Patent classifications
B24B7/06
Apparatus and methods for chemical mechanical polishing
Embodiments of the present disclosure relate a CMP tool and methods for planarization a substrate. Particularly, embodiments of the present disclosure provide a substrate transporter for use in a CMP tool. The transporter may be used transport and/or carry substrates among various polishers and cleaners in a CMP tool while preventing the substrates from drying out during transportation. By keeping surfaces of the substrates wet during substrate waiting time or idle time in the CMP tool, embodiments of the present disclosure prevent many types of defects, such as byproducts, agglomerated abrasives, pad debris, slurry residues, from accumulate on the substrate surface during CMP processing, thus improve yields and device performance.
Metal plate polishing machine and control method therefor
The present invention discloses a metal plate polishing machine and a control method therefor. The metal plate polishing machine comprises a work base, the work base is provided with a conveyor belt, a feed motor for driving the conveyor belt, a polishing roller located above the conveyor belt, a main motor for driving the polishing roller, a lifting mechanism for driving the polishing roller to move up and down, and a chassis with a controller inside, the feed motor and the main motor are electrically connected with the controller respectively, the conveyor belt is arranged at a front position of the work base, the feed motor is arranged behind the conveyor belt and is in transmission connection with a drive shaft on a feed end of the conveyor belt, the main motor is located behind the conveyor belt and is in transmission connection with the polishing roller.
Metal plate polishing machine and control method therefor
The present invention discloses a metal plate polishing machine and a control method therefor. The metal plate polishing machine comprises a work base, the work base is provided with a conveyor belt, a feed motor for driving the conveyor belt, a polishing roller located above the conveyor belt, a main motor for driving the polishing roller, a lifting mechanism for driving the polishing roller to move up and down, and a chassis with a controller inside, the feed motor and the main motor are electrically connected with the controller respectively, the conveyor belt is arranged at a front position of the work base, the feed motor is arranged behind the conveyor belt and is in transmission connection with a drive shaft on a feed end of the conveyor belt, the main motor is located behind the conveyor belt and is in transmission connection with the polishing roller.