A wafer manufacturing apparatus includes an ingot grinding unit for grinding an upper surface of an ingot to planarize the upper surface of the ingot, a laser applying unit for forming peel-off layers in the ingot at a depth therein, which corresponds to the thickness of a wafer to be produced from the ingot, from the upper surface of the ingot, a wafer peeling unit for holding the upper surface of the ingot and peeling off a wafer from the ingot at the peel-off layers, a tray having an ingot support portion and a wafer support portion, and a belt conveyor unit for delivering the ingot supported on the tray between the ingot grinding unit, the laser applying unit, and the wafer peeling unit.

A processing machine includes a chuck table, a chuck table cover having an opening through which a holding surface of the chuck table can protrude, a processing unit having a spindle, a spindle housing, and a mount portion arranged on a lower end portion of the spindle, the processing unit being configured to process a workpiece by a processing tool mounted on a lower part of the mount portion, a processing chamber construction cover that covers the chuck table and the mount portion. The processing machine further includes a processing tool cover that is secured to a lower end portion of the spindle housing and that has an upper wall and a side wall that extends downwardly from the upper wall. The processing tool cover is disposed inside the processing chamber construction cover and covers the processing tool from above and sides by the upper and side walls.

A processing machine includes a chuck table, a chuck table cover having an opening through which a holding surface of the chuck table can protrude, a processing unit having a spindle, a spindle housing, and a mount portion arranged on a lower end portion of the spindle, the processing unit being configured to process a workpiece by a processing tool mounted on a lower part of the mount portion, a processing chamber construction cover that covers the chuck table and the mount portion. The processing machine further includes a processing tool cover that is secured to a lower end portion of the spindle housing and that has an upper wall and a side wall that extends downwardly from the upper wall. The processing tool cover is disposed inside the processing chamber construction cover and covers the processing tool from above and sides by the upper and side walls.

A grinding method includes a first grinding step of executing grinding feed of a rough grinding unit and grinding the workpiece to a predetermined thickness while supplying grinding water with a first grinding water amount that allows suppression of wear of grinding abrasive stones and a second grinding step of, after executing the first grinding step, promoting dressing of the grinding abrasive stones to prepare for processing of the next workpiece through executing grinding feed of the rough grinding unit and grinding the workpiece to the finished thickness while supplying the grinding water with a second grinding water amount that increases wear of the grinding abrasive stones and promotes self-sharpening through reduction relative to the first grinding water amount.

A grinding method includes a first grinding step of executing grinding feed of a rough grinding unit and grinding the workpiece to a predetermined thickness while supplying grinding water with a first grinding water amount that allows suppression of wear of grinding abrasive stones and a second grinding step of, after executing the first grinding step, promoting dressing of the grinding abrasive stones to prepare for processing of the next workpiece through executing grinding feed of the rough grinding unit and grinding the workpiece to the finished thickness while supplying the grinding water with a second grinding water amount that increases wear of the grinding abrasive stones and promotes self-sharpening through reduction relative to the first grinding water amount.

A workpiece has a device area and a peripheral area surrounding the device area on a front surface side thereof. A workpiece grinding method includes a groove forming step of performing grinding feed of a grinding unit while a spindle is rotated, and grinding a predetermined area on a back surface side of the workpiece, the predetermined area corresponding to the device area, in a state in which a chuck table holding the workpiece is not rotated, thereby forming a groove on the back surface side, a groove removing step of starting rotation of the chuck table while the spindle is kept rotating, thereby grinding side walls of the groove and removing the groove, and a recess forming step of performing grinding feed of the grinding unit while the spindle and the chuck table are rotated, thereby grinding the predetermined area and forming a recess and a ring-shaped reinforcement part.

A workpiece has a device area and a peripheral area surrounding the device area on a front surface side thereof. A workpiece grinding method includes a groove forming step of performing grinding feed of a grinding unit while a spindle is rotated, and grinding a predetermined area on a back surface side of the workpiece, the predetermined area corresponding to the device area, in a state in which a chuck table holding the workpiece is not rotated, thereby forming a groove on the back surface side, a groove removing step of starting rotation of the chuck table while the spindle is kept rotating, thereby grinding side walls of the groove and removing the groove, and a recess forming step of performing grinding feed of the grinding unit while the spindle and the chuck table are rotated, thereby grinding the predetermined area and forming a recess and a ring-shaped reinforcement part.

A processing apparatus includes a holder configured to hold a substrate; a grinding device configured to perform a grinding on a processing surface of the substrate held on the holder; a transfer device configured to transfer the substrate to the holder; and a controller configured to control the holder, the grinding device and the transfer device. The controller controls the holder, the grinding device and the transfer device to perform performing initialization of the holder, initialization of the grinding device and initialization of the transfer device after the processing apparatus is stopped during an operation thereof and the processing apparatus is restarted; detecting the substrate on the holder; deciding whether the grinding on the detected substrate by the grinding device is required; and performing, by the grinding device, the grinding on the processing surface of the substrate on which the grinding is decided to be required.

A grinding apparatus includes a rotary table, multiple chuck, a rotational driving unit, a grinding position cover, a cleaning unit and an attachment/detachment position cover. The horizontal rotary table is configured to be rotated around a vertical rotation center line. The multiple chucks are arranged at an equal distance therebetween around the rotation center line of the rotary table. The rotational driving unit moves the chuck between an attachment/detachment position and a grinding position. The grinding position cover covers the grinding position from above and from a side. The cleaning unit is configured to supply a cleaning liquid to the chuck or the substrate at the attachment/detachment position. The attachment/detachment position cover covers the attachment/detachment position from above and from a side. The attachment/detachment position cover is provided with a transfer opening for the substrate in a side surface thereof, and accommodates therein the chuck and the cleaning unit.

A grinding apparatus includes a rotary table, multiple chuck, a rotational driving unit, a grinding position cover, a cleaning unit and an attachment/detachment position cover. The horizontal rotary table is configured to be rotated around a vertical rotation center line. The multiple chucks are arranged at an equal distance therebetween around the rotation center line of the rotary table. The rotational driving unit moves the chuck between an attachment/detachment position and a grinding position. The grinding position cover covers the grinding position from above and from a side. The cleaning unit is configured to supply a cleaning liquid to the chuck or the substrate at the attachment/detachment position. The attachment/detachment position cover covers the attachment/detachment position from above and from a side. The attachment/detachment position cover is provided with a transfer opening for the substrate in a side surface thereof, and accommodates therein the chuck and the cleaning unit.