A machining machine comprises a first support disk, a first working disk coupled to the first support disk, and a counter bearing element positioned to define a working gap between the first working disk and the counter bearing element. The first working disk and the counter bearing element are configured to rotate relative to each other to machine at least one side of a flat workpiece. A pressure volume is positioned between the first support disk and the first working disk and is configured to hold a pressure fluid, which generates a pressure configured to deform the first working disk. One or more temperature-controlling channels are positioned within the first working disk and configured to hold a temperature-controlling fluid that is configured to control a temperature of the first working disk, wherein the one or more temperature-controlling channels are fluidly separate from the pressure volume.

The present disclosure provides a polishing device comprising a frame (1), and a polishing disc (2), an assistant polishing disc (3), and a fixture (5) that are disposed on the frame (1). At least one polishing position (4) is disposed on the assistant polishing disc (3). The assistant polishing disc (3) is clamped by the fixture (5) and in contact with the polishing disc (2). The fixture (5) includes a plurality of claws (52), the plurality of claws (52) include at least a first claw extending from above the at least one polishing position (4) to an edge of the assistant polishing disc (3). A pre-tightening part is disposed on a position, corresponding to the at least one polishing position (4), of the first claw. The pre-tightening part includes a scale and a pre-tightening member. A scale value representing a polishing removal efficiency is preset on the scale.

The present disclosure provides a polishing device comprising a frame (1), and a polishing disc (2), an assistant polishing disc (3), and a fixture (5) that are disposed on the frame (1). At least one polishing position (4) is disposed on the assistant polishing disc (3). The assistant polishing disc (3) is clamped by the fixture (5) and in contact with the polishing disc (2). The fixture (5) includes a plurality of claws (52), the plurality of claws (52) include at least a first claw extending from above the at least one polishing position (4) to an edge of the assistant polishing disc (3). A pre-tightening part is disposed on a position, corresponding to the at least one polishing position (4), of the first claw. The pre-tightening part includes a scale and a pre-tightening member. A scale value representing a polishing removal efficiency is preset on the scale.

The present invention provides an abrasive material capable of polishing difficult-to-polish silicon carbide at a high degree of surface precision. The present invention relates to an abrasive material including manganese dioxide particles having a non-needle-like shape possessing a ratio of the longitudinal axis to the transverse axis of the particles observed with a scanning electron microscope of 3.0 or less. The abrasive material is preferable if the average particle size D.sub.SEM of the longitudinal axis of the observed particles is 1.0 m or less, and if the particle size D.sub.50 of the volume-based cumulative fraction of 50% in laser diffraction/scattering particle size distribution measurement is 2.0 m or less.

The present invention provides an abrasive material capable of polishing difficult-to-polish silicon carbide at a high degree of surface precision. The present invention relates to an abrasive material including manganese dioxide particles having a non-needle-like shape possessing a ratio of the longitudinal axis to the transverse axis of the particles observed with a scanning electron microscope of 3.0 or less. The abrasive material is preferable if the average particle size D.sub.SEM of the longitudinal axis of the observed particles is 1.0 m or less, and if the particle size D.sub.50 of the volume-based cumulative fraction of 50% in laser diffraction/scattering particle size distribution measurement is 2.0 m or less.

A flush cut grinder tool bit made of an elongated cylindrical shape with an inwardly facing saw blade within the inner diameter of the elongated cylindrical shape that can be sleeved over a protruding object, such that the cutting saw blade portion of the tool bit is inside the cylindrical tool bit so that when it is sleeved over a protruding object, moving the tool bit back and forth over the protruding object will cut the protruding object off at the surface. The body of the drill bit terminates at its distal end with a flush flange having saw teeth therein, and may include a bit shank suspended in the middle of a drill bit body by spokes or a solid surface radially extending from said bit shank. A method of using such a flush cut grinder tool bit is included.

A flush cut grinder tool bit made of an elongated cylindrical shape with an inwardly facing saw blade within the inner diameter of the elongated cylindrical shape that can be sleeved over a protruding object, such that the cutting saw blade portion of the tool bit is inside the cylindrical tool bit so that when it is sleeved over a protruding object, moving the tool bit back and forth over the protruding object will cut the protruding object off at the surface. The body of the drill bit terminates at its distal end with a flush flange having saw teeth therein, and may include a bit shank suspended in the middle of a drill bit body by spokes or a solid surface radially extending from said bit shank. A method of using such a flush cut grinder tool bit is included.

Provided is an automatic polishing system that is capable of adjusting a degree of polishing in accordance with a condition of a surface of a body of a mobile object. The automatic polishing system includes: a multi-articulated robot; a polishing machine including a spindle that spins around an axis and a polishing tool that is fixed at an end of the spindle; a sensor which is provided between the multi-articulated robot and the polishing machine and which detects normal reaction (z-axis component F.sub.z) that acts from a polish target surface to the polishing machine and moment (z-axis component M.sub.z) that acts around the axis of the spindle; and a control unit which controls the multi-articulated robot based on the normal reaction (z-axis component F.sub.z) and the moment (z-axis component M.sub.z).

Provided is an automatic polishing system that is capable of adjusting a degree of polishing in accordance with a condition of a surface of a body of a mobile object. The automatic polishing system includes: a multi-articulated robot; a polishing machine including a spindle that spins around an axis and a polishing tool that is fixed at an end of the spindle; a sensor which is provided between the multi-articulated robot and the polishing machine and which detects normal reaction (z-axis component F.sub.z) that acts from a polish target surface to the polishing machine and moment (z-axis component M.sub.z) that acts around the axis of the spindle; and a control unit which controls the multi-articulated robot based on the normal reaction (z-axis component F.sub.z) and the moment (z-axis component M.sub.z).

A rotating tool (1) includes a tool body (5) including a polishing tool (2) and a shank (3), and a flange part (4) provided in the tool body (5). The polishing tool (2) includes a plurality of linear grinding members (6) and a grinding member holder (7) to hold the linear grinding members (6). The flange part (4) is an annular member (8), and attached to the grinding member holder (7) in a state of being movable in the direction of an axial line (L) and rotatable about the axial line (L). When the inner circumferential surface of a hole (H) formed in a workpiece (W) is processed, the grinding member holder (7) and the annular member (8) are inserted into the hole (H). When the run-out on the front side of the rotating tool (1) occurs, the annular member (8) comes into contact with the peripheral wall surface of the hole (H), whereby the run-out of the tool body (5) is reduced.