B23Q3/15

ELECTROSTATIC CHUCK AND MANUFACTURING METHOD THEREFOR
20210057257 · 2021-02-25 · ·

The present invention relates to a method for manufacturing an electrostatic chuck comprising: a base member of a metal material; and a dielectric layer, formed on an upper surface of the base member, including an electrode layer to the inside of which a DC power is applied. According to the present invention, the dielectric layer is formed of a ceramic material by using at least one selected from among a plasma spraying method and a sol-gel method, and thus can be provided with low porosity to increase in lifespan, and with high permittivity to increase in adhesion force to a substrate.

Electrostatic chuck

According to one embodiment, an electrostatic chuck includes a ceramic dielectric substrate having a first major surface placing an object to be processed and a second major surface on an opposite side of the first major surface, and a base plate provided on a side of the second major surface and supporting the ceramic dielectric substrate. The base plate includes a first communicating passage passing a medium which adjusts a temperature of the object to be processed. The first communicating passage has an upper surface, a side surface, and a lower surface. A ratio of variation of a maximum height Sz in the upper surface to a height of the first communicating passage is not more than 1%.

Electrostatic chuck

According to one embodiment, an electrostatic chuck includes a ceramic dielectric substrate having a first major surface placing an object to be processed and a second major surface on an opposite side of the first major surface, and a base plate provided on a side of the second major surface and supporting the ceramic dielectric substrate. The base plate includes a first communicating passage passing a medium which adjusts a temperature of the object to be processed. The first communicating passage has an upper surface, a side surface, and a lower surface. A ratio of variation of a maximum height Sz in the upper surface to a height of the first communicating passage is not more than 1%.

Electrostatic chuck including ceramic dielectric substrate
10943809 · 2021-03-09 · ·

According to one embodiment, an electrostatic chuck includes a ceramic dielectric substrate, a base plate, and a first electrode layer. The ceramic dielectric substrate has first and second major surfaces. The first electrode layer is provided inside the ceramic dielectric substrate. The first electrode layer is connected to a high frequency power supply. The first electrode layer has a first surface at the first major surface side and a second surface at a side opposite to the first surface. The first electrode layer includes a first portion including the first surface. The first electrode layer includes a ceramic component and a metal component. A concentration of the metal component in the first portion is higher than an average concentration of the metal component in the first electrode layer.

Electrostatic chuck including ceramic dielectric substrate
10943809 · 2021-03-09 · ·

According to one embodiment, an electrostatic chuck includes a ceramic dielectric substrate, a base plate, and a first electrode layer. The ceramic dielectric substrate has first and second major surfaces. The first electrode layer is provided inside the ceramic dielectric substrate. The first electrode layer is connected to a high frequency power supply. The first electrode layer has a first surface at the first major surface side and a second surface at a side opposite to the first surface. The first electrode layer includes a first portion including the first surface. The first electrode layer includes a ceramic component and a metal component. A concentration of the metal component in the first portion is higher than an average concentration of the metal component in the first electrode layer.

Dual Mode Electropermanent Magnet Array
20210210267 · 2021-07-08 · ·

An electropermanent magnet array is provided. The electropermanent magnet array includes one or more of a plurality of electropermanent magnets, arranged in a parallel fashion, a plurality of switching circuits, each switching circuit coupled to a different electropermanent magnet of the plurality of electropermanent magnets, and a control circuit, coupled to the plurality of switching circuits. The control circuit is configured to receive commands to control the plurality of switching circuits to demagnetize the plurality of electropermanent magnets, magnetize the plurality of electropermanent magnets to produce a first magnetic field with a strength and an attraction distance and magnetize the plurality of electropermanent magnets to produce a second magnetic field with a lower strength and greater attraction distance than the first magnetic field.

HOLDING DEVICE
20210007183 · 2021-01-07 · ·

A holding device including a plate-shaped member, a base member, a plurality of heater electrodes disposed in the plate-shaped member, a plurality of electricity supply terminals, a bonding portion, and insulating members. The holding device holds an object on the surface of the plate-shaped member. The plurality of electricity supply terminals disposed in the holding device include N individual electricity supply terminals (N is an integer of 2 or more) electrically connected to respective N heater electrodes of the plurality of heater electrodes, and a common electricity supply terminal electrically connected to all the N heater electrodes. The N individual electricity supply terminals are received in one terminal hole in which the common electricity supply terminal is not received and are insulated from one another by an insulating member. The common electricity supply terminal is received in another terminal hole in which the individual electricity supply terminals are not received.

HOLDING DEVICE
20210007183 · 2021-01-07 · ·

A holding device including a plate-shaped member, a base member, a plurality of heater electrodes disposed in the plate-shaped member, a plurality of electricity supply terminals, a bonding portion, and insulating members. The holding device holds an object on the surface of the plate-shaped member. The plurality of electricity supply terminals disposed in the holding device include N individual electricity supply terminals (N is an integer of 2 or more) electrically connected to respective N heater electrodes of the plurality of heater electrodes, and a common electricity supply terminal electrically connected to all the N heater electrodes. The N individual electricity supply terminals are received in one terminal hole in which the common electricity supply terminal is not received and are insulated from one another by an insulating member. The common electricity supply terminal is received in another terminal hole in which the individual electricity supply terminals are not received.

Electropermanent Magnet Array
20200365305 · 2020-11-19 · ·

An electropermanent magnet array is provided. The electropermanent magnet array includes one or more of a plurality of electropermanent magnets of common length, arranged in a parallel fashion, and a planar pole piece, coupled to the first ends of the plurality of electropermanent magnets. Each electropermanent magnet includes a first and a second end opposite the first end.

Electrostatic chuck
10840119 · 2020-11-17 · ·

According to one embodiment, an electrostatic chuck includes a ceramic dielectric substrate, a base plate, and first and second electrode layers. The ceramic dielectric substrate has first and second major surfaces. The first and second electrode layers are provided inside the ceramic dielectric substrate. The second electrode layer is provided between the first electrode layer and the first major surface. The first electrode layer has a first surface at the first major surface side and a second surface at a side opposite to the first surface. The first electrode layer includes a first portion including the first surface. The first electrode layer includes a ceramic component and a metal component. A concentration of the ceramic component in the first portion is higher than an average concentration of the ceramic component in the first electrode layer.