An apparatus comprises a stressed glass member and an actuator mounted on the stressed glass member. A power source is coupled to the actuator. An abrasion structure is disposed between the actuator and the stressed glass member. The abrasion structure comprises abrading features in contact with the stressed glass member. The abrading features have a hardness higher than a hardness of the stressed glass member. When energized by the power source, the actuator is configured to induce movement of the abrasion structure that causes the abrading features to create scratches in the stressed glass member to a depth sufficient to initiate fracture of the stressed glass member.

An apparatus comprises a stressed glass member and an actuator mounted on the stressed glass member. A power source is coupled to the actuator. An abrasion structure is disposed between the actuator and the stressed glass member. The abrasion structure comprises abrading features in contact with the stressed glass member. The abrading features have a hardness higher than a hardness of the stressed glass member. When energized by the power source, the actuator is configured to induce movement of the abrasion structure that causes the abrading features to create scratches in the stressed glass member to a depth sufficient to initiate fracture of the stressed glass member.

The invention provides a chemical-mechanical polishing composition comprising (a) about 0.05 wt. % to about 10 wt. % of an abrasive; (b) a dispersant, wherein the dispersant is a linear or branched C.sub.2-C.sub.10 alkylenediol; and (c) water, wherein the chemical-mechanical polishing composition has a pH of about 2 to about 6. The invention also provides a method of chemically-mechanically polishing a substrate by contacting the substrate with the inventive chemical-mechanical polishing composition.

The invention provides a chemical-mechanical polishing composition comprising (a) about 0.05 wt. % to about 10 wt. % of an abrasive; (b) a dispersant, wherein the dispersant is a linear or branched C.sub.2-C.sub.10 alkylenediol; and (c) water, wherein the chemical-mechanical polishing composition has a pH of about 2 to about 6. The invention also provides a method of chemically-mechanically polishing a substrate by contacting the substrate with the inventive chemical-mechanical polishing composition.

A method and a system for producing nanoparticles. The method includes obtaining a foil covered screw by wrapping a foil around an externally threaded section of an outer surface of a screw, placing the foil between an internally threaded section of an inner surface of a nut and the externally threaded section of the outer surface of the screw by screwing the foil covered screw into the nut, and grinding the foil between the internally threaded section of the inner surface of the nut and the externally threaded section of the outer surface of the screw by vibrating one of the nut and the foil covered screw along a first axis. The system includes a foil covered screw, a nut with an internally threaded section, and an ultrasound transducer. The nut and the screw are configured to grind the foil between the internally threaded section of the nut and the externally threaded section of the screw responsive to one of the nut and the screw vibrating along the first axis.

A method and a system for producing nanoparticles. The method includes obtaining a foil covered screw by wrapping a foil around an externally threaded section of an outer surface of a screw, placing the foil between an internally threaded section of an inner surface of a nut and the externally threaded section of the outer surface of the screw by screwing the foil covered screw into the nut, and grinding the foil between the internally threaded section of the inner surface of the nut and the externally threaded section of the outer surface of the screw by vibrating one of the nut and the foil covered screw along a first axis. The system includes a foil covered screw, a nut with an internally threaded section, and an ultrasound transducer. The nut and the screw are configured to grind the foil between the internally threaded section of the nut and the externally threaded section of the screw responsive to one of the nut and the screw vibrating along the first axis.

A planarization processing device for polishing a substrate, e.g., a semiconductor wafer, includes two planarization processing sections (SP1, SP2) that each include a holder (62) for holding a workpiece (W), a drive motor (71) that rotates the holder (62), a support plate (4) holds a pad (5), a linear guide (3) that guides reciprocal movement of the support plate (4) in a direction parallel to the surface of the pad (5), and a drive cylinder (72) that advances the holder (62) or the support plate (4) in a direction that intersects the surface of the workpiece W or the pad (5) to cause the opposing surfaces of the workpiece and the pad (5) to be at least proximal to each other. A primary driver (PD) causes the support plates (4) of the planarization processing sections (SP1, SP2) to reciprocate along the same straight line in opposite phases.

A planarization processing device for polishing a substrate, e.g., a semiconductor wafer, includes two planarization processing sections (SP1, SP2) that each include a holder (62) for holding a workpiece (W), a drive motor (71) that rotates the holder (62), a support plate (4) holds a pad (5), a linear guide (3) that guides reciprocal movement of the support plate (4) in a direction parallel to the surface of the pad (5), and a drive cylinder (72) that advances the holder (62) or the support plate (4) in a direction that intersects the surface of the workpiece W or the pad (5) to cause the opposing surfaces of the workpiece and the pad (5) to be at least proximal to each other. A primary driver (PD) causes the support plates (4) of the planarization processing sections (SP1, SP2) to reciprocate along the same straight line in opposite phases.

A method for processing fracture surfaces of a ductile metal component by processing fracture surfaces (51a and 52a) of fracture components (51 and 52) into which the ductile metal component (50) is divided by fracturing the ductile metal component (50) in a fracture direction includes: a holding step of holding the fracture components in a state in which the fracture surfaces of the fracture components are separated from each other; a vibration step of imparting predetermined vibration to at least either one of the fracture components being held in the holding step in a direction intersecting the fracture direction; a pressing step of pressing the fracture surfaces of the fracture components against each other by a specified pressing force in a state in which the vibration is imparted by the vibration step; and a separation step of separating the fracture surfaces of the fracture components from each other after the pressing step in the state in which the vibration is imparted by the vibration step.

A method for processing fracture surfaces of a ductile metal component by processing fracture surfaces (51a and 52a) of fracture components (51 and 52) into which the ductile metal component (50) is divided by fracturing the ductile metal component (50) in a fracture direction includes: a holding step of holding the fracture components in a state in which the fracture surfaces of the fracture components are separated from each other; a vibration step of imparting predetermined vibration to at least either one of the fracture components being held in the holding step in a direction intersecting the fracture direction; a pressing step of pressing the fracture surfaces of the fracture components against each other by a specified pressing force in a state in which the vibration is imparted by the vibration step; and a separation step of separating the fracture surfaces of the fracture components from each other after the pressing step in the state in which the vibration is imparted by the vibration step.