A device for polishing of a multi-surface workpiece is described. The device includes a base and a vertical motion platform that moves along two support rods, which carries a motor that drives a rotating shaft. The support rods extend from said base. A polishing tool is attached to the motor shaft. The workpiece being polished is placed on a linear motion stage during the polishing process.

A device for polishing of a multi-surface workpiece is described. The device includes a base and a vertical motion platform that moves along two support rods, which carries a motor that drives a rotating shaft. The support rods extend from said base. A polishing tool is attached to the motor shaft. The workpiece being polished is placed on a linear motion stage during the polishing process.

A device for polishing of a multi-surface workpiece is described. The device includes a base and a vertical motion platform that moves along two support rods, which carries a motor that drives a rotating shaft. The support rods extend from the base. A polishing tool is attached to the motor shaft. The workpiece being polished is placed on a linear motion stage during the polishing process.

A device for polishing of a multi-surface workpiece is described. The device includes a base and a vertical motion platform that moves along two support rods, which carries a motor that drives a rotating shaft. The support rods extend from the base. A polishing tool is attached to the motor shaft. The workpiece being polished is placed on a linear motion stage during the polishing process.

Prior to a stopping step in which spark-out is conducted, a spacing step of operating a moving mechanism to space a chuck table and a grinding wheel from each other while maintaining a state in which a plurality of grindstones and a workpiece are in contact with each other is carried out. In the spacing step, a grinding load is reduced. Thus, as compared to the case where the spacing step is not conducted, the length of time necessary for completing the spark-out is shortened, and the length of time necessary for grinding the workpiece can be restrained from being prolonged.

Prior to a stopping step in which spark-out is conducted, a spacing step of operating a moving mechanism to space a chuck table and a grinding wheel from each other while maintaining a state in which a plurality of grindstones and a workpiece are in contact with each other is carried out. In the spacing step, a grinding load is reduced. Thus, as compared to the case where the spacing step is not conducted, the length of time necessary for completing the spark-out is shortened, and the length of time necessary for grinding the workpiece can be restrained from being prolonged.

A processing system capable of processing a workpiece with high accuracy. A tilting device capable of tilting a rotation axis 3a of a chuck 3 holds a workpiece W. A film thickness measurement device 7 measures a film thickness of the workpiece W after fine grinding in a non-contact manner. A control device 8 operates a shape of the workpiece W after fine grinding on the basis of a measurement value of the film thickness measurement device 7, calculates a tilt angle of the tilting device such that a difference between a maximum thickness and a minimum thickness of the workpiece W after the fine grinding decreases, and tilts the chuck 3 by the tilt angle such that the workpiece W after the fine grinding is reprocessed by rough grinding, intermediate grinding, and fine grinding in this order with the chuck 3 tilted by the tilt angle.

A processing system capable of processing a workpiece with high accuracy. A tilting device capable of tilting a rotation axis 3a of a chuck 3 holds a workpiece W. A film thickness measurement device 7 measures a film thickness of the workpiece W after fine grinding in a non-contact manner. A control device 8 operates a shape of the workpiece W after fine grinding on the basis of a measurement value of the film thickness measurement device 7, calculates a tilt angle of the tilting device such that a difference between a maximum thickness and a minimum thickness of the workpiece W after the fine grinding decreases, and tilts the chuck 3 by the tilt angle such that the workpiece W after the fine grinding is reprocessed by rough grinding, intermediate grinding, and fine grinding in this order with the chuck 3 tilted by the tilt angle.

A grinding machine includes a plane grinding mechanism carrying a workpiece, an electrically controlled device mounted on the plane grinding mechanism, a grinder unit rotatably mounted on the plane grinding mechanism to grind the workpiece, and a smart working control system mounted on the plane grinding mechanism and electrically coupled to the electrically controlled device. The smart working control system includes a smart coder and a smart driver. When a load and a cutting force produced between the grinder unit and the workpiece reach preset parameters during the grinding process, the smart driver executes the working sequence or parameter setting program edited by the smart coder, to shorten a movement distance of the workbench of the plane grinding mechanism along the X-axis (leftward and rightward), and to produce an optimum lapping path.

A grinding machine includes a plane grinding mechanism carrying a workpiece, an electrically controlled device mounted on the plane grinding mechanism, a grinder unit rotatably mounted on the plane grinding mechanism to grind the workpiece, and a smart working control system mounted on the plane grinding mechanism and electrically coupled to the electrically controlled device. The smart working control system includes a smart coder and a smart driver. When a load and a cutting force produced between the grinder unit and the workpiece reach preset parameters during the grinding process, the smart driver executes the working sequence or parameter setting program edited by the smart coder, to shorten a movement distance of the workbench of the plane grinding mechanism along the X-axis (leftward and rightward), and to produce an optimum lapping path.