A grinding machine includes a base having a plate and a movable device which is connected to the plate. A driving unit is connected to one end of the base and includes having a first motor which has a hollow shaft. An oval hole is defined in the hollow shaft. A grinding unit is located across the top of the plate and includes a body and a grinding part. The grinding part is slidably connected to a slot of the body and has a shaft unit which is located in the oval hole of the hollow shaft. A transverse moving unit is connected to the grinding part and has a second driving motor. A cam link is connected between the driving motor and the grinding part. The grinding part is moved transversely relative to the plate by the cam link driven by the second driving motor.

A polishing device configured to polish a glass substrate is disclosed, including a polishing wheel fixedly arranged, a cooling pipe, and a movable platform. The polishing wheel has an outer peripheral polishing surface, the glass substrate is placed on the platform and is driven by the platform to move so as to make the outer peripheral polishing surface polish the predetermined polishing surface of the glass substrate; the polishing wheel further has a chamber, and the cooling pipe containing a coolant is disposed in the chamber to decrease a temperature of the chamber and then to make temperatures of the outer peripheral polishing surface and the predetermined polishing surface during polishing is lower than a preset temperature. The disclosure solves the problem of high polishing temperature of the polishing wheel and the glass substrate, thereby enhancing the service life of the polishing wheel and the yield of the glass substrate.

A polishing device configured to polish a glass substrate is disclosed, including a polishing wheel fixedly arranged, a cooling pipe, and a movable platform. The polishing wheel has an outer peripheral polishing surface, the glass substrate is placed on the platform and is driven by the platform to move so as to make the outer peripheral polishing surface polish the predetermined polishing surface of the glass substrate; the polishing wheel further has a chamber, and the cooling pipe containing a coolant is disposed in the chamber to decrease a temperature of the chamber and then to make temperatures of the outer peripheral polishing surface and the predetermined polishing surface during polishing is lower than a preset temperature. The disclosure solves the problem of high polishing temperature of the polishing wheel and the glass substrate, thereby enhancing the service life of the polishing wheel and the yield of the glass substrate.

An apparatus including a controller, and at least two cutting head assemblies. The controller typically includes a computer processor, and a computer memory, having a computer program stored therein. The controller automatically controls the current load of a cutting motor of each of the at least two cutting head assemblies via current sensors, in response to monitoring real time current loads. The controller may also control feed mechanism speed. The feed mechanism may include a conveyor belt. The controller may also be programmed to control a position or height of each of the at least two cutting head assemblies with respect to the feed mechanism. The two or more cutting head assemblies may be attached to a frame, and the controller may control the movement of the frame perpendicular to the direction of movement of feeding mechanism. Cutting head pads may be monitored for wear and replaced if necessary.

A device for polishing of a multi-surface workpiece is described. The device includes a base and a vertical motion platform that moves along two support rods, which carries a motor that drives a rotating shaft. The support rods extend from said base. A polishing tool is attached to the motor shaft. The workpiece being polished is placed on a linear motion stage during the polishing process.

A grinding apparatus includes a table that holds a workpiece, and a grinding unit including a grinding wheel mounted to a spindle. The grinding wheel has a grindstone formed by binding abrasive grains with a bonding agent. In addition, the grinding apparatus further includes: a supply unit that supplies grinding water to at least the grindstone when grinding the workpiece; and a light applying unit that is disposed adjacent to the table and that applies light to a grinding surface of the grindstone grinding the workpiece held by the table. The light applying unit includes a light emission section that emits light, and a diffusion preventive wall that surrounds the light emission section and prevents diffusion of the light.

A grinding apparatus includes a table that holds a workpiece, and a grinding unit including a grinding wheel mounted to a spindle. The grinding wheel has a grindstone formed by binding abrasive grains with a bonding agent. In addition, the grinding apparatus further includes: a supply unit that supplies grinding water to at least the grindstone when grinding the workpiece; and a light applying unit that is disposed adjacent to the table and that applies light to a grinding surface of the grindstone grinding the workpiece held by the table. The light applying unit includes a light emission section that emits light, and a diffusion preventive wall that surrounds the light emission section and prevents diffusion of the light.

A glass polishing apparatus includes a jig that holds a glass structure. The glass polishing apparatus includes a first flat portion, a second flat portion opposite to the first flat portion, and a curved portion connecting the first flat portion to the second flat portion. The jig and includes a first holding surface holding the first flat portion, a second holding surface disposed opposite to the first holding surface and holding the second flat portion, and a third holding surface connecting the first holding surface to the second holding surface and holding the curved portion. At least a portion of a roller unit having a cylindrical shape is inserted between the first flat portion and the second flat portion.

An apparatus for machining flat workpieces has at least two tool carriers mounted to machining heads that are drivable by at least a first drive unit. The tool carrier of one machining head is arranged such that it is movable in a shifting range (V1) along a first axis relative to the carrier unit. The tool carrier of a second machining head is arranged such that it is movable in a shifting area (V2) along the first axis relative to the carrier unit.

An automated polishing system includes a workbench, a transport unit and a polishing unit, wherein the transport unit is provided with a transport surface and a transport drive configured to drive the transport surface to move horizontally, and the polishing unit includes a supporting portion, a holding arm rotatably connected to the supporting portion, a holder connected to the holding arm, a horizontal drive configured to drive the supporting portion to move horizontally, a vertical drive configured to drive the supporting portion to move vertically, a horizontally rotating drive configured to drive the holding arm to rotate in a horizontal direction, a vertically rotating drive configured to drive the holder to rotate in a vertical direction, a polishing shaft, a polishing rotating device configured to drive the polishing shaft, and a polishing drive configured to drive the polishing shaft to move towards the holder for reciprocating motion.