A vapor chamber water-filling section sealing structure. The vapor chamber water-filling section sealing structure includes a main body and a capillary structure. The main body has a first plate body and a second plate body, which are correspondingly mated with each other to together define an airtight chamber and a water-filling section. A flange is disposed along an outer periphery of the main body. The water-filling section has a water-filling notch and a water-filling passage. Two ends of the water-filling passage are respectively connected with the flange and the water-filling notch to communicate with the airtight chamber. A portion of the water-filling passage that is connected with the flange is pressed to have a height equal to the height of the flange or lower than the height of the flange. The capillary structure is disposed in the airtight chamber of the main body.

An integrated vapor chamber includes an outer shell and a plurality of composite capillary structures. The outer shell includes a flat casing and a plurality of partitions integrally formed. The flat shell includes a chamber, and the partitions are disposed in the chamber to separate the chamber into a plurality of flow channels. Each composite capillary structure is extended along each flow channel and distributed in the chamber. The composite capillary structure includes a metal mesh and a plurality of sintered powder uniformly sintered in the metal mesh. Furthermore, this disclosure also discloses a manufacturing method of the integrated vapor chamber. Therefore, the manufacturing method of the thin vapor chamber is simplified to improve the yield rate.

A vapor chamber with a support structure is provided. The vapor chamber with the support structure includes a first plate, a second plate spaced apart from the first plate, and multiple support elements fixed between the first and second plates. On an outer surface of any of the first plate or the second plate, laser welding is performed on positions corresponding to the support elements so as to join the support elements to the first and second plates and to form weld ports on the outer surface of any of the plates. The invention solves the problem of fixing the support structure inside the thin vapor chamber, and therefore mass production can be realized.

The present invention provides a heat exchange tube assembly, a fabrication method thereof and a refrigerator, wherein the heat exchange tube assembly includes a heat exchange tube group, the heat exchange tube group includes a capillary tube and a gas return tube which come into contact with each other, and the heat exchange tube assembly further includes a vacuum tube with which a periphery of the heat exchange tube group is sleeved; heat transfer paths, such as heat conduction, heat convection, or the like, can be eliminated.

One or more methods of fabricating a microscale canopy wick structure having an array of individual wicks having one or more canopy members. Each method includes selectively etching a substrate to control the thickness of the canopy members and also control the width of a fluid flow channel between adjacent wicks in a manner that enhances the overall performance of the microscale canopy wick structure.

A method uses a sheet shaped member to separate two spaces from each other. The sheet shaped member includes a base having a first principal surface and a second principal surface, and a moisture permeable membrane provided on or close to the first principal surface of the base. The first principal surface of the base is arranged in one of the two spaces having a lower water vapor pressure when the two spaces separated from each other by the sheet-like member have different water vapor pressures.

A method for forming heatsink tube includes cutting a base sheet plate into a first molded frame and a second molded frame, applying a flux on an inner face of the first molded frame and the second molded frame, mounting the first molded frame on a heatsink fin module, and mounting the second molded frame on the first molded frame, to assemble the first molded frame, the heatsink fin module, and the second molded frame, and to form a heatsink tube. The first molded frame has a first end faceplate and two first connecting portions. The second molded frame has a second end faceplate and two second connecting portions. Each of the two first connecting portions is formed with a first abutting section, and each of the two second connecting portions is formed with a second abutting section.

A method for designing startup critical tube diameter of pulsating heat pipe in vertical state, including the following steps: step 1. establishing a first model of working medium mass in pulsating heat pipe; step 2. establishing a second model of working medium mass in pulsating heat pipe, the second model including the vapor working medium mass model and the liquid working medium mass model in the pulsating heat pipe; step 3. according to the law of conservation of mass, combining the first model and the second model, and determining the volume percentage of the liquid working medium in the total length of the pulsating heat pipe under the condition of heat addition; step 4. determining the startup critical tube diameter of the pulsating heat pipe according to the volume percentage of the liquid working medium in the total length of the pulsating heat pipe under the condition of heat addition obtained in step 3, the physical properties of the working medium in the pulsating heat pipe, the temperatures at the heat-absorbing end and heat-releasing end, the heating power, and the filling factor.

Disclosed herein is a blank for a heat-transfer device that includes a vapor chamber enclosed by a body of the heat-transfer device, and a charging tube connected to the vapor chamber, wherein a part of the charging tube protruding from the body has at least one unsealed sealing zone with an oblong flow area, where a width of the charging tube exceeds a height of the charging tube.

A vapor chamber device and a manufacturing method are disclosed. The vapor chamber has a housing and multiple independent chambers. The housing includes two shells opposite to each other. The independent chambers are formed between the two shells. Each independent chamber contains a working fluid and has at least one diversion bump and a capillary structure. The diversion bump is formed on an inner surface of the second shell, and the capillary structure is mounted on the diversion bump. When the vapor chamber device is vertically mounted to a heat source, the independent chambers at an upper portion of the vapor chamber device still contain the working fluid. The working fluid in the independent chambers may not all flow to a bottom of the vapor chamber device. Therefore, a contact area between the working fluid and the heat source is increased and heat dissipation efficiency is improved.