A method for manufacturing a heat exchanger includes softening a base material having a predetermined hardness, forming fins by cutting and raising a surface of a softened base material by skiving, and hardening the base material by performing a heat treatment on the base material with the fins formed thereon.

A system is provided for installing a heatsink onto a circuit board. The heatsink has a base, a first hook and a second hook. The system includes a heatsink holder, a circuit board arm, a heatsink pusher, and a hook pusher. The heatsink holder is operable to receive the heatsink. The circuit board arm is operable to move the circuit board onto the heatsink received on the heatsink holder such that the bottom surface of the heatsink is adjacent to the circuit board. The heatsink pusher is operable to move the heatsink holder in a first direction so as to move the first hook relative to the first catch. The hook pusher is operable to push the first hook in a direction normal to the base from the top surface to the bottom surface.

A heat sink is disclosed comprising a metallic pin extending between a proximal end and a distal end. A lower pin stud is positioned adjacent to the proximal end. An upper pin stud is positioned adjacent to the distal end. A base flange is interposed between the lower pin stud and the upper pin stud and defines a lower base surface and an upper base surface. The lower pin stud engages a source aperture and the lower base surface engages a source surface. A composite pitch fiber encapsulates the upper pin stud and the upper base surface. The metallic pin and the composite pitch fiber transfer the thermal energy from the lower pin stud and the lower base surface, through the upper pin stud and through the composite pitch fiber for dissipating the thermal energy from the source.

Exfoliated graphite materials, and composite materials including exfoliated graphite, having enhanced through-plane thermal conductivity can be used in thermal management applications and devices. Methods for making such materials and devices involve processing exfoliated graphite materials such as flexible graphite to orient or re-orient the graphite flakes in one or more regions of the material.

An electronic circuit board comprising an assembly of a printed circuit board comprises a first face receiving at least one electronic component, and a heat sink, the printed circuit board and the heat sink stacked in a stacking direction, the heat sink fixed to the printed circuit board on a second face opposite the first face, the heat sink comprising a base, in the form of a plate, and reliefs extending from a flat surface of the base, the reliefs intended to increase the contact surface between the heat sink and a flow of air relative to the contact surface between the base and the flow of air, the base interposed between the printed circuit board and the reliefs in the stacking direction, the heat sink fixed directly to the printed circuit board by gluing only and wherein the heat sink is of a single piece.

A method and apparatus for heat-dissipation utilizing a fin assembly including one or more fins organized on a wall or base surface. The fins can extend into a flow of fluid passing along the wall or base surface to convectively cool the fins, which can transfer heat from heat-producing components, such as electronics.

A light-emitting diode (LED) lighting apparatus including at least one LED group including a plurality of LEDs, a rectifier configured to rectify an alternating current (AC) voltage and generate a driving voltage for the at least one LED group, and a system-in-package (SIP) configured to drive and control the at least one LED group, in which the SIP is connected to the at least one LED group and the rectifier, and includes a driving module, a functional module, and a first resistor disposed on a single substrate.

Methods and systems for providing a cold plate assembly include providing a base and a cover. The cover can be fixedly coupled to the base. Each of the base and the cover can include spaced internal ribs, which can form flow paths when the base and cover are fixedly coupled together. The internal ribs of the base and the cover can have spaced tabs that can be fixedly coupled to the other of the base or the cover. The base and the cover may also include spaced external or outer sacrificial ribs.

Provided is a method for producing a heat sink that can easily and effectively form a heat radiating film on the surface of a substrate without requiring enormous heat energy for increasing the temperature of the substrate. The method is a method for producing a heat sink having a substrate and a heat radiating film formed on the surface of the substrate, including a first step of casting a substrate by injecting molten metal into a cavity of molding dies; and a second step of applying a heat radiating coating to the substrate through spraying or dropping in the period from when the molding dies are opened after the casting until when the temperature of the substrate that has been cast becomes lower than the deposition temperature that is a temperature necessary to deposit the heat radiating coating on the substrate.

Provided is a method for inspecting a heat sink that enables an accurate inspection of an insulating film formed on a surface of heat sink fins. The method including a metallic housing that includes a plurality of cooling fins arranged side by side on an outer surface thereof, and an insulating film formed on a surface of the cooling fins and between the cooling fins. The method includes disposing, in an electrolyte solution, an inspection electrode including a plurality of electrode fins insertable between the cooling fins to face the housing with a predetermined distance therebetween in such a way that the cooling fins and the electrode fins are alternately arranged; and applying a voltage between the housing and the inspection electrode, which are arranged to face each other, and inspecting a formation state of the insulating film based on a measured value of a current.