The invention relates to a heat exchanger comprising first fluid inlets, first fluid outlets, second fluid inlets and second fluid outlets. Each of the first fluid inlets, the first fluid outlets, the second fluid inlets and the second fluid outlets are arranged on four different sides of a heat exchanger core. A manifold covers one of the four different sides of the heat exchanger core, wherein a first sidewall of the manifold is arranged at an angle smaller than 90 degree to the one side of the heat exchanger core which is covered by the manifold. An edge of the heat exchanger core between the one side of the heat exchanger core which is covered by the manifold and a neighbouring side of the four different sides of the heat exchanger core forms a common weld line with a connecting edge of the first sidewall of the manifold. The invention also relates to a method for manufacturing a heat exchanger comprising a heat exchanger core and a manifold.

One variation of a method for fabricating a dermal heatsink includes: fabricating a substrate defining an interior surface, an exterior surface opposite the interior surface, and an open network of pores extending between the interior surface and the exterior surface; activating surfaces of the substrate and walls of the open network of pores; applying a coating over the substrate to form a heatsink, the coating comprising a porous, hydrophilic material and defining a void network; removing an excess of the coating from the substrate to clear blockages within the open network of pores by the coating; hydrating the heatsink during a curing period; heating the heatsink during the curing period to increase porosity of the coating applied over surfaces of the substrate; and rinsing the heatsink with an acid to decarbonate the coating along walls of the open network of pores in the substrate.

One variation of a method for fabricating a dermal heatsink includes: fabricating a substrate defining an interior surface, an exterior surface opposite the interior surface, and an open network of pores extending between the interior surface and the exterior surface; activating surfaces of the substrate and walls of the open network of pores; applying a coating over the substrate to form a heatsink, the coating comprising a porous, hydrophilic material and defining a void network; removing an excess of the coating from the substrate to clear blockages within the open network of pores by the coating; hydrating the heatsink during a curing period; heating the heatsink during the curing period to increase porosity of the coating applied over surfaces of the substrate; and rinsing the heatsink with an acid to decarbonate the coating along walls of the open network of pores in the substrate.

A plate heat exchanger has two metal plates brought into abutment, with a solder material between the plates. The plates are heated up to a first temperature. The plates are placed into a mold, the mold surfaces of which have cavities for envisaged channel structures. Channel structures are formed by local internal pressure forming of at least one plate under pressurization by the tool. The plates are heated up to a second temperature. The plates are solder bonded at the abuted surfaces. A plate heat exchanger has two metal plates, wherein channel structures have been formed in at least one plate and the plates are bonded to one another by soldering away from the channel structures. Eutectic microstructures having a longest extent of less than 50 micrometers are formed in the solder layer.

A plate heat exchanger has two metal plates brought into abutment, with a solder material between the plates. The plates are heated up to a first temperature. The plates are placed into a mold, the mold surfaces of which have cavities for envisaged channel structures. Channel structures are formed by local internal pressure forming of at least one plate under pressurization by the tool. The plates are heated up to a second temperature. The plates are solder bonded at the abuted surfaces. A plate heat exchanger has two metal plates, wherein channel structures have been formed in at least one plate and the plates are bonded to one another by soldering away from the channel structures. Eutectic microstructures having a longest extent of less than 50 micrometers are formed in the solder layer.

A heat exchanger according to one embodiment includes: a heat exchange core; a shell provided to surround the heat exchange core; and a first partition wall that is provided in a space surrounded by an outer surface of the heat exchange core and an inner surface of the shell, and partitions the space into a first header space communicating with the heat exchange core and a second header space communicating with the heat exchange core. The first header space and the second header space are adjacent to each other, separated by the first partition wall.

A heat exchanger according to one embodiment includes: a heat exchange core; a shell provided to surround the heat exchange core; and a first partition wall that is provided in a space surrounded by an outer surface of the heat exchange core and an inner surface of the shell, and partitions the space into a first header space communicating with the heat exchange core and a second header space communicating with the heat exchange core. The first header space and the second header space are adjacent to each other, separated by the first partition wall.

A fill tool system that fills, seals, and inspects a heat pipe array, which includes one or more heat pipes with heat pipe working fluid.

A fill tool system that fills, seals, and inspects a heat pipe array, which includes one or more heat pipes with heat pipe working fluid.

A method including forming a housing configured to house a number of first magnets; fixing the number of first magnets to the housing to form a magnetic sub-assembly; and attaching the magnetic sub-assembly to at least one of the closure or the body. The magnetic sub-assembly being configured to cooperate with a number of second magnets disposed on either the closure or the body, so that when the closure is in the closed position, a magnetic force between the magnetic sub-assembly and the number of second magnets biases the closure towards the body.