A device for polishing of a multi-surface workpiece is described. The device includes a base and a vertical motion platform that moves along two support rods, which carries a motor that drives a rotating shaft. The support rods extend from said base. A polishing tool is attached to the motor shaft. The workpiece being polished is placed on a linear motion stage during the polishing process.

The invention relates to a sample carrier for a sample (70). Said sample carrier comprises a supporting base (10), a carriage (20) having a receiving region (30) for the sample (70), the carriage (20) being supported on the supporting base (10), a guide (40), the carriage (20) being movably arranged along the guide (40), and a disc (60) that is rotationally movable about an axis of rotation (50), said disc being operatively connected to the carriage (20), wherein a center (65) of the disc (60) is located outside of the axis of rotation (50).

The invention relates to a sample carrier for a sample (70). Said sample carrier comprises a supporting base (10), a carriage (20) having a receiving region (30) for the sample (70), the carriage (20) being supported on the supporting base (10), a guide (40), the carriage (20) being movably arranged along the guide (40), and a disc (60) that is rotationally movable about an axis of rotation (50), said disc being operatively connected to the carriage (20), wherein a center (65) of the disc (60) is located outside of the axis of rotation (50).

A grinding machine includes a plane grinding mechanism carrying a workpiece, an electrically controlled device mounted on the plane grinding mechanism, a grinder unit rotatably mounted on the plane grinding mechanism to grind the workpiece, and a smart working control system mounted on the plane grinding mechanism and electrically coupled to the electrically controlled device. The smart working control system includes a smart coder and a smart driver. When a load and a cutting force produced between the grinder unit and the workpiece reach preset parameters during the grinding process, the smart driver executes the working sequence or parameter setting program edited by the smart coder, to shorten a movement distance of the workbench of the plane grinding mechanism along the X-axis (leftward and rightward), and to produce an optimum lapping path.

A grinding machine includes a plane grinding mechanism carrying a workpiece, an electrically controlled device mounted on the plane grinding mechanism, a grinder unit rotatably mounted on the plane grinding mechanism to grind the workpiece, and a smart working control system mounted on the plane grinding mechanism and electrically coupled to the electrically controlled device. The smart working control system includes a smart coder and a smart driver. When a load and a cutting force produced between the grinder unit and the workpiece reach preset parameters during the grinding process, the smart driver executes the working sequence or parameter setting program edited by the smart coder, to shorten a movement distance of the workbench of the plane grinding mechanism along the X-axis (leftward and rightward), and to produce an optimum lapping path.

Disclosed herein is a grinding wheel including a wheel base to be fixed to a spindle, a plurality of abrasive members fixed to the wheel base, and a plurality of grinding water supply holes for supplying a grinding water to the abrasive members. Each abrasive member is formed as a segment abrasive having an outer surface extending downward from the lower surface of the wheel base so as to be inclined radially outward. The plural abrasive members are arranged annularly at given intervals. The plural grinding water supply holes are formed on the lower surface of the wheel base in the vicinity of the abrasive members so as to each correspond to the abrasive members in the condition where each grinding water supply hole lies on a line connecting the corresponding abrasive member and the axis of rotation of the wheel base.

Disclosed herein is a grinding wheel including a wheel base to be fixed to a spindle, a plurality of abrasive members fixed to the wheel base, and a plurality of grinding water supply holes for supplying a grinding water to the abrasive members. Each abrasive member is formed as a segment abrasive having an outer surface extending downward from the lower surface of the wheel base so as to be inclined radially outward. The plural abrasive members are arranged annularly at given intervals. The plural grinding water supply holes are formed on the lower surface of the wheel base in the vicinity of the abrasive members so as to each correspond to the abrasive members in the condition where each grinding water supply hole lies on a line connecting the corresponding abrasive member and the axis of rotation of the wheel base.

A device for polishing of a multi-surface workpiece is described. The device includes a base and a vertical motion platform that moves along two support rods, which carries a motor that drives a rotating shaft. The support rods extend from said base. A polishing tool is attached to the motor shaft. The workpiece being polished is placed on a linear motion stage during the polishing process.

A device for polishing of a multi-surface workpiece is described. The device includes a base and a vertical motion platform that moves along two support rods, which carries a motor that drives a rotating shaft. The support rods extend from said base. A polishing tool is attached to the motor shaft. The workpiece being polished is placed on a linear motion stage during the polishing process.

The present invention relates to a substrate polishing method of polishing a substrate, such as a wafer, by pressing a polishing tape against the substrate. The substrate polishing method includes: storing an actual polishing condition for a substrate that has been polished in the past and an actual amount of use of a polishing tape under the actual polishing condition in a database (21a), with the actual polishing condition and the actual amount of use associated with each other, searching the database (21a) for an actual polishing condition that matches a preset polishing condition for a polishing-target substrate before polishing of the polishing-target substrate, determining a predicted amount of use of the polishing tape necessary for polishing the polishing-target substrate which is an actual amount of use of the polishing tape associated with the actual polishing condition that matches the preset polishing condition; comparing a remaining amount of the polishing tape to be used for polishing of the polishing-target substrate with the determined predicted amount of use; and when the remaining amount of the polishing tape is equal to or larger than the predicted amount of use, polishing the polishing-target substrate by a polishing module (4A, 4B).