A method of fabricating a liquid-cooled heat sink assembly, including: providing a heat transfer element including a heat transfer base having opposite first and second sides, and a plurality of thermally conductive fins extending from the first side of the heat transfer base, the second side of the heat transfer base to couple to a component(s) to be cooled; providing a coolant-carrying structure including a coolant-carrying base and a coolant-carrying compartment through which liquid coolant flows, the coolant-carrying base including a plurality of fin-receiving openings sized and positioned for the plurality of thermally conductive fins of the heat sink base to extend through; and attaching the heat transfer element and coolant-carrying structure together with the plurality of thermally conductive fins extending through the fin-receiving openings in the coolant-carrying base into the coolant-carrying compartment.

A method of producing a complex product includes designing a three dimensional preform of the complex product, creating a three dimensional preform of the complex product using the model, depositing a material on the preform, and removing the preform to complete the complex product. In one embodiment the system provides a complex heat sink that can be used in heat dissipation in power electronics, light emitting diodes, and microchips.

Liquid-cooled heat sink assemblies are provided which include: a heat transfer element including a heat transfer base with opposite first and second sides and a plurality of thermally conductive fins extending from the first side, and with the second side of the heat transfer base to couple to a component(s) to be cooled. The heat sink assembly further includes a coolant-carrying structure attached to the heat transfer element. The coolant-carrying structure includes a coolant-carrying base, and a coolant-carrying compartment through which liquid coolant flows. The coolant-carrying base includes a plurality of fin-receiving openings sized and positioned for the plurality of thermally conductive fins to extend therethrough. The plurality of thermally conductive fins extend into the coolant-carrying compartment through which the liquid coolant flows. In one or more embodiments, the heat transfer element is a metal structure and the coolant-carrying structure is a plastic structure.

A thermal management system is provided. The thermal management system includes at least one heat sink including one or more respective fins, wherein the one or more fins include one or more respective cavities. The thermal management system also includes a synthetic jet stack including at least one synthetic jet mounted within each of the respective cavities employing at least one engaging structure to provide a rigid positioning of the synthetic jet stack within the fins, wherein the synthetic jet includes at least one orifice through which a fluid is ejected.

Exfoliated graphite materials, and composite materials including exfoliated graphite, having enhanced through-plane thermal conductivity can be used in thermal management applications and devices. Methods for making such materials and devices involve processing exfoliated graphite materials such as flexible graphite to orient or re-orient the graphite flakes in one or more regions of the material.

A heat sink component is made of a thermally conductive material and intended to thermally connect an optoelectronics sensor to a rigid cradle cooled by external cooling means; the optoelectronics sensor being mounted on a printed circuit; the cradle having at least one fixing boss and an opening intended to house the optoelectronics sensor; the heat sink component including a base intended to be placed in thermal contact with at least one fixing boss of the cradle; a protuberance intended to be placed in thermal contact with a lower face of the optoelectronics sensor through a hole passing through the printed circuit.

A method for manufacturing a liquid dispenser includes machining a flow tube to form a manifold that includes a plurality of liquid dispensing holes and a plurality of fixing parts, performing precision processing on the liquid dispensing holes and the fixing parts to adjust dimensions thereof, performing a first cleaning process on the manifold, clamping the manifold in a jig at a clamping position of the manifold, welding a liquid inlet adapter and a liquid outlet adapter at opposite ends of the manifold, respectively, and performing a second cleaning process on the liquid dispenser, wherein the second cleaning process is simpler than the first cleaning process.

Corrugated fin components and base plates are stamped from coil-fed sheet in progressive dies. The corrugated component is staked to a primary base plate and the primary base plate is staked to a secondary base plate by plastically deforming conic posts into mushroom-shaped heads, thereby mechanically joining components without loose fasteners or adhesives. The manufacturing line may include multiple punch presses, staking stations, and positioning fixtures arranged about a rotary table or along a conveyor. Pick-and-place robots load the parts, and a PLC coordinates stamping, staking, inspection/sorting, and packaging. Vent apertures can be pierced in the corrugated component to promote omni-directional airflow. The approach enables high fin density and increased surface area relative to die-cast or extruded designs, supporting reduced weight, lower material usage, and high-throughput production.