A machine (10) for grinding and/or polishing slabs of stone material, such as natural or agglomerated stone, ceramics or glass, comprises: a support bench (12) for the slabs to be machined. At least one working station (14) is provided above the support bench (12), said station comprising at least one pair of bridge support structures (16, 18) situated opposite each and arranged transversely on either side of the support bench (12). First means (19) are provided for performing a relative movement in the longitudinal direction of machining station (14) and slab on the support bench (12). The machine further comprises at least one beam (20, the two ends (22, 24) of which are supported by the support structures (16, 18), and at least one rotating spindle (26) with a sliding vertical axis mounted on the at least one beam (20). The beam (20) is movable transversely on the support structures (16, 18). The bottom end of the spindle (26) is provided with at least one tool-carrying support (28) rotating about the axis of rotation of the spindle (26). The machine is characterized in that it comprises second means (32) for performing a relative movement in the longitudinal direction of the at least one spindle (26) with respect to the support bench (12).

The present invention relates to a grinding device for machining an, in particular plate-shaped workpiece (W). The grinding device comprises an emitter (31) for emitting electromagnetic waves in the direction of the abrasive belt (10) and a detector (32) for detecting electromagnetic waves which are reflected by the abrasive belt (10).

The present invention relates to a grinding device for machining an, in particular plate-shaped workpiece (W). The grinding device comprises an emitter (31) for emitting electromagnetic waves in the direction of the abrasive belt (10) and a detector (32) for detecting electromagnetic waves which are reflected by the abrasive belt (10).

In a sanding machine for sanding/finishing panels made of wood, metal or the like, an abrasive belt is moved so as to cause it to come into contact with a panel by a plurality of thrust elements, which are distributed inside the abrasive belt, and are moved perpendicularly to the panel by respective actuator cylinders, each of which has an output rod which is moveable between a lowered operating position and a raised rest position under the thrust of a pressurised gas supplied in a continuous manner to an upper chamber of the actuator cylinder and in a selective manner to a lower chamber of the actuator cylinder itself.

A grinding apparatus includes grinding wheel side vibrational displacement calculation devices that obtain a vibrational displacement of a grinding wheel resulting from a vibration in an approaching/separating direction of the grinding wheel; main spindle side vibrational displacement calculation devices that obtain a vibrational displacement of a workpiece generated by propagation of the vibration in the approaching/separating direction of the grinding wheel; a relative vibrational displacement calculation unit that obtains a relative vibrational displacement between the grinding wheel and the workpiece based on the vibrational displacement of the grinding wheel and the vibrational displacement of the workpiece that have been obtained; a position change unit that creates, based on the obtained relative vibrational displacement between the grinding wheel and the workpiece, a position change command to change a position of the wheel spindle stock; and a processing controller that grinds the workpiece W based on the created position change command.

An apparatus for grinding a concrete floor surface, in order to perform grinding with a manual, a pullable or a ride-on concrete trowel machine is provided. The apparatus comprises a concrete trowel organ to be used with the concrete trowel machine and a diamond grinding arrangement, such as one or several diamond disks or like, to be coupled in connection with the concrete trowel organ removably by means of a fastening arrangement. The fastening arrangement for coupling the diamond grinding arrangement in connection with the concrete trowel organ comprises a fastening frame, being in connection with the diamond grinding arrangement that exits on a scrubbing surface of the concrete trowel organ, and a fastening part extending from the fastening frame and, while going through the concrete trowel organ, getting supported against a back surface of the same.

The invention relates to an apparatus for machining the running edges of a sporting device, more particularly a ski or a snowboard, comprising a transport apparatus, which can be temporarily connected to the sporting device, for the automated movement of the sporting device in a movement sequence having, at least in parts, a movement direction substantially parallel to the longitudinal direction of the sporting device, wherein the following are located one behind the other in said movement sequence of the sporting device: a lower-edge machining unit for machining a lower surface of at least one running edge, said lower surface laterally adjoining the running-surface covering of the sporting device; a lateral-edge machining unit for machining a lateral surface of the at least one running edge, said lateral surface adjoining the bottom of the lateral surface of the sporting device; and a deburring unit for removing a burr formed by the lateral-edge machining unit on the at least one running edge.

A method of processing a wafer includes a cutting step of cutting the face side of the wafer with a cutting blade to form grooves therein along projected dicing lines, a first inspecting step of capturing an image of the grooves formed in the cutting step and inspecting a state of a chip in the captured image of the grooves, a protecting member sticking step of sticking a protective member to the face side of the wafer, a grinding step of holding the protective member side of the wafer on a chuck table and grinding a reverse side of the wafer to thin the wafer to a finished thickness, thereby dividing the wafer into device chips, a second inspecting step of capturing an image of the grooves exposed on the reverse side of the wafer and inspecting a state of a chip in the captured image of the grooves.

Equipment (300) for the surface sanding of plate-shaped bodies (101), in particular of tiles, said equipment (300) comprising support and feeding means (100) for supporting said plate-shaped bodies (101) and feeding said plate-shaped bodies (101) along a given feed direction (D), so that during the movement along said given direction (D) the surface of each said plate-shaped body (101) that shall be sanded can be visible and accessed, said equipment (300) including a sanding module (200) provided with sanding means defining a sanding abrasive surface and with moving means for moving said abrasive surface in contact with the visible surface of said plate-shaped bodies (101) in succession during the movement thereof; wherein said sanding means comprise a closed belt (201) that defines said sanding abrasive surface and is suitable to be driven into rotation by means of said moving means.

Equipment (300) for the surface sanding of plate-shaped bodies (101), in particular of tiles, said equipment (300) comprising support and feeding means (100) for supporting said plate-shaped bodies (101) and feeding said plate-shaped bodies (101) along a given feed direction (D), so that during the movement along said given direction (D) the surface of each said plate-shaped body (101) that shall be sanded can be visible and accessed, said equipment (300) including a sanding module (200) provided with sanding means defining a sanding abrasive surface and with moving means for moving said abrasive surface in contact with the visible surface of said plate-shaped bodies (101) in succession during the movement thereof; wherein said sanding means comprise a closed belt (201) that defines said sanding abrasive surface and is suitable to be driven into rotation by means of said moving means.