fastening holes of the sections.

A method of producing an injection molding tool for molding an article includes producing a replica of the article using at least one of an additive manufacturing process, a solid freeform fabrication process, or a computer numerically controlled (CNC) process. A support block is configured to receive at least a portion of the replica of the article and support the replica with at least one of an outer peripheral surface of the replica or an inner peripheral surface of the replica positioned at a spaced distance from a peripheral surface of the support block. The replica is supported inside the support block at the spaced distance, a ceramic resin material is introduced into the spaced distance and cured to form a ceramic shell insert, the insert is removed from the cavity and sintered, and the insert is positioned within the support block to form a part of a mold tool adapted for installation in a standard plastic injection molding machine.

There is provided a metal product having an internal space formed therein, allowing for improvements in the flow of a coolant in the internal space, such as a cooling channel and an increase in cooling efficiency, and a method of manufacturing thereof. The metal product includes a body part having a first space formed therein; a space formation member having a second space formed therein, mounted on the body part to be communicated with the first space; and a finishing part forming an exterior by covering the space formation member in a state in which the space formation member is mounted on the body part.

There are provided a metal product having an internal space formed therein, allowing for improvements in the flow of a coolant in the internal space, such as a cooling channel and an increase in cooling efficiency, and a method of manufacturing thereof. The metal product includes a body part having a first space formed therein; a space formation member having a second space formed therein, mounted on the body part to be communicated with the first space; and a finishing part forming an exterior by covering the space formation member in a state in which the space formation member is mounted on the body part.

An injection device has a heating cylinder, a nozzle adaptor attached to an end of the heating cylinder, a nozzle body attached to an end of the nozzle adaptor, a heater for heating the nozzle body, and a thermocouple for measuring a temperature of the nozzle body. The nozzle body has an outer peripheral surface and a key seat formed in the outer peripheral surface and extending in an axial direction of the nozzle body. The thermocouple includes a plate fitted in the key seat of the nozzle body.

A method for forming a mold apparatus comprising: forming a cavity portion through an additive manufacturing process; wherein the cavity portion comprises a cavity molding surface having a surface roughness of greater than or equal to about 0.025 m and a plurality of cavity fluid channels; wherein the cavity fluid channels comprise a profile conforming to the profile of the cavity molding surface; treating the cavity molding surface to reduce the surface roughness to less than about 0.025 m; forming a core portion through additive manufacturing; wherein the core portion comprises a core molding surface and a plurality of core fluid channels; wherein the core fluid channels conform to the core molding surface.

The invention provides a method for producing a component (100) having a cooling channel system, the method comprising: building a first portion (10) of the component (100) by means of the additive, integrally bonded application of a build material; andintroducing a first cavity (11) having an opening into the first portion (10) of the component (100). The method is characterized in that it also comprises: covering the opening of the first cavity (11) in the first portion (10) by means of a covering part (13);building a second portion (20) of the component (100) by means of the additive, integrally bonded application of the build material, the build material being applied to the first portion (10) and to the covering part (13); introducing a second cavity (21) having an opening into the second portion (20) of the component (100); andintroducing a connecting channel (90), (90a) into the component (100) by means of material-removing machining in order to form the cooling channel system, the connecting channel (90), (90a) connecting the second cavity (21) of the second portion (20) to the first cavity (11) of the first portion (10) of the component (100).

A method of encapsulating a panel of electronic components such as power converters reduces wasted printed circuit board area. The panel, which may include a plurality of components, may be cut into one or more individual pieces after encapsulation with the mold forming part of the finished product, e.g. providing heat sink fins or a surface mount solderable surface. Interconnection features provided along boundaries of individual circuits are exposed during the singulation process providing electrical connections to the components without wasting valuable PCB surface area. The molds may include various internal features such as registration features accurately locating the circuit board within the mold cavity, interlocking contours for structural integrity of the singulated module, contours to match component shapes and sizes enhancing heat removal from internal components and reducing the required volume of encapsulant, clearance channels providing safety agency spacing and setbacks for the interconnects. Wide cuts may be made in the molds after encapsulation reducing thermal stresses and reducing the thickness of material to be cut during subsequent singulation. External mold features can include various fin configurations for heat sinks, flat surfaces for surface mounting or soldering, etc. Blank mold panels may be machined to provide some or all of the above features in an on-demand manufacturing system. Connection adapters may be provided to use the modules in vertical or horizontal mounting positions in connector, through-hole, surface-mount solder variations. The interconnects may be plated to provide a connectorized module that may be inserted into a mating connector.

A method of encapsulating a panel of electronic components such as power converters reduces wasted printed circuit board area. The panel, which may include a plurality of components, may be cut into one or more individual pieces after encapsulation. The mold may be used to form part of the finished product, e.g. providing heat sink fins or a surface mount solderable surface. Interconnection features provided along boundaries of individual circuits are exposed during the singulation process providing electrical connections to the components without wasting valuable PCB surface area. The molds may include various internal features such as registration features accurately locating the circuit board within the mold cavity, interlocking contours for structural integrity of the singulated module, contours to match component shapes and sizes enhancing heat removal from internal components and reducing the required volume of encapsulant, clearance channels providing safety agency spacing and setbacks for the interconnects. Wide cuts may be made in the molds after encapsulation reducing thermal stresses and reducing the thickness of material to be cut during subsequent singulation. External mold features can include various fin configurations for heat sinks, flat surfaces for surface mounting or soldering, etc. Blank mold panels may be machined to provide some or all of the above features in an on-demand manufacturing system. Connection adapters may be provided to use the modules in vertical or horizontal mounting positions in connector, through-hole, surface-mount solder variations. The interconnects may be plated to provide a connectorized module that may be inserted into a mating connector. Reuseable plates may be used instead of the heat sink panels. Alternatively the panel may be encapsulated in and separated from a re-useable mold after curing.