Patent classifications
B23Q3/15
APPARATUS AND METHOD FOR CONTROLLING CHUCKING FORCE
An apparatus includes a chuck having an upper surface configured to support a substrate; a fixing unit configured to generate chucking force to fix the substrate to the chuck in a first perpendicular direction and applying the chucking force to the substrate; and a controller configured to divide the chuck into a plurality of zones on a plane perpendicular to the first direction, based on reference overlay distribution corresponding to a degree of overlay deterioration when the substrate is fixed to the upper surface of the chuck, and individually control respective magnitudes of the chucking force applied to each of the plurality of zones. The controller is configured to reduce a magnitude of chucking force applied to a zone including a region having a high degree of overlay deterioration, among the plurality of zones, in the reference overlay distribution.
MAGNETIC TAPPING GUIDE DEVICE
The present application provides a magnetic tapping guide device to guide a tap for threading in a workpiece. The magnetic tapping guide device includes a guide seat configured to contact with the workpiece; a guide portion positioned outside the guide seat, having a pilot hole for guiding the tap; and a magnetic module positioned inside the guide seat, configured to provide a magnetic force to keep the guide seat in contact with the workpiece, the magnetic force of the magnetic module being adjustable.
ELECTROSTATIC CHUCK
According to one embodiment, an electrostatic chuck includes a ceramic dielectric substrate, a base plate, and a heater plate. The ceramic dielectric substrate has a surface where a processing object is placed. The base plate supports the ceramic dielectric substrate. The heater plate is provided between the ceramic dielectric substrate and the base plate. The heater plate includes a first support plate including a metal, a second support plate including a metal, a heater element, a first resin layer, and a second resin layer. The heater element is provided between the first support plate and the second support plate. The heater element emits heat due to a current flowing. The first resin layer is provided between the first support plate and the heater element. The second resin layer is provided between the second support plate and the heater element.
ELECTROSTATIC CHUCK
According to one embodiment, an electrostatic chuck includes a ceramic dielectric substrate, a base plate, and a heater plate. The ceramic dielectric substrate has a surface where a processing object is placed. The base plate supports the ceramic dielectric substrate. The heater plate is provided between the ceramic dielectric substrate and the base plate. The heater plate includes a first support plate including a metal, a second support plate including a metal, a heater element, a first resin layer, and a second resin layer. The heater element is provided between the first support plate and the second support plate. The heater element emits heat due to a current flowing. The first resin layer is provided between the first support plate and the heater element. The second resin layer is provided between the second support plate and the heater element.
ELECTROSTATIC CHUCK DEVICE
The present invention provides an electrostatic chuck device capable of increasing the electrostatic adsorptive force for a focus ring and uniformly cooling the focus ring. In an electrostatic chuck device (10) of the present invention, a mounting table (11) has a holder (15) being provided in the periphery of a placing surface (24a) along the circumferential direction of a focus ring (12) and electrostatically adsorbing the focus ring (12), the holder (15) has a pair of banks (16) being provided in the circumferential direction and being for placing the focus ring (12) thereon, and an annular groove (17) formed between these banks, and, in at least a bank (16A) on an outer circumferential position of the focus ring (12) among the pair of the banks (16), a micro-protruding part including a plurality of micro-protrusions is formed on a surface facing the focus ring (12), or convex parts (18) are provided on a bottom (17a) of the groove (17). The convex parts (18) do not come into contact with the focus ring, and the pair of the banks (16) or the plurality of the micro-protrusions comes into contact with the focus ring (12) and electrostatically adsorbs the focus ring (12) in coordination with the convex parts (18).
Compound Linear Guide Having A Fastening Means
The invention relates to a transfer system for transporting objects. It includes a guide rail, which has a light-metal main body and at least one guide element, which is connected to the light-metal main body and has a guide surface. A slide for accommodating at least one object and a bearing, which interacts with the guide element and supports the slide on the guide rail in such a way that the slide can move linearly is also included. The guide rail has at least one magnetic fastening means, which makes it possible to temporarily fasten the guide rail by means of a magnetic clamping device, in particular in order to process the guide surface.
Compound Linear Guide Having A Fastening Means
The invention relates to a transfer system for transporting objects. It includes a guide rail, which has a light-metal main body and at least one guide element, which is connected to the light-metal main body and has a guide surface. A slide for accommodating at least one object and a bearing, which interacts with the guide element and supports the slide on the guide rail in such a way that the slide can move linearly is also included. The guide rail has at least one magnetic fastening means, which makes it possible to temporarily fasten the guide rail by means of a magnetic clamping device, in particular in order to process the guide surface.
Universal magnetic table jig assemblies and methods for positioning a workpiece, especially for the fabrication of aircraft structural components
Magnetic table jig assemblies and methods allow workpieces (e.g., aircraft components to be fabricated) on a table top of the table jig assembly to be accurately indexed relative to a robotically operated tool (e.g., a robotically operated drill). The magnetic table jig assembly may include a wheeled frame which is capable of rolling movement across a floor surface, a horizontally planar table top exhibiting ferromagnetic properties supported by the frame and a plurality of magnetic workpiece positioners each including an actuator to magnetically couple and decouple the magnetic workpiece positioner to the table top. The workpiece will therefore be positioning restrained on the table top by magnetically coupling the plurality of the magnetic workpiece positioners to the table top in abutting relationship to a perimetrical edge of the workpiece.
ELECTROSTATIC CHUCKING DEVICE
Provided is an electrostatic chucking device having high heat resistance. The electrostatic chucking device of the present invention includes a first ceramic plate which includes a first surface on which a substrate is able to be placed and a second surface on the opposite side thereof, and in which an internal electrode for electrostatic adsorption is embedded; a heating member fixed to the second surface; a second ceramic plate adhered to the first ceramic plate and the heating member via a first adhesive layer; and a cooling base portion adhered to the second ceramic plate via a second adhesive layer and cools at least the second ceramic plate. The first adhesive layer has a higher heat resistance than the second adhesive layer. The second adhesive layer has a smaller Young's modulus than the first adhesive layer.
Electrostatic Chuck For Clamping In High Temperature Semiconductor Processing And Method Of Making Same
An electrostatic chuck with a top surface adapted for Johnsen-Rahbek clamping in the temperature range of 500 C to 750 C. The top surface may be sapphire. The top surface is attached to the lower portion of the electrostatic chuck using a braze layer able to withstand corrosive processing chemistries. A method of manufacturing an electrostatic chuck with a top surface adapted for Johnsen-Rahbek clamping in the temperature range of 500 C to 750 C.