B23P2700/09

MEMORY MODULE COOLER WITH VAPOR CHAMBER DEVICE CONNECTED TO HEAT PIPES
20200022282 · 2020-01-16 ·

An example memory cooler may include a vapor chamber device and a number of heat pipes connected to the vapor chamber device. The vapor chamber device may include walls that bound a vapor chamber, the heat pipes may include vapor channels, and the heat pipes may be connected to a first wall of the vapor chamber device such that their respective vapor channels are communicably connected to the vapor chamber. The example memory cooler may also include fins extending from a second wall of the vapor chamber device, the second wall bounding the vapor chamber. The fins and the second wall may be part of the same continuous body.

Thermal ground plane

Methods, apparatuses, and systems are disclosed for flexible thermal ground planes. A flexible thermal ground plane may include a support member. The flexible thermal ground plane may include an evaporator region or multiple evaporator regions configured to couple with the support member. The flexible thermal ground plane may include a condenser region or multiple condenser regions configured to couple with the support member. The evaporator and condenser region may include a microwicking structure. The evaporator and condenser region may include a nanowicking structure coupled with the micro-wicking structure, where the nanowicking structure includes nanorods. The evaporator and condenser region may include a nanomesh coupled with the nanorods and/or the microwicking structure. Some embodiments may include a micromesh coupled with the nanorods and/or the microwicking structure.

Loop heat pipe and electronic device

A loop heat pipe includes a first heat pipe portion and a second heat pipe portion. The first heat pipe portion includes a first evaporator, a first condenser, a first vapor tube, and a first liquid tube. The second heat pipe portion includes a second evaporator, a second condenser, a second vapor tube, and a second liquid tube. The loop heat pipe further includes a connecting portion that connects the first condenser and the second condenser.

VAPOR CHAMBER WATER-FILLING SECTION SEALING STRUCTURE
20190383561 · 2019-12-19 ·

A vapor chamber water-filling section sealing structure. The vapor chamber water-filling section sealing structure includes a main body and a capillary structure. The main body has a first plate body and a second plate body, which are correspondingly mated with each other to together define an airtight chamber and a water-filling section. A flange is disposed along an outer periphery of the main body. The water-filling section has a water-filling notch and a water-filling passage. Two ends of the water-filling passage are respectively connected with the flange and the water-filling notch to communicate with the airtight chamber. A portion of the water-filling passage that is connected with the flange is pressed to have a height equal to the height of the flange or lower than the height of the flange. The capillary structure is disposed in the airtight chamber of the main body.

PRE-PIPED THERMAL TRANSFER UNIT WITH SUPPORT MECHANISM
20240085055 · 2024-03-14 ·

A zone-control unit for use in a heating, ventilation, and air conditioning (HVAC) system, the zone-control unit includes a heat exchanger, an inlet piping assembly coupled with the heat exchanger for supplying fluid to the heat exchanger, an outlet piping assembly coupled with the heat exchanger for receiving fluid from the heat exchanger, a bracket that maintains the inlet piping assembly and the outlet piping assembly in positional relationship, and an ancillary component coupled with the heat exchanger.

COOLING DEVICE WITH EASY-TO-WELD STRUCTURE
20240060725 · 2024-02-22 ·

A cooling device includes a partitioning board abutting inner faces of two boards, respectively. A chamber is defined between the partitioning board and one of the two boards. Another chamber is defined between the partitioning board and another of the two boards and intercommunicates with the chamber via an intercommunication port and a backflow port of the partitioning board. A pump drives a working fluid to circulate in the two chambers. Two welding channels are formed on outer faces of the two boards and surround the two chambers, respectively. The smallest distance between a channel bottom face of each annular welding channel and the inner face of a respective board having the annular welding channel is smaller than that between the inner and outer faces of the respective board. The two boards are coupled to the partitioning board along the annular welding channels by laser welding.

Device and method for opening folded heat exchanger cores

A device is configured for opening a heat exchanger core from a U-shape to a V-shape. Such heat exchanger core has a plurality of parallel flat tubes, each having two ends; and two manifolds. Each of the flat tubes has two straight sections adjacent to the manifolds and an intermediate bent section. The device has two hinged frames, a respective clamp arrangement on each of the hinged frames for holding the two manifolds, and a trough shaped support for the intermediate portion. For opening the U-shaped heat exchanger core, the heat exchanger core is inserted into the device, and the two manifolds are secured with the clamp arrangements. The clamp arrangements are separated from one another by pivoting apart the two hinged frames, on which the clamps are mounted. Simultaneously, the intermediate bent section is pushed toward the trough adapted to provide a desired curvature to the intermediate section.

Multi-layer wick structures with surface enhancement and fabrication methods

A method for fabricating a multi-layer porous wick structure including, providing a first mold set comprising a negative mold and a positive mold, introducing metal particles in the negative mold defining a first porous wick layer, and sintering the metal particles within the negative mold while interfaced with the positive mold to form the first porous wick layer. The method further includes providing a second mold set comprising a negative mold and a positive mold corresponding to the negative mold and assembling the first porous wick layer with the negative mold of the second mold set. The method further includes introducing filler particles into the negative mold of the second mold set to form a sacrificial layer with the first porous wick layer, introducing metal particles in the negative mold of the second mold set with the first porous wick layer and the sacrificial layer and sintering the metal particles, thereby forming the multi-layer porous wick structure.

Heat pipe with non-uniform cross-section

A heat pipe comprises a tube and protrusions. The tube has an internal surface, an external surface, and a length running from a first end to a second end. The protrusions are on the internal surface. A first cross-section of the protrusions at a first location of the length of the tube is different from a second cross-section of the protrusions at a second location of the length of the tube. The tube and the protrusions are monolithic.

Heat pipe structure and caulking jig for heat pipe structure

A heat pipe structure includes a base block including a rear surface part thermally connectable to a heat generating body and a heat pipe fixed to a front surface part of the base block and including a heat receiving tubular portion disposed along an in-plane direction of the base block. The base block has a longitudinal direction and a width direction and includes a recessed part in which the heat receiving tubular portion is housed and a pair of wall parts projecting along an outer circumferential surface of the heat receiving tubular portion from width direction both sides of the recessed part, and a container of the heat pipe is caulked and fixed by the recessed part and the pair of wall parts and includes a projecting shape part projecting in a direction opposite to a direction of the caulking between distal end portions of the pair of wall parts.