Disclosed is a defect inspection device according to an embodiment of the present disclosure. The defect inspection device includes: a robot arm including a hold unit for holding an object and a driving unit for moving the object; a first camera unit photographing an exterior of the object; an illumination unit irradiating light to the exterior of the object; and a control unit determining whether there is a defect in the object based on an image of the object photographed by the first camera unit.

A workpiece processing method includes a carry-in step of carrying a workpiece into the field of view of a magnifier, a work step of performing predetermined work on the workpiece based on an image provided via the magnifier, and a carry-out step of carrying the workpiece out of the field of view of the magnifier, and a robot performs at least one of the carry-in step and the carry-out step as well as the work step.

A workpiece processing method includes a carry-in step of carrying a workpiece into the field of view of a magnifier, a work step of performing predetermined work on the workpiece based on an image provided via the magnifier, and a carry-out step of carrying the workpiece out of the field of view of the magnifier, and a robot performs at least one of the carry-in step and the carry-out step as well as the work step.

A cutting apparatus includes a chuck table having a holding surface used for holding either a workpiece unit that includes a plate-shaped workpiece supported on an annular frame by a tape or a tray shaped similarly to the annular frame, a rest area used for placing a receptacle that houses the workpiece unit or the tray, a transport unit configured to transport the workpiece unit or the tray between the rest area and the chuck table, the transport unit having a holding pad that holds the workpiece unit or the tray, a sub-chuck table that is disposed sideways of the chuck table and has a holding surface used for holding a board for use in adjusting a cutting unit, and a board transport unit configured to transport the board between the tray held on the chuck table and the sub-chuck table.

A cutting apparatus includes a chuck table having a holding surface used for holding either a workpiece unit that includes a plate-shaped workpiece supported on an annular frame by a tape or a tray shaped similarly to the annular frame, a rest area used for placing a receptacle that houses the workpiece unit or the tray, a transport unit configured to transport the workpiece unit or the tray between the rest area and the chuck table, the transport unit having a holding pad that holds the workpiece unit or the tray, a sub-chuck table that is disposed sideways of the chuck table and has a holding surface used for holding a board for use in adjusting a cutting unit, and a board transport unit configured to transport the board between the tray held on the chuck table and the sub-chuck table.

An automatic nut tapping equipment is provided. The automatic nut tapping equipment includes a tap rotating mechanism, a nut clamping mechanism, an axial transmission mechanism, and a nut placing slot. The tap rotating mechanism includes a tap rotary motor and a tap, wherein the tap is driven by the tap rotary motor. The nut clamping mechanism includes a clamping assembly and a sliding rail, wherein the clamping assembly is disposed on the sliding rail and is configured for clamping a to-be-tapped nut to restrict the to-be-tapped nut from rotating. The axial transmission mechanism controls the clamping assembly to axially translate one pitch in response to the tap rotating one revolution, such that a forward nut-tapping motion and a backward nut-retracting motion are performed by the nut clamping mechanism. The nut placing slot is configured to arrange and control the dropping of another to-be-tapped nut.

A method for removing a workpiece from the remainder of the workpiece supported in a bearing plane. The method includes moving the workpiece part, which is clamped between at least one ejector element of an ejection unit and at least one counter-holding element of a counter-holding unit, along a removal direction, and checking whether the workpiece part has been completely separated from the remainder of the workpiece during movement along the removal direction. The method is characterized by reducing or completely canceling the clamping of the workpiece part and subsequently resuming the clamping of the workpiece part if it is determined during checking that the workpiece part has not been completely separated from the remainder of the workpiece.

A method for removing a workpiece from the remainder of the workpiece supported in a bearing plane. The method includes moving the workpiece part, which is clamped between at least one ejector element of an ejection unit and at least one counter-holding element of a counter-holding unit, along a removal direction, and checking whether the workpiece part has been completely separated from the remainder of the workpiece during movement along the removal direction. The method is characterized by reducing or completely canceling the clamping of the workpiece part and subsequently resuming the clamping of the workpiece part if it is determined during checking that the workpiece part has not been completely separated from the remainder of the workpiece.

A stage for cutting process and cutting method thereof, processing apparatus are disclosed. The stage includes a support substrate and a driving unit disposed on the support substrate. The driving unit is configured to drive the support substrate to rotate around a first direction in a board surface of the support substrate so as to remove foreign matters on the support substrate. The driving unit disposed in the stage can drive the rotation of the stage to allow foreign matters on the stage to automatically slide down.

A stage for cutting process and cutting method thereof, processing apparatus are disclosed. The stage includes a support substrate and a driving unit disposed on the support substrate. The driving unit is configured to drive the support substrate to rotate around a first direction in a board surface of the support substrate so as to remove foreign matters on the support substrate. The driving unit disposed in the stage can drive the rotation of the stage to allow foreign matters on the stage to automatically slide down.