Patent classifications
B24B19/02
Method for manufacturing of a rotor
A method for manufacturing a rotor includes the following operations: the clamping of a workpiece in a grinding machine; the performance of one or more cylindrical grinding operations whereby a rotor shaft section is ground to the desired diameter with a cylindrical grinding disk; the performance of one more profile grinding operations whereby a rotor body is profiled with a profile grinding disk. During the manufacture of the rotor in the grinding machine, the workpiece is not undamped and the cylindrical grinding operations and the profile grinding operations are done with the same grinding machine.
WORKPIECE PROCESSING PREPARATION METHOD AND PROCESSING METHOD
A processing method of thinning a sheet-shaped workpiece having an outer peripheral groove formed in an outer peripheral edge portion of a top surface thereof. The method includes the steps of: laying an adhesive material on a top surface of a supporting substrate; causing the sheet-shaped workpiece to face the adhesive material; pressing the adhesive material with the top surface of the workpiece to press-spread the adhesive material between the workpiece and the supporting substrate, and to fill the outer peripheral groove with the adhesive material; hardening the adhesive material with an external stimulus to form a laminated body; holding the supporting substrate side of the laminated body on a holding table to expose a back surface of the workpiece; and grinding the back surface of the workpiece with a grinding stone to thin the workpiece to a predetermined thickness.
WORKPIECE PROCESSING PREPARATION METHOD AND PROCESSING METHOD
A processing method of thinning a sheet-shaped workpiece having an outer peripheral groove formed in an outer peripheral edge portion of a top surface thereof. The method includes the steps of: laying an adhesive material on a top surface of a supporting substrate; causing the sheet-shaped workpiece to face the adhesive material; pressing the adhesive material with the top surface of the workpiece to press-spread the adhesive material between the workpiece and the supporting substrate, and to fill the outer peripheral groove with the adhesive material; hardening the adhesive material with an external stimulus to form a laminated body; holding the supporting substrate side of the laminated body on a holding table to expose a back surface of the workpiece; and grinding the back surface of the workpiece with a grinding stone to thin the workpiece to a predetermined thickness.
METHOD FOR CLAMPING A TOOL ON A TOOL SPINDLE IN A HARD FINISHING MACHINE AND HARD FINISHING MACHINE
A method for clamping a tool on a tool spindle in a hard finishing machine that includes: the tool spindle connected to a drive motor, with a cylindrical receiving seat and a thread, and the tool. The receiving seat is limited at one axial position of the tool spindle by a abutment flange for axial abutment of the tool. A clamping nut can be screwed onto the thread and is designed for axial abutment on the tool. The clamping nut is temporarily held in a rotationally fixed manner when the tool spindle is rotated by the drive motor. The method includes: placing the tool on the receiving seat and screwing the clamping nut onto the thread; blocking the clamping nut against rotation during the rotation of the tool spindle with the drive motor; and actuating the drive motor to tighten the clamping nut so it presses axially against the tool.
Substrate warpage correction method, computer storage medium, and substrate warpage correction apparatus
A substrate warpage correction method according to this disclosure corrects warpage of a substrate without performing a process on a front surface of the substrate. The substrate warpage correction method includes a surface roughening of performing a surface roughening process on a rear surface of the substrate using a surface roughening processing apparatus configured to be able to perform the surface roughening process on the rear surface of the substrate, to form grooves in the rear surface to thereby correct the warpage of the substrate.
Substrate warpage correction method, computer storage medium, and substrate warpage correction apparatus
A substrate warpage correction method according to this disclosure corrects warpage of a substrate without performing a process on a front surface of the substrate. The substrate warpage correction method includes a surface roughening of performing a surface roughening process on a rear surface of the substrate using a surface roughening processing apparatus configured to be able to perform the surface roughening process on the rear surface of the substrate, to form grooves in the rear surface to thereby correct the warpage of the substrate.
END MILL WITH GRADIENT EDGE GEOMETRY AND GRINDING METHOD THEREOF
An end mill with a gradient edge geometry and a grinding method thereof relate to the technical field of metal cutting. Through multi-dimensional data acquisition, the grinding method comprehensively evaluates a cutting load, a cutting temperature and a cutting vibration amplitude of the tool, and overcomes limitations of the conventional method. By setting a lifetime evaluation criterion and an alert threshold, the grinding method forms a scientific evaluation system, improving accuracy of the evaluation and lifetime of the tool. By combining a preliminary adjustment strategy with a fine adjustment strategy, the grinding method improves the adaptability of the tool in complex conditions, ensuring that the tool works in an optimal state all the time. At last, with fine adjustment on the adjustment index, the grinding method realizes collaborative optimization of various parameters, improves the performance of the tool, and expands the application range, providing an effective solution for high-precision machining.
END MILL WITH GRADIENT EDGE GEOMETRY AND GRINDING METHOD THEREOF
An end mill with a gradient edge geometry and a grinding method thereof relate to the technical field of metal cutting. Through multi-dimensional data acquisition, the grinding method comprehensively evaluates a cutting load, a cutting temperature and a cutting vibration amplitude of the tool, and overcomes limitations of the conventional method. By setting a lifetime evaluation criterion and an alert threshold, the grinding method forms a scientific evaluation system, improving accuracy of the evaluation and lifetime of the tool. By combining a preliminary adjustment strategy with a fine adjustment strategy, the grinding method improves the adaptability of the tool in complex conditions, ensuring that the tool works in an optimal state all the time. At last, with fine adjustment on the adjustment index, the grinding method realizes collaborative optimization of various parameters, improves the performance of the tool, and expands the application range, providing an effective solution for high-precision machining.