A method of installing an asymmetric heat pipe in a heat sink includes providing an asymmetric heat pipe with additional material on one side; forming a cavity in a base of the heat sink leaving additional base material on the component side of the heat sink; inserting the asymmetric heat pipe in the cavity; and removing the additional material on the asymmetric heat pipe and the additional base material on the heat sink to form a smooth and substantially uniform contact surface on the component side. An apparatus includes a component; a heat sink with a cavity; and a flattened heat pipe inserted into the cavity; wherein the heat sink and the heat pipe have a smooth and substantially uniform surface on the side proximal to the component and the heat pipe has a thickness which is substantially the same size on a component side and an opposite side.

A vapor chamber and a manufacturing method thereof are provided. The vapor chamber includes a housing, a capillary structure, at least two liquid-filling and gas-discharging pipes and a working fluid; the housing has a bottom housing plate and a top housing plate correspondingly engaged and sealed with the bottom housing plate, and a single chamber is formed between the top housing plate and the bottom housing plate; the capillary structure is disposed in the single chamber; each of the liquid-filling and gas-discharging pipes is allowed to penetrate into the housing and communicate with the single chamber; and the working fluid is disposed in the single chamber. Accordingly, the working fluid can be evenly and widely distributed in the single chamber.

A vapor chamber and an assembly method thereof are provided. The vapor chamber includes a mesh structure including a main body and an extension part. The main body and the extension part have a capillary-wick structure, respectively. The extension part is extended outwardly from a side of the main body and folded along an intersection between the extension part and the main body. The extension part is stacked on the main body. An overlapping area is formed by stacking the extension part on the main body, and the overlapping area fails to contact with a support structure. The main body is disposed on a first concave of the lower case. The upper case covers the lower case and is assembled with the lower case. A second concave of the upper case and the first concave collaboratively form a space. The mesh structure is accommodated within the space.

Disclosed embodiments are relate to heat transfer devices or heat exchangers for computing systems, and in particular, to heat pipes for improved thermal performance at a cold plate interface. A thermal exchange assembly includes a heat pipe (HP) directly coupled to a cold plate. The HP includes a window, which is a recessed or depressed portion of the HP. The window is attached to the cold plate at a window section of the cold plate. The cold plate is configured to be placed on a semiconductor device that generates heat during operation. The cold plate transfers the heat to the HP with less thermal resistance than existing HP solutions. Other embodiments may be described and/or claimed.

A evaporator of a loop heat pipe includes a liquid inlet side portion that extends in a widthwise direction crossing with a lengthwise direction from a liquid inlet side to a vapor outlet side, a plurality of portions that continue to the liquid inlet side portion and extend in the lengthwise direction, a plurality of vapor flow paths that are provided between the plurality of portions and extend in the lengthwise direction, and a vapor outlet side vapor flow path that extends in the widthwise direction and continues to the vapor flow paths. Each of the plurality of portions includes a first groove communicating two adjacent ones of the vapor flow paths.

A method of fabricating a heat pipe may include providing a first material as a body section. The method may include stamping or etching the body section to include the cavity. A portion of the body section may constitute a wall of the cavity. The method may include stamping or etching the wall of the cavity to provide a set of corrugations on a portion of the wall of the cavity. The method may include forming an opening in the wall of the cavity. The method may include attaching a lid over the cavity. The lid constituting at least a portion of a hermetic seal of the cavity. The method may include attaching a cover to the body section approximately adjacent to the opening in the cavity. The method may include attaching a valve to the body section approximately at the opening to the cavity.

A method for designing startup critical tube diameter of pulsating heat pipe in vertical state, including the following steps: step 1. establishing a first model of working medium mass in pulsating heat pipe; step 2. establishing a second model of working medium mass in pulsating heat pipe, the second model including the vapor working medium mass model and the liquid working medium mass model in the pulsating heat pipe; step 3. according to the law of conservation of mass, combining the first model and the second model, and determining the volume percentage of the liquid working medium in the total length of the pulsating heat pipe under the condition of heat addition; step 4. determining the startup critical tube diameter of the pulsating heat pipe according to the volume percentage of the liquid working medium in the total length of the pulsating heat pipe under the condition of heat addition obtained in step 3, the physical properties of the working medium in the pulsating heat pipe, the temperatures at the heat-absorbing end and heat-releasing end, the heating power, and the filling factor.

Methods, systems, and device for bendable flat heat pipes are provided in accordance with various embodiments. For example, some embodiments include a device that includes one or more containment layers. A wick and vapor layer may be positioned between two containment layers or between two portions of a containment layer; the wick and vapor layer may include both wick and vapor channels. Some embodiments include multiple cross ribs that may run laterally on either side or both sides of the wick and vapor layer. In some embodiments, the containment layer(s), the wick and vapor layer, and the multiple cross ribs are bonded with each other to form the device. In addition, the device may be charged with a working fluid.

A heat pipe with micro tubes includes of a solid heat conductor provided therein with two or more parallel micro tubes. The micro tubes are filled with a working medium which exchanges heat through phase change. Two ends of the heat conductor are sealed and at least one of the ends is provided with a sealing strip of gradually shrinking shape that is formed from cold welding.

A method for manufacturing a device temperature controller includes filling an inside of a circuit with working fluid by connecting a filling port of the circuit to a container that stores gas phase working fluid. The circuit constitutes a thermosiphon heat pipe and allows the working fluid to circulate in the circuit. In the filling, the working fluid inside the circuit is cooled by a cooling source. An inside temperature of the circuit is decreased to be lower than an inside temperature of the container, and thereby an inside pressure of the circuit is decreased to be lower than an inside pressure of the container.