Patent classifications
B23P15/26
METHOD OF MODIFYING AIR CONDITIONER FOR HEATING
The method of modifying an air conditioner for heating takes advantage of the features and operation of a conventional limited space air conditioner, such as a portable room air conditioner. A hood or manifold is placed over the vents or grille that normally exhausts cold air into the room, and a flexible duct hose is connected between the hood or duct and an exhaust vent installed in a window or ceiling to exhaust cold air produced by the air conditioner outside the building. The duct from the condenser or hot air side of the air conditioner, which would normally be exhausted outside the building, is open to the room in need of heating. Thus, the hot air produced by normal operation of the air conditioner is used to heat the room.
METHOD OF MODIFYING AIR CONDITIONER FOR HEATING
The method of modifying an air conditioner for heating takes advantage of the features and operation of a conventional limited space air conditioner, such as a portable room air conditioner. A hood or manifold is placed over the vents or grille that normally exhausts cold air into the room, and a flexible duct hose is connected between the hood or duct and an exhaust vent installed in a window or ceiling to exhaust cold air produced by the air conditioner outside the building. The duct from the condenser or hot air side of the air conditioner, which would normally be exhausted outside the building, is open to the room in need of heating. Thus, the hot air produced by normal operation of the air conditioner is used to heat the room.
METHODS FOR ESTABLISHING THERMAL JOINTS BETWEEN HEAT SPREADERS OR LIDS AND HEAT SOURCES
According to various aspects, exemplary embodiments are disclosed of thermal interface materials, electronic devices, and methods for establishing thermal joints between heat spreaders or lids and heat sources. In exemplary embodiments, a method of establishing a thermal joint for conducting heat between a heat spreader and a heat source of an electronic device generally includes positioning a thermal interface material (TIM1) between the heat spreader and the heat source.
SANITARY EVAPORATOR ASSEMBLY
An ice maker evaporator assembly having an evaporator pan with a back wall and left, right, top and bottom sidewalls extending from the back wall, and a freeze plate located within the evaporator pan. Refrigerant tubing is thermally coupled to the back wall of the evaporator pan opposite the left, right, top and bottom sidewalls. A first layer of insulation is formed on the refrigerant tubing. An evaporator housing having a housing back wall and housing left, right, top and bottom sidewalls extending from the housing back wall is attached to the evaporator pan and covers refrigerant tubing. A second layer of insulation is formed on top of the first layer of insulation.
SANITARY EVAPORATOR ASSEMBLY
An ice maker evaporator assembly having an evaporator pan with a back wall and left, right, top and bottom sidewalls extending from the back wall, and a freeze plate located within the evaporator pan. Refrigerant tubing is thermally coupled to the back wall of the evaporator pan opposite the left, right, top and bottom sidewalls. A first layer of insulation is formed on the refrigerant tubing. An evaporator housing having a housing back wall and housing left, right, top and bottom sidewalls extending from the housing back wall is attached to the evaporator pan and covers refrigerant tubing. A second layer of insulation is formed on top of the first layer of insulation.
METHOD AND HOT-FORMING DIE FOR PRODUCING A HEAT TRANSFER PLATE
A hot-forming die has a heatable lower die and a heatable upper die. The lower die and the upper die have spacer elements to permit flexing. A plate stack including two plate elements is inside the hot-forming die. The plate stack is on the spacer elements in the lower die. The lower die and the upper die are displaced relative to each other when the hot-forming die is closed. The spacer elements of the upper die come into contact with the plate stack. As the closing movement continues, the spacer elements, are displaced into the lower die and the upper die, respectively, and the plate stack is clamped between the lower die and the upper die. The plate stack is then heated by the lower die and the upper die and an internal pressure is applied to an intermediate space between the plate elements by feeding in an active medium.
METHOD AND HOT-FORMING DIE FOR PRODUCING A HEAT TRANSFER PLATE
A hot-forming die has a heatable lower die and a heatable upper die. The lower die and the upper die have spacer elements to permit flexing. A plate stack including two plate elements is inside the hot-forming die. The plate stack is on the spacer elements in the lower die. The lower die and the upper die are displaced relative to each other when the hot-forming die is closed. The spacer elements of the upper die come into contact with the plate stack. As the closing movement continues, the spacer elements, are displaced into the lower die and the upper die, respectively, and the plate stack is clamped between the lower die and the upper die. The plate stack is then heated by the lower die and the upper die and an internal pressure is applied to an intermediate space between the plate elements by feeding in an active medium.
INTEGRATED VAPOR CHAMBER AND MANUFACTURING METHOD THEREOF
An integrated vapor chamber includes an outer shell and a plurality of composite capillary structures. The outer shell includes a flat casing and a plurality of partitions integrally formed. The flat shell includes a chamber, and the partitions are disposed in the chamber to separate the chamber into a plurality of flow channels. Each composite capillary structure is extended along each flow channel and distributed in the chamber. The composite capillary structure includes a metal mesh and a plurality of sintered powder uniformly sintered in the metal mesh. Furthermore, this disclosure also discloses a manufacturing method of the integrated vapor chamber. Therefore, the manufacturing method of the thin vapor chamber is simplified to improve the yield rate.
Heat exchanger with porous material
A method for manufacturing a heat exchanger includes: providing a porous material that has a porosity of about 30% to about 80%; forming an oxide layer on a surface of the porous material by heat treating the porous material at a temperature in a range of 600° C. to 900° C. for a time period in a range of 8 hours to 12 hours in air; and integrating the porous material into a cold side flow passage of the heat exchanger.
Heat exchanger with porous material
A method for manufacturing a heat exchanger includes: providing a porous material that has a porosity of about 30% to about 80%; forming an oxide layer on a surface of the porous material by heat treating the porous material at a temperature in a range of 600° C. to 900° C. for a time period in a range of 8 hours to 12 hours in air; and integrating the porous material into a cold side flow passage of the heat exchanger.