A shared mold manufacturing method for industrial lighting devices includes the following steps: putting a metal material in a mold to execute a casting molding step to generate a semi-finished product; the semi-finished product has a plate portion and a box portion disposed on the plate portion; taking the semi-finished product from the mold and performing a cooling step to cool the semi-finished product; performing a separating step to separate the plate portion from the box portion; executing a re-processing step for the plate portion and the box portion in order to obtain a heat sink and a driver; and performing a combining step to combine the heat sink with the driver.

A method for forming heatsink tube includes cutting a base sheet plate into a first molded frame and a second molded frame, applying a flux on an inner face of the first molded frame and the second molded frame, mounting the first molded frame on a heatsink fin module, and mounting the second molded frame on the first molded frame, to assemble the first molded frame, the heatsink fin module, and the second molded frame, and to form a heatsink tube. The first molded frame has a first end faceplate and two first connecting portions. The second molded frame has a second end faceplate and two second connecting portions. Each of the two first connecting portions is formed with a first abutting section, and each of the two second connecting portions is formed with a second abutting section.

A method of manufacturing a heat sink includes a rib portion forming step of forming a rib portion on a substrate having a flat plate shape in such a manner that a first groove and a second groove are formed on a front surface side of the substrate by plastically deforming the substrate by a press thus forming the rib portion in a region sandwiched between the first groove and the second groove. The method further includes a back surface protruding ridge portion cutting removal step of removing protruding ridge portions formed on a back surface side of the substrate by cutting. The method further includes a fin forming step of forming a plurality of fins by working the rib portion; and a heat sink separating step of obtaining the heat sink by separating a portion within a predetermined range which includes the fins from the substrate.

An apparatus includes a first planar region having a first surface configured to contact a heat sink. The apparatus also includes at least one second planar region having a second surface configured to contact a surface of at least one heat generating component, the at least one second planar region being parallel to the first planar region and disposed in at least one plane that is offset from the first planar region. The apparatus further includes a plurality of flexure regions disposed at an angle or curved relative to the first planar region and the at least one second planar region. The plurality of flexure regions connect the at least one second planar region to the first planar region. The first planar region and the at least one second planar region are formed of at least a thermally conductive material and a stiffening material and the plurality of flexure regions are formed of at least the stiffening material.

A method for forming heatsink tube includes cutting a base sheet plate into a first molded frame and a second molded frame, applying a flux on an inner face of the first molded frame and the second molded frame, mounting the first molded frame on a heatsink fin module, and mounting the second molded frame on the first molded frame, to assemble the first molded frame, the heatsink fin module, and the second molded frame, and to form a heatsink tube. The first molded frame has a first end faceplate and two first connecting portions. The second molded frame has a second end faceplate and two second connecting portions. Each of the two first connecting portions is formed with a first abutting section, and each of the two second connecting portions is formed with a second abutting section.

Provided is a heat sink that has a clad structure of a Cu—Mo composite material and a Cu material and has a low coefficient of thermal expansion and high thermal conductivity. The heat sink comprises a pair of Cu—Mo composite layers and a Cu layer stacked in a thickness direction so that the Cu layer is interposed between the Cu—Mo composite layers or comprises three or more Cu—Mo composite layers and two or more Cu layers alternately stacked in the thickness direction so that two of the Cu—Mo composite layers are outermost layers on both sides, wherein each of the Cu—Mo composite layers has a thickness section microstructure in which flat Mo phase is dispersed in a Cu matrix. Such a clad structure achieves high thermal conductivity together with a low coefficient of thermal expansion.

Disclosed are systems for applying materials to components. The system comprises a tool operable for transferring a portion of a material from a supply of the material to a component. A first portion of the tool may be configured for cutting along a side or edge of the portion of the material. A second portion of the tool may be configured for tamping, pressing, or pushing against the portion of the material to cause uncut sides or edges of the portion of the material attached to the supply of the material to be torn, severed, detached, or separated from the supply of the material.

A system is provided for installing a heatsink onto a circuit board. The heatsink has a base, a first hook and a second hook. The system includes a heatsink holder, a circuit board arm, a heatsink pusher, and a hook pusher. The heatsink holder is operable to receive the heatsink. The circuit board arm is operable to move the circuit board onto the heatsink received on the heatsink holder such that the bottom surface of the heatsink is adjacent to the circuit board. The heatsink pusher is operable to move the heatsink holder in a first direction so as to move the first hook relative to the first catch. The hook pusher is operable to push the first hook in a direction normal to the base from the top surface to the bottom surface.

The present disclosure provides a heat conducting device. The heat conducting device includes a main body, the main body including an enclosable inner cavity, the inner cavity being configured to receive a medium and accommodate the medium to carry heat to flow in the inner cavity. A surface enclosing the inner cavity is an uneven surface with a height difference, a plurality of parts of the uneven surface having the height difference, and the plurality of parts having the height difference including a plurality of microchannels for guiding the medium.

An method for forming a cooling apparatus for cooling an electronic component. The apparatus has a planar top member of a thermal energy conductive material and a parallel planar bottom member of the material, the planar bottom member including a surface having regions configured for heat exchange contact with the electronic component. The planar top member has a plurality of stamped indent formations at a plurality of locations, each indent formation providing a contact surface such that the planar top member is affixed to the bottom member by braze or solder at each contact surface. Alternatively, the planar bottom member also has a plurality of stamped indent formations in alignment with indent formations of the top member. The planar top member is affixed to the bottom member by brazing or soldering each respective contact surface of an indent formation of the planar top member to an opposing contact surface of a corresponding indent formation of the parallel planar bottom member.