An apparatus for supporting at least one component includes a supporting device having a first and at least one second support element, which are mounted movably relative to each other, and a shape-defining device with a surface contour which fits, at least in some regions, a contour of a supporting section of the component. The supporting device can be placed against the shape-defining device, and, by contact of the at least two support elements with the surface contour of the shape-defining device, the first support element can be moved into a defined position relative to the at least second support element, in which position the at least two support elements reproduce the contour of the supporting section, at least in some regions.

A fabrication fixture suitable for retaining a workpiece. The fabrication fixture includes a first housing having a plurality of reversibly connected modular subsections and a plurality of independently adjustable supports. A second housing has a plurality of reversibly connected modular subsections and a plurality of independently adjustable supports. In use, the first and second housings at least in part envelop the workpiece such that the independently adjustable supports retain the workpiece within the first and second housings, so as to allow the retained workpiece to be moved. A method of moving a workpiece is also disclosed.

A substrate processing apparatus including a lower jig plate for arranging a substrate which is an object to be pressurized, columnar members supporting the lower jig plate, and a heat dissipating column contacting the lower jig plate directly or indirectly and having a higher heat dissipation property than the columnar members.

A wafer adaptor ring assembly for adapting an adapted sized wafer for plasma dicing by a plasma etch chamber designed for dicing a designed sized wafer, which is larger than the adapted sized wafer is disclosed. The wafer adaptor ring assembly includes a primary wafer ring designed for plasma dicing the designed sized wafer by the plasma, an adhesive sheet attached to a bottom surface of the primary wafer ring, and an adapted sized wafer disposed on the adhesive sheet between the primary wafer ring and the adapted sized wafer. A method for forming the wafer adaptor ring assembly is also disclosed.

A wafer adaptor ring assembly for adapting an adapted sized wafer for plasma dicing by a plasma etch chamber designed for dicing a designed sized wafer, which is larger than the adapted sized wafer is disclosed. The wafer adaptor ring assembly includes a primary wafer ring designed for plasma dicing the designed sized wafer by the plasma, an adhesive sheet attached to a bottom surface of the primary wafer ring, and an adapted sized wafer disposed on the adhesive sheet between the primary wafer ring and the adapted sized wafer. A method for forming the wafer adaptor ring assembly is also disclosed.

A modular fixture plate system comprising: at least one interlocking fixture plate comprising at least one of a male end and a female end, wherein the male end comprises at least one male projection and the female end comprises at least one female recess; and a docking plate comprising at least one of at least one male projection and at least one female recess; wherein at least one male projection or female recess of the at least one interlocking fixture plate is interlocked with a mating one of the at least one male projection or the at least one female recess of the docking plate.

A modular fixture plate system comprising: at least one interlocking fixture plate comprising at least one of a male end and a female end, wherein the male end comprises at least one male projection and the female end comprises at least one female recess; and a docking plate comprising at least one of at least one male projection and at least one female recess; wherein at least one male projection or female recess of the at least one interlocking fixture plate is interlocked with a mating one of the at least one male projection or the at least one female recess of the docking plate.

A modular tabletop apparatus, typically used for workpiece storage and handling during robotic manipulation and feeding to a machine, is disclosed. Modules of the apparatus comprise detection interfaces disposed at locations corresponding to module edge locations and arranged in a periodic grid. Alignment of facing detection interfaces along common edges of pairs of adjacent modules permits module controllers to detect neighboring modules, and a main controller to compute the overall size and shape of the tabletop formed by the modules. Connecting arrangements are also disclosed. The connecting arrangements may be placed at the same grid locations as the detection interfaces, advantageously permitting alignment of detection interfaces for any interconnection configuration of modules. Modules may comprise plates with a grid of positioning indentations. The period of the positioning grid can be an integer multiple or integer fraction of that of the interface/connection grid.

According to the present invention, there is provided a fabrication fixture for retaining a workpiece, comprising: a first housing; a second housing; said housing comprising; an independently adjustable support; wherein the first and second housing substantially envelop said workpiece to allow the workpiece to be moved.

The present disclosure provides a system and method relating to work tables. The system comprises a table that attaches to a drill press. Specifically, the present disclosure relates to a drill press table with a fence and optionally a drawer, a vacuum assembly, flip stop assemblies, and various other components. Various operation of using the table are described herein.