A grinding setting selection system for a robotic grinding system is presented. The system includes an abrasive rotational speed retriever that retrieves a current rotational speed of a grinder in the robotic grinding system. The system also includes an end effector load retriever that receives a current end effector load of an end effector in the robotic grinding system. The system also includes a material removal predictor that, based on the retrieved rotational speed and the end effector road, predicts a material removal rate. The system also includes a setting adjuster that, based on the predicted removal rate, provides a setting adjustment for the robotic grinding system. The setting adjustment alters a mechanical setting of the robotic grinding system. The system also includes a setting communicator that communicates the setting adjustment to the robotic grinding system.

A grinding setting selection system for a robotic grinding system is presented. The system includes an abrasive rotational speed retriever that retrieves a current rotational speed of a grinder in the robotic grinding system. The system also includes an end effector load retriever that receives a current end effector load of an end effector in the robotic grinding system. The system also includes a material removal predictor that, based on the retrieved rotational speed and the end effector road, predicts a material removal rate. The system also includes a setting adjuster that, based on the predicted removal rate, provides a setting adjustment for the robotic grinding system. The setting adjustment alters a mechanical setting of the robotic grinding system. The system also includes a setting communicator that communicates the setting adjustment to the robotic grinding system.

A grinding and polishing device includes a main body, a grinding disk, a sample disk, a first console, and a second console. The main body includes a support table and a support column. The support table is coupled to the support column. The grinding disk is fixed on the support table and includes a polishing surface. The sample disk is fixed on the support column and configured to hold a preform. The first console is electrically coupled to the sample disk and used for controlling a distance between the preform held by the sample disk and the grinding disk. The second console is electrically coupled to the grinding disk and used for controlling a working state of the grinding disk for grinding and polishing the preform.

A grinding and polishing device includes a main body, a grinding disk, a sample disk, a first console, and a second console. The main body includes a support table and a support column. The support table is coupled to the support column. The grinding disk is fixed on the support table and includes a polishing surface. The sample disk is fixed on the support column and configured to hold a preform. The first console is electrically coupled to the sample disk and used for controlling a distance between the preform held by the sample disk and the grinding disk. The second console is electrically coupled to the grinding disk and used for controlling a working state of the grinding disk for grinding and polishing the preform.

A chuck table includes a holding plate having a holding surface for holding the wafer under suction, and a frame body that supports the holding plate thereon and transmits a negative pressure or a positive pressure to the holding surface. The holding plate is formed such that a plurality of cleaved portions are included through cleavage of the holding plate into a plurality of blocks along a plurality of modified layers formed by applying a laser beam of a wavelength, which has transmissivity through the holding plate, with a focal point thereof positioned inside the holding plate, and the negative pressure or the positive pressure is transmitted from the cleaved portions to the holding surface. A grinding machine and a manufacturing method of the chuck table for holding the wafer are also disclosed.

A chuck table includes a holding plate having a holding surface for holding the wafer under suction, and a frame body that supports the holding plate thereon and transmits a negative pressure or a positive pressure to the holding surface. The holding plate is formed such that a plurality of cleaved portions are included through cleavage of the holding plate into a plurality of blocks along a plurality of modified layers formed by applying a laser beam of a wavelength, which has transmissivity through the holding plate, with a focal point thereof positioned inside the holding plate, and the negative pressure or the positive pressure is transmitted from the cleaved portions to the holding surface. A grinding machine and a manufacturing method of the chuck table for holding the wafer are also disclosed.

A method includes receiving a metal component including a raw surface that includes a metal base, a first native oxide disposed on the metal base, and hydrocarbons disposed on the metal base. The method further includes machining the raw surface of the metal component to remove the first native oxide and a first portion of the hydrocarbons from the metal base. The machining generates an as-machined surface of the metal component including the metal base without the first native oxide and without the first portion of the hydrocarbons. The method further includes performing a surface machining of the as-machined surface of the metal component to remove a second portion of the hydrocarbons. The method further includes surface treating the metal component to remove a third portion of the hydrocarbons. The method further includes performing a cleaning of the metal component and drying the metal component.

A method includes receiving a metal component including a raw surface that includes a metal base, a first native oxide disposed on the metal base, and hydrocarbons disposed on the metal base. The method further includes machining the raw surface of the metal component to remove the first native oxide and a first portion of the hydrocarbons from the metal base. The machining generates an as-machined surface of the metal component including the metal base without the first native oxide and without the first portion of the hydrocarbons. The method further includes performing a surface machining of the as-machined surface of the metal component to remove a second portion of the hydrocarbons. The method further includes surface treating the metal component to remove a third portion of the hydrocarbons. The method further includes performing a cleaning of the metal component and drying the metal component.

A method of grinding a workpiece includes a holding step of holding the workpiece on a flat holding surface of a holding table and a grinding step of rotating a grinding wheel to turn grindstones along an annular track while rotating the holding table, and bringing the grindstones into grinding contact with an upper surface of the workpiece to thereby grind the workpiece. The grinding step includes the step of bringing the grindstones into grinding contact with the upper surface of the workpiece in a state where the annular track is closest to the holding surface in an area between a point above a center of the holding surface and a point above an outer circumferential end of the holding surface.

A method of grinding a workpiece includes a holding step of holding the workpiece on a flat holding surface of a holding table and a grinding step of rotating a grinding wheel to turn grindstones along an annular track while rotating the holding table, and bringing the grindstones into grinding contact with an upper surface of the workpiece to thereby grind the workpiece. The grinding step includes the step of bringing the grindstones into grinding contact with the upper surface of the workpiece in a state where the annular track is closest to the holding surface in an area between a point above a center of the holding surface and a point above an outer circumferential end of the holding surface.